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LM4951TL/NOPB

Audio Amplifiers Wide Voltage Range 1.8 Watt Audio Power Amplifier 9-DSBGA

器件类别:模拟混合信号IC    消费电路   

厂商名称:Texas Instruments(德州仪器)

厂商官网:http://www.ti.com.cn/

器件标准:

敬请期待
器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Texas Instruments(德州仪器)
包装说明
FBGA, BGA9,3X3,20
Reach Compliance Code
compliant
ECCN代码
EAR99
Factory Lead Time
1 week
商用集成电路类型
AUDIO AMPLIFIER
JESD-30 代码
S-PBGA-B9
JESD-609代码
e1
湿度敏感等级
1
功能数量
1
端子数量
9
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
FBGA
封装等效代码
BGA9,3X3,20
封装形状
SQUARE
封装形式
GRID ARRAY, FINE PITCH
峰值回流温度(摄氏度)
260
电源
3.3/7.5 V
认证状态
Not Qualified
最大压摆率
4.5 mA
表面贴装
YES
温度等级
INDUSTRIAL
端子面层
Tin/Silver/Copper (Sn/Ag/Cu)
端子形式
BALL
端子节距
0.5 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
NOT SPECIFIED
参数对比
与LM4951TL/NOPB相近的元器件有:LM4951SD-NOPB、LM4951TL-NOPB、LM4951SDX-NOPB、LM4951SD/NOPB、LM4951SDX/NOPB、LM4951、LM4951TL、LM4951TLX。描述及对比如下:
型号 LM4951TL/NOPB LM4951SD-NOPB LM4951TL-NOPB LM4951SDX-NOPB LM4951SD/NOPB LM4951SDX/NOPB LM4951 LM4951TL LM4951TLX
描述 Audio Amplifiers Wide Voltage Range 1.8 Watt Audio Power Amplifier 9-DSBGA Audio Amplifiers Wide Vtg Range 1.8W Audio Pwr Amp Audio Amplifiers Wide Voltage Range 1.8 Watt Audio Power Amplifier 9-DSBGA Audio Amplifiers Y Wide Voltage Range 1.8 Watt Audio Power Amplifier 10-WSON Wide Voltage Range 1.8 Watt Audio Power Amplifier 10-WSON LM4951 Wide Voltage Range 1.8 Watt Audio Power Amplifier 1.8W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9, BGA-9 1.8W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9, BGA-9
是否Rohs认证 符合 - - - 符合 符合 - 符合 符合
包装说明 FBGA, BGA9,3X3,20 - - - HVSON, SOLCC10,.11,20 HVSON, SOLCC10,.11,20 - VFBGA, VFBGA,
Reach Compliance Code compliant - - - compliant compliant - compliant compliant
ECCN代码 EAR99 - - - EAR99 EAR99 - EAR99 EAR99
商用集成电路类型 AUDIO AMPLIFIER - - - AUDIO AMPLIFIER AUDIO AMPLIFIER - AUDIO AMPLIFIER AUDIO AMPLIFIER
JESD-30 代码 S-PBGA-B9 - - - S-PDSO-N10 S-PDSO-N10 - S-PBGA-B9 S-PBGA-B9
JESD-609代码 e1 - - - e3 e3 - e1 e1
湿度敏感等级 1 - - - 1 1 - 1 1
功能数量 1 - - - 1 1 - 1 1
端子数量 9 - - - 10 10 - 9 9
最高工作温度 85 °C - - - 85 °C 85 °C - 85 °C 85 °C
最低工作温度 -40 °C - - - -40 °C -40 °C - -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY - - - PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 FBGA - - - HVSON HVSON - VFBGA VFBGA
封装形状 SQUARE - - - SQUARE SQUARE - SQUARE SQUARE
封装形式 GRID ARRAY, FINE PITCH - - - SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE - GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
认证状态 Not Qualified - - - Not Qualified Not Qualified - Not Qualified Not Qualified
表面贴装 YES - - - YES YES - YES YES
温度等级 INDUSTRIAL - - - INDUSTRIAL INDUSTRIAL - INDUSTRIAL INDUSTRIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) - - - Matte Tin (Sn) Matte Tin (Sn) - TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 BALL - - - NO LEAD NO LEAD - BALL BALL
端子节距 0.5 mm - - - 0.8 mm 0.8 mm - 0.5 mm 0.5 mm
端子位置 BOTTOM - - - DUAL DUAL - BOTTOM BOTTOM
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