If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Power Dissipation
Input-Output Voltage Differential
Storage Temperature
Lead Temperature
Metal Package (Soldering, 10 seconds)
Plastic Package (Soldering, 4 seconds)
300˚C
260˚C
Internally Limited
+40V, −0.3V
−65˚C to +150˚C
ESD Tolerance (Note 5)
3 kV
Operating Temperature Range
LM117
LM317A
LM317
Preconditioning
Thermal Limit Burn-In
All Devices 100%
−55˚C
≤
T
J
≤
+150˚C
−40˚C
≤
T
J
≤
+125˚C
0˚C
≤
T
J
≤
+125˚C
Electrical Characteristics
(Note 3)
Specifications with standard type face are for T
J
= 25˚C, and those with
boldface type
apply over
full Operating Tempera-
ture Range.
Unless otherwise specified, V
IN
− V
OUT
= 5V, and I
OUT
= 10 mA.
Parameter
Reference Voltage
3V
≤
(V
IN
− V
OUT
)
≤
40V,
10 mA
≤
I
OUT
≤
I
MAX
, P
≤
P
MAX
Line Regulation
Load Regulation
Thermal Regulation
Adjustment Pin Current
Adjustment Pin Current Change
Temperature Stability
Minimum Load Current
Current Limit
10 mA
≤
I
OUT
≤
I
MAX
3V
≤
(V
IN
− V
OUT
)
≤
40V
T
MIN
≤
T
J
≤
T
MAX
(V
IN
− V
OUT
) = 40V
(V
IN
− V
OUT
)
≤
15V
K Package
H Package
(V
IN
− V
OUT
) = 40V
K Package
H Package
RMS Output Noise, % of V
OUT
Ripple Rejection Ratio
10 Hz
≤
f
≤
10 kHz
V
OUT
= 10V, f = 120 Hz,
C
ADJ
= 0 µF
V
OUT
= 10V, f = 120 Hz,
C
ADJ
= 10 µF
Long-Term Stability
Thermal Resistance,
Junction-to-Case
Thermal Resistance, Junction-
to-Ambient (No Heat Sink)
T
J
= 125˚C, 1000 hrs
K Package
H Package
E Package
K Package
H Package
E Package
35
140
0.3
2.3
12
1
3
15
%
˚C/W
˚C/W
˚C/W
˚C/W
˚C/W
˚C/W
66
80
dB
0.3
0.15
0.4
0.2
0.003
65
A
A
%
dB
1.5
0.5
2.2
0.8
3.4
1.8
A
A
1
3.5
5
%
mA
3V
≤
(V
IN
− V
OUT
)
≤
40V (Note 4)
10 mA
≤
I
OUT
≤
I
MAX
(Note 4)
20 ms Pulse
0.01
0.02
0.1
0.3
0.03
50
0.2
0.02
0.05
0.3
1
0.07
100
5
%/V
%/V
%
%
%/W
µA
µA
1.20
1.25
1.30
Conditions
Min
LM117
(Note 2)
Typ
Max
V
V
Units
www.national.com
4
LM117/LM317A/LM317
Electrical Characteristics
(Note 3)
Specifications with standard type face are for T
J
= 25˚C, and those with
boldface type
apply over
full Operating Tempera-
ture Range.
Unless otherwise specified, V
IN
− V
OUT
= 5V, and I
OUT
= 10 mA.
