型号
- 型号
- 关键词
Stellaris LM3S Microcontroller 108-NFBGA -40 to 85
器件类别：嵌入式处理器和控制器 微控制器和处理器
器件标准：
| 型号 | LM3S2939-IBZ50-A2 | LM3S2939-IBZ50-A2T | LM3S2939-IQC50-A2 | LM3S2939-IQC50-A2T |
|---|---|---|---|---|
| 描述 | Stellaris LM3S Microcontroller 108-NFBGA -40 to 85 | Stellaris LM3S Microcontroller 108-NFBGA -40 to 85 | Stellaris LM3S Microcontroller 100-LQFP -40 to 85 | Stellaris LM3S Microcontroller 100-LQFP -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA | BGA | QFP | QFP |
| 包装说明 | LFBGA, BGA108,12X12,32 | LFBGA, BGA108,12X12,32 | LFQFP, QFP100,.63SQ,20 | LFQFP, QFP100,.63SQ,20 |
| 针数 | 108 | 108 | 100 | 100 |
| Reach Compliance Code | compli | compli | compli | compli |
| Factory Lead Time | 16 weeks | 16 weeks | 1 week | 1 week |
| 具有ADC | YES | YES | YES | YES |
| 位大小 | 32 | 32 | 32 | 32 |
| 最大时钟频率 | 0.032 MHz | 0.032 MHz | 0.032 MHz | 0.032 MHz |
| DAC 通道 | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO |
| JESD-30 代码 | S-PBGA-B108 | S-PBGA-B108 | S-PQFP-G100 | S-PQFP-G100 |
| JESD-609代码 | e1 | e1 | e3 | e3 |
| 长度 | 10 mm | 10 mm | 14 mm | 14 mm |
| 湿度敏感等级 | 3 | 3 | 3 | 3 |
| I/O 线路数量 | 57 | 57 | 57 | 57 |
| 端子数量 | 108 | 108 | 100 | 100 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| PWM 通道 | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFBGA | LFBGA | LFQFP | LFQFP |
| 封装等效代码 | BGA108,12X12,32 | BGA108,12X12,32 | QFP100,.63SQ,20 | QFP100,.63SQ,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | FLATPACK | FLATPACK |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 |
| 电源 | 2.5,3.3 V | 2.5,3.3 V | 2.5,3.3 V | 2.5,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 65536 | 65536 | 65536 | 65536 |
| ROM（单词） | 262144 | 262144 | 262144 | 262144 |
| ROM可编程性 | FLASH | FLASH | FLASH | FLASH |
| 座面最大高度 | 1.5 mm | 1.5 mm | 1.6 mm | 1.6 mm |
| 速度 | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| 最大供电电压 | 2.75 V | 2.75 V | 2.75 V | 2.75 V |
| 最小供电电压 | 2.25 V | 2.25 V | 2.25 V | 2.25 V |
| 标称供电电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin (Sn) | Tin (Sn) |
| 端子形式 | BALL | BALL | GULL WING | GULL WING |
| 端子节距 | 0.8 mm | 0.8 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | BOTTOM | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 10 mm | 10 mm | 14 mm | 14 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
