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LMBR260FT1G

Rectifier Diode, Schottky, 1 Phase, 1 Element, 2A, 60V V(RRM), Silicon, SMA, 2 PIN

器件类别:分立半导体    二极管   

厂商名称:LRC

厂商官网:http://www.lrc.cn

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
包装说明
R-PDSO-F2
Reach Compliance Code
unknown
ECCN代码
EAR99
其他特性
FREE WHEELING DIODE, LOW POWER LOSS
应用
EFFICIENCY
配置
SINGLE
二极管元件材料
SILICON
二极管类型
RECTIFIER DIODE
最大正向电压 (VF)
0.7 V
JESD-30 代码
R-PDSO-F2
最大非重复峰值正向电流
50 A
元件数量
1
相数
1
端子数量
2
最高工作温度
150 °C
最低工作温度
-55 °C
最大输出电流
2 A
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
最大重复峰值反向电压
60 V
最大反向电流
500 µA
表面贴装
YES
技术
SCHOTTKY
端子形式
FLAT
端子位置
DUAL
Base Number Matches
1
文档预览
LMBR220FT1G thru LMBR2200FT1G
Schottky Barrier Rectifiers
Reverse Voltage 20 to 200V Forward Current 2.0A
FEATURES
* Plastic package has Underwriters Laboratory
*
*
*
*
Flammability Classification 94V-0
Low power loss,high efficiency
For use in low voltage high frequency inverters,
free wheeling,and polarity protection applications
Guardring for over voltage protection
High temperature soldering guaranteed:
260°C/10 seconds at terminals
Mechanical Data
Case:
SOD123-FL/MINI SMA
molded plastic over sky die
Terminals:
Tin Plated, solderable per
MIL-STD-750, Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.0155 g
Handling precautin:None
We declare that the material of product is
Haloggen free (green epoxy compound)
1.Electrical Characteristic
Maximum & Thermal Characteristics Ratings
Parameter Symbol
device marking code
Maximum repetitive peak reverse
voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified
current at TA = 75°C
Peak forward surge current 8.3ms
single half sine-wave superimposed on
rated load (JEDEC Method)
Typical thermal resistance (Note 1)
Operating junction temperature range
storage temperature range
V
RRM
V
RMS
V
DC
I
F(AV)
symbol
22
20
14
20
23
30
21
30
at 25°C ambient temperature unless otherwise specified.
LMBR
260FT1G
LMBR
280FT1G
LMBR
LMBR
LMBR
2100FT1G 2150FT1G 2200FT1G
LMBR
LMBR
LMBR
LMBR
220FT1G 230FT1G 240FT1G 250FT1G
Unit
24
40
28
40
25
50
35
50
26
60
42
60
2.0
28
80
56
80
210
100
70
100
215
150
105
150
220
200
140
200
V
V
V
A
I
FSM
RθJ
A
RθJ
C
50
110
40
–55
to +150
–65
to +175
A
°C/W
°C
°C
T
J
T
STG
Electrical Characteristics Ratings
at 25°C ambient temperature unless otherwise specified.
Parameter Symbol
Maximum instantaneous forward
voltage at 2.0A
Maximum DC reverse current at rated
DC blocking voltage T
A
= 25℃
Tj = 100
Typical junction capacitance at
4.0V, 1MHz
NOTES:
1. 8.0mm (.013mm thick) land areas
2
symbol
V
F
LMBR
LMBR
LMBR
LMBR
220FT1G 230FT1G 240FT1G 250FT1G
LMBR
260FT1G
LMBR
280FT1G
LMBR
LMBR
LMBR
2100FT1G 2150FT1G 2200FT1G
Unit
V
0.50
0.70
0.85
0.9
0.92
I
R
0.5
20
160
mA
C
J
PF
LMBR220FT1G thru LMBR2200FT1G