Parameter
Reference Voltage
3V
≤
(V
IN
− V
OUT
)
≤
40V,
10 mA
≤
I
OUT
≤
I
MAX
, P
≤
P
MAX
Line Regulation
Load Regulation
Thermal Regulation
Adjustment Pin Current
Adjustment Pin Current
Change
Temperature Stability
Minimum Load Current
Current Limit
10 mA
≤
I
OUT
≤
I
MAX
3V
≤
(V
IN
− V
OUT
)
≤
40V
T
MIN
≤
T
J
≤
T
MAX
(V
IN
− V
OUT
) = 40V
(V
IN
− V
OUT
)
≤
15V
K, T, S Packages
H Package
MP Package
(V
IN
− V
OUT
) = 40V
K, T, S Packages
H Package
MP Package
RMS Output Noise, % of V
OUT
Ripple Rejection Ratio
10 Hz
≤
f
≤
10 kHz
V
OUT
= 10V, f = 120 Hz,
C
ADJ
= 0 µF
V
OUT
= 10V, f = 120 Hz,
C
ADJ
= 10 µF
Long-Term Stability
Thermal Resistance,
Junction-to-Case
T
J
= 125˚C, 1000 hrs
K Package
MDT Package
H Package
T Package
MP Package
Thermal Resistance,
Junction-to-Ambient (No Heat
Sink)
K Package
MDT Package(Note 6)
H Package
T Package
S Package (Note 6)
12
4
23.5
35
140
50
50
15
5
0.3
1
0.3
2.3
5
12
4
23.5
35
92
140
50
50
1
3
15
%
˚C/W
˚C/W
˚C/W
˚C/W
˚C/W
˚C/W
˚C/W
˚C/W
˚C/W
˚C/W
66
80
66
80
dB
0.15
0.075
0.15
0.4
0.2
0.4
0.003
65
0.15
0.075
0.15
0.4
0.2
0.4
0.003
65
A
A
A
%
dB
1.5
0.5
1.5
2.2
0.8
2.2
3.4
1.8
3.4
1.5
0.5
1.5
2.2
0.8
2.2
3.4
1.8
3.4
A
A
A
1
3.5
10
1
3.5
10
%
mA
3V
≤
(V
IN
− V
OUT
)
≤
40V (Note 4)
10 mA
≤
I
OUT
≤
I
MAX
(Note 4)
20 ms Pulse
0.005
0.01
0.1
0.3
0.04
50
0.2
0.01
0.02
0.5
1
0.07
100
5
0.01
0.02
0.1
0.3
0.04
50
0.2
0.04
0.07
0.5
1.5
0.07
100
5
%/V
%/V
%
%
%/W
µA
µA
Conditions
Min
1.238
1.225
LM317A
Typ
1.250
1.250
Max
1.262
1.270
1.20
1.25
1.30
Min
LM317
Typ
Max
V
V
Units
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The
guaranteed specifications apply only for the test conditions listed.
Note 2:
Refer to RETS117H drawing for the LM117H, or the RETS117K for the LM117K military specifications.
Note 3:
Although power dissipation is internally limited, these specifications are applicable for maximum power dissipations of 2W for the TO-39 and SOT-223 and
20W for the TO-3, TO-220, and TO-263. I
MAX
is 1.5A for the TO-3, TO-220, and TO-263 packages, 0.5A for the TO-39 package and 1A for the SOT-223 Package.
All limits (i.e., the numbers in the Min. and Max. columns) are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 4:
Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are
covered under the specifications for thermal regulation.
Note 5:
Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Note 6:
If the TO-263 or TO-252 packages are used, the thermal resistance can be reduced by increasing the PC board copper area thermally connected to the
package. Using 0.5 square inches of copper area.
θ
JA
is 50˚C/W; with 1 square inch of copper area,
θ
JA
is 37˚C/W; and with 1.6 or more square inches of copper
area,
θ
JA
is 32˚C/W. If the SOT-223 package is used, the thermal resistance can be reduced by increasing the PC board copper area (see applications hints for
虽然没能出现在昨晚Mate40发布会的PPT中，但华为在官方商城低调上线了Mate 30E Pro 5G手机，并确认其改用了麒麟990E芯片。麒麟990E的“动刀”思路和用在Mate40标准版上的麒麟9000E基本相同，CPU和基带部分并未做调整，主要是GPU和NPU做了变动。 具体来说，麒麟990E的GPU是14核Mali-G76，NPU为大核+微核的双核达芬奇架构。对比之下，麒麟9...[详细]
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