型号
- 型号
- 关键词
ARM Microcontrollers - MCU 5000 SERIES - STELLARIS MICROCONTROLLER
器件类别：嵌入式处理器和控制器 微控制器和处理器
敬请期待| 型号 | LM3S5R31-IBZ80-C1T | LM3S5R31-IQC80-C0 | LM3S5R31-IBZ80-C1 | LM3S5R31-IQC80-C1 | LM3S5R31-IQC80-C0T | LM3S5R31-IQC80-C3 | LM3S5R31-IBZ80-C3T | LM3S5R31-IBZ80-C3 | LM3S5R31-IQC80-C3T |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | ARM Microcontrollers - MCU 5000 SERIES - STELLARIS MICROCONTROLLER | ARM Microcontrollers - MCU Stellaris Micro controller | ARM Microcontrollers - MCU 5000 SERIES - STELLARIS MICROCONTROLLER | ARM Microcontrollers - MCU Stellaris MCU | ARM Microcontrollers - MCU IC ARM CORTEX M3 MCU | ARM Microcontrollers - MCU Stellaris MCU | ARM Microcontrollers - MCU Stellaris MCU | ARM Microcontrollers - MCU Stellaris MCU | ARM Microcontrollers - MCU Stellaris MCU |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA | - | BGA | QFP | - | QFP | BGA | BGA | QFP |
| 包装说明 | LFBGA, | - | LFBGA, | LFQFP, | - | LFQFP, | LFBGA, | LFBGA, | LFQFP, |
| 针数 | 108 | - | 108 | 100 | - | 100 | 108 | 108 | 100 |
| Reach Compliance Code | unknow | - | unknow | unknow | - | compliant | compliant | compliant | compliant |
| 具有ADC | YES | - | YES | YES | - | YES | YES | YES | YES |
| 位大小 | 32 | - | 32 | 32 | - | 32 | 32 | 32 | 32 |
| 最大时钟频率 | 0.032 MHz | - | 0.032 MHz | 0.032 MHz | - | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
| DAC 通道 | NO | - | NO | NO | - | NO | NO | NO | NO |
| DMA 通道 | YES | - | YES | YES | - | YES | YES | YES | YES |
| JESD-30 代码 | S-PBGA-B108 | - | S-PBGA-B108 | S-PQFP-G100 | - | S-PQFP-G100 | S-PBGA-B108 | S-PBGA-B108 | S-PQFP-G100 |
| 长度 | 10 mm | - | 10 mm | 14 mm | - | 14 mm | 10 mm | 10 mm | 14 mm |
| I/O 线路数量 | 67 | - | 67 | 67 | - | 67 | 67 | 67 | 67 |
| 端子数量 | 108 | - | 108 | 100 | - | 100 | 108 | 108 | 100 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
| PWM 通道 | YES | - | YES | YES | - | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFBGA | - | LFBGA | LFQFP | - | LFQFP | LFBGA | LFBGA | LFQFP |
| 封装形状 | SQUARE | - | SQUARE | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | - | GRID ARRAY | FLATPACK | - | FLATPACK | GRID ARRAY | GRID ARRAY | FLATPACK |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM可编程性 | FLASH | - | FLASH | FLASH | - | FLASH | FLASH | FLASH | FLASH |
| 座面最大高度 | 1.5 mm | - | 1.5 mm | 1.6 mm | - | 1.6 mm | 1.5 mm | 1.5 mm | 1.6 mm |
| 速度 | 80 MHz | - | 80 MHz | 80 MHz | - | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| 最大供电电压 | 1.32 V | - | 1.32 V | 1.32 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | 1.08 V | - | 1.08 V | 1.08 V | - | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 | 1.2 V | - | 1.2 V | 1.2 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | - | YES | YES | - | YES | YES | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BALL | - | BALL | GULL WING | - | GULL WING | BALL | BALL | GULL WING |
| 端子节距 | 0.8 mm | - | 0.8 mm | 0.5 mm | - | 0.5 mm | 0.8 mm | 0.8 mm | 0.5 mm |
| 端子位置 | BOTTOM | - | BOTTOM | QUAD | - | QUAD | BOTTOM | BOTTOM | QUAD |
| 宽度 | 10 mm | - | 10 mm | 14 mm | - | 14 mm | 10 mm | 10 mm | 14 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | - | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | - | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