2.Ratings and Characteristic Curves
( TA = 25°C unless otherwise noted )
Fig. 1
Forward Current Derating Curve
Average Forward Rectified Current (A)
60 Hz
Resistive or
Inductive Load
Fig. 2
Maximum Non-repetitive Peak
Forward Surge Current
Peak forward surge current (A)
TJ = TJ max
8.3ms Single Half
Sine-wave
2.0
60
1.0
30
0
0
25 50 75 100 125 150 175
Ambient Temperature,
°C
Fig 3.
Typical Instantaneous Forward
Characteristics
TJ = 25°C
Pulse width = 300µs
1% Duty Cycle
0
1
10
Number of Cycles at 60Hz
Fig 4.
Typical Reverse Characteristics
10
Instantaneous Reverse Current (mA)
Tj=125
Instantaneous Forward Current (A)
100
10
1.0
Tj=75
1.0
0.1
0.1
0.01
Tj=25
0.01
0.2
0.001
0.4
0.6
0.8
1.0
1.2
Instantaneous Forward Voltage (V)
0
20
40
60
80
100
Percent of Rated Peak Reverse Voltage (%)
Fig 6.
Typical Junction Capacitance
Transient thermal impedance(°C/W)
100
Fig 5.
–typical
transient thermal
impedance
1000
Junction Capacitance (pF)
TJ = 25°C
f = 1.0 MHz
Vsig =
10
100
1.0
0.1
0.01
0.1
1.0
10
t,Pulse duration,sec
100
10
0.1
1
10
Reverse Voltage (V)
100
LMBR220FT1G thru LMBR2200FT1G
3. dimension:
SOD123-FL
DIM
A
B
C
D
E
H
J
K
MILLIMETERS
MIN
MAX
3.5
3.9
0.75
0.95
2.6
3.0
1.6
2.0
0.45Typ
0.9
1.2
0.12
0.22
0.8Typ
INCHES
MIN
MAX
0.138
0.159
0.029
0.037
0.103
0.119
0.063
0.079
0.018Typ
0.036
0.047
0.005
0.009
0.032Typ
Suggested solder pad layout
Dimensions in inches and (millimeters)
PACKAGE
SOD123-FL
A
0.044(1.10
B
0.040(1.00)
C
0.079(2.00)
LMBR220FT1G thru LMBR2200FT1G
4.Packing information
Unit:mm
Item
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Spocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
Symbol
A
B
C
d
D
D
1
D
D
1
D
2
E
F
P
P
0
P
1
T
W
W
1
tolerance
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
SOD123-FL
2.00
3.85
1.10
1.50
-
-
178.00
62.00
13.00
1.75
3.50
4.00
4.00
2.00
0.23
8.00
11.40
LMBR220FT1G thru LMBR2200FT1G
Reel packing
PACKAGE
SOD123-FL
REEL SIZE
7"
REEL
(PCS)
3,000
COMPONENT
SPACING
(mm)
4.0
BOX
(pcs)
30,000
INNER BOX
(mm)
183*183*123
REEL DIA.
(mm)
178
CARTON SIZE
(mm)
382*262*387
CARTON
(PCS)
240,000
APPOX.
GROSS WEIGHT
(kg)
8.7
5.Suggested thermal profile for soldering process
1. Storage environment:Temperature=5~40℃ Humidity=55±25%
2. Reflow soldering of surface-mount device
3. Reflow soldering
Profile Feature
Average ramp-up rate(T
L
to T
P
)
Preheat
- Temperature Min(Tsmin)
- Temperature Max(Tsmax)
- Time(min to max)(t
s
)
Tsmax to T
L
- Ramp-up Rate
Time maintained above:
- Temperature (T
L
)
- Time(t
L
)
Peak Temperature(T
P
)
Time within 5℃ of actual Peak
Temperature(T
P
)
Ramp-down Rate
Time 25℃ to Peak Temperature
Soldering Condition
<3℃/sec
150℃
200℃
60~120sec
<3sec
217℃
60-260sec
255 -0/+5℃
10~30sec
<6℃/sec
<6minutes
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