The small physical size of the SOT-223 package does not allow sufficient space to provide the complete device part number. The actual devices will be labeled with
the package markings shown.
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2
LM2937
Absolute Maximum Ratings
(Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Input Voltage
Continuous
Transient (t
≤
100 ms)
Internal Power Dissipation (Note 2)
Maximum Junction Temperature
Storage Temperature Range
TO-220 (10 seconds)
26V
60V
Internally Limited
150˚C
−65˚C to +150˚C
260˚C
TO-263 (10 seconds)
SOT-223 (Vapor Phase, 60 seconds)
SOT-223 (Infared, 15 seconds)
ESD Susceptibility (Note 3)
230˚C
215˚C
220˚C
2 kV
Operating Conditions
(Note 1)
Temperature Range (Note 2)
LM2937ET, LM2937ES
LM2937IMP
Maximum Input Voltage
−40˚C
≤
T
J
≤125˚C
−40˚C
≤
T
J
≤85˚C
26V
Electrical Characteristics
V
IN
= V
NOM
+ 5V, (Note 4) I
OUTmax
= 500 mA for the TO-220 and TO-263 packages, I
OUTmax
=400mA for the SOT-223 pack-
age, C
OUT
= 10 µF unless otherwise indicated.
Boldface limits apply over the entire operating temperature range of the
indicated device.,
all other specifications are for T
A
= T
J
= 25˚C.
Output Voltage (V
OUT
)
Parameter
Output Voltage
Conditions
5 mA
≤
I
OUT
≤
I
OUTmax
5.00
Typ
5V
Limit
4.85
4.75
5.15
5.25
Line Regulation
Load Regulation
Quiescent Current
(V
OUT
+ 2V)
≤
V
IN
≤
26V,
I
OUT
= 5 mA
5 mA
≤
I
OUT
≤
I
OUTmax
(V
OUT
+ 2V)
≤
V
IN
≤
26V,
I
OUT
= 5 mA
V
IN
= (V
OUT
+ 5V),
I
OUT
= I
OUTmax
Output Noise
Voltage
Long Term Stability
Dropout Voltage
Short-Circuit Current
Peak Line Transient
Voltage
Maximum Operational
Input Voltage
Reverse DC
Input Voltage
Reverse Transient
Input Voltage
t
r
<
1 ms, R
L
= 100Ω
−75
−50
−75
−50
−75
−50
V(Min)
V
OUT
≥
−0.6V, R
L
= 100Ω
−30
−15
−30
−15
−30
−15
V(Min)
26
26
26
V(Min)
t
f
<
100 ms, R
L
= 100Ω
10 Hz–100 kHz
I
OUT
= 5 mA
1000 Hrs.
I
OUT
= I
OUTmax
I
OUT
= 50 mA
20
0.5
110
1.0
75
1.0
250
0.6
60
32
0.5
110
1.0
75
1.0
250
0.6
60
40
0.5
110
1.0
75
1.0
250
0.6
60
mV
V(Max)
mV(Max)
A(Min)
V(Min)
150
240
300
µVrms
10
20
10
20
10
20
mA(Max)
5
2
50
10
8
2
80
10
10
2
100
10
mV(Max)
mA(Max)
15
50
24
8.00
Typ
8V
Limit
7.76
7.60
8.24
8.40
80
30
10.00
Typ
10V
Limit
9.70
9.50
10.30
10.50
100
V(Min)
V(Min)
V(Max)
V(Max)
mV(Max)
Units
3
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LM2937
Electrical Characteristics
V
IN
= V
NOM
+ 5V, (Note 4) I
OUTmax
= 500 mA for the TO-220 and TO-263 packages, I
OUTmax
=400mA for the SOT-223 pack-
age, C
OUT
= 10 µF unless otherwise indicated.
Boldface limits apply over the entire operating temperature range of the
indicted device.,
all other specifications are for T
A
= T
J
= 25˚C.
Output Voltage (V
OUT
)
Parameter
Output Voltage
Conditions
5 mA
≤
I
OUT
≤
I
OUTmax
12.00
Typ
12V
Limit
11.64
11.40
12.36
12.60
Line Regulation
Load Regulation
Quiescent Current
(V
OUT
+ 2V)
≤
V
IN
≤
26V,
I
OUT
= 5 mA
5 mA
≤
I
OUT
≤
I
OUTmax
(V
OUT
+ 2V)
≤
V
IN
≤
26V,
I
OUT
= 5 mA
V
IN
= (V
OUT
+ 5V),
I
OUT
= I
OUTmax
Output Noise
Voltage
Long Term Stability
Dropout Voltage
Short-Circuit Current
Peak Line Transient
Voltage
Maximum Operational
Input Voltage
Reverse DC
Input Voltage
Reverse Transient
Input Voltage
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device
outside of its rated Operating Conditions.
Note 2:
The maximum allowable power dissipation at any ambient temperature is P
MAX
= (125 − T
A
)/θ
JA
, where 125 is the maximum junction temperature for op-
eration, T
A
is the ambient temperature, and
θ
JA
is the junction-to-ambient thermal resistance. If this dissipation is exceeded, the die temperature will rise above 125˚C
and the electrical specifications do not apply. If the die temperature rises above 150˚C, the LM2937 will go into thermal shutdown. For the LM2937, the
junction-to-ambient thermal resistance
θ
JA
is 65˚C/W, for the TO-220 package, 73˚C/W for the TO-263 package, and 174˚C/W for the SOT-223 package. When used
with a heatsink,
θ
JA
is the sum of the LM2937 junction-to-case thermal resistance
θ
JC
of 3˚C/W and the heatsink case-to-ambient thermal resistance. If the TO-263
or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package (see Application
Hints for more information on heatsinking).
Note 3:
ESD rating is based on the human body model, 100 pF discharged through 1.5 kΩ.
Note 4:
Typicals are at T
J
= 25˚C and represent the most likely parametric norm.
