infrared LED optically coupled with two photodiodes.
A feedback (input) photodiode is used to generate a
control signal that provides a servomechanism to the
LED drive current, thus compensating for the LED's
nonlinear time and temperature characteristics. The
other (output) photodiode provides an output signal
that is linear with respect to the servo LED current.
The product features wide bandwidth, high input to
output isolation and excellent servo linearity.
V
rms
Features
•
•
•
•
•
•
•
•
•
•
•
0.01% Servo Linearity
THD -87dB Typical
Wide Bandwidth (>200kHz)
Couples Analog and Digital Signals
High Gain Stability
Low Input/Output Capacitance
Low Power Consumption
16-Pin SOIC Package (PCMCIA Compatible)
Machine Insertable, Wave Solderable
Surface Mount Tape & Reel Version Available
VDE Compatible
Approvals
•
UL Recognized Component: File # E76270
•
CSA Certified Component: Certificate # 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate # B 13 12 82667 003
Ordering Information
Applications
•
Modem Transformer Replacement With No
Insertion Loss
•
Digital Telephone Isolation
•
Power Supply Feedback Voltage/Current
•
Medical Sensor Isolation
•
Audio Signal Interfacing
•
Isolation of Process Control Transducers
Part #
LOC210P
LOC210PTR
Description
16-Pin SOIC (50/tube)
16-Pin SOIC (1000/Reel)
K3 Sorted Bins
Bin
Bin 1
Bin 2
Bin Matrix
K3 Range
0.773 - 0.886
0.887 - 1.072
Top Pole
Optocoupler*
Bottom Pole
Optocoupler**
Bin
1
2
1
2
Pin Configuration
– LED
+ LED
3
C1
1
2
16
15
14
13
12
11
10
9
A1
NC
NC
C2
A2
– LED
+ LED
C1
Suffix
K
L
M
N
1
1
2
2
*Top Optocoupler: Pins 1,2,3,4,13, and 14
**Bottom Optocoupler: Pins 7 through 12
Optocoupler #1
Optocoupler #2
4
A1
NC
NC
C2
8
A2
5
6
7
Part Number Information
The LOC210P is shipped in anti-static tubes (50
pieces each) or tape/reel (1,000 pieces each). Each
container has only 1 bin combination which will be
branded on each part with the appropriate bin letter
K, L, M, or N in the lower right hand corner. Suffix
representation is described in the “Bin Matrix”.
DS-LOC210P-R07
www.ixysic.com
1
I
NTEGRATED
C
IRCUITS
D
IVISION
Absolute Maximum Ratings @ 25ºC
Parameter
Reverse LED Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Power Dissipation
Total Package Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
LOC210P
Ratings
5
100
1
150
800
3750
-40 to +85
-40 to +125
Units
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Input Characteristics
LED Voltage Drop
Reverse LED Current
Coupler/Detector Characteristics
Dark Current
K1, Servo Gain (I
C1
/I
F
)
K2, Forward Gain (I
C2
/I
F
)
K3, Transfer Gain (K2/K1=I
C2
/I
C1
)
K3,
Transfer Gain Linearity (non-servoed)
K3 Temperature Coefficient
Common Mode Rejection Ratio
Total Harmonic Distortion
Frequency Response
2
Common Characteristics
Input/Output Capacitance
1
2
Conditions
I
F
=2 - 10mA
V
R
=5V
I
F
=0mA, V
C1-A1
=V
C2-A2
=15V
I
F
=2 - 10mA, V
C1-A1
=V
C2-A2
=15V
I
F
=2 - 10mA
I
F
=2 - 10mA, V
C1-A1
=V
C2-A2
= 5V
V=20V
P-P
, R
L
=2K, f=100Hz
f
0
=350Hz, 0dBm
Photoconductive Configuration
Photovoltaic Configuration
-
Symbol
V
F
I
R
I
D
K1
K2
K3
K3
K3/T
CMRR
THD
f
-3dB
Min
0.9
-
-
0.004
0.004
0.773
-
-
-
-96
-
-
-
Typ
1.2
-
1
-
-
-
-
0.005
130
-87
200
40
3
Max
1.4
10
25
0.030
0.030
1.072
1
-
-
-80
-
-
-
Units
V
A
nA
-
-
-
%
%/
°
C
dB
dB
kHz
kHz
pF
C
I/O
All parameters above are for each optocoupler.
Refer to Application Note, AN-107, for LOC210P configurations.
2
www.ixysic.com
R07
I
NTEGRATED
C
IRCUITS
D
IVISION
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
LED Forward Current
vs. LED Forward Voltage
60
LED Current (mA)
LOC210P
LED Forward Current
vs. LED Forward Voltage
LED Forward Voltage Drop (V)
100
LED Current (mA)
Typical LED Forward Voltage Drop
vs. Temperature
1.6
1.5
1.4
1.3
1.2
1.1
1.0
-40
I
F
=5mA
I
F
=2mA
I
F
=1mA
-20
0
20
40
60
Temperature (ºC)
80
100
I
F
=50mA
I
F
=20mA
I
F
=10mA
50
40
30
20
10
0
1.0
1.1
1.2
1.3
1.4
1.5
10
1
0.1
0.01
1.0
1.1
1.2
1.3
1.4
1.5
LED Forward Voltage (V)
LED Forward Voltage (V)
Servo Gain
vs. LED Current & Temperature
0.016
Servo-Photocurrent
vs. LED Current & Temperature
Servo-Photocurrent ( A)
120
100
80
60
40
20
0
0
2
4
6
8
LED Current (mA)
10
12
0ºC
25ºC
50ºC
70ºC
85ºC
Normalized Servo-Photocurrent
vs. LED Current & Temperature
Normalized Servo-Photocurrent
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
2
4
6
8
LED Current (mA)
10
12
0ºC
25ºC
50ºC
70ºC
85ºC
140
0ºC
25ºC
50ºC
70ºC
85ºC
0.012
Servo Gain
0.008
0.004
0.000
0
2
4
6
8
LED Current (mA)
10
12
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R07
www.ixysic.com
3
I
NTEGRATED
C
IRCUITS
D
IVISION
Manufacturing Information
Moisture Sensitivity
LOC210P
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
LOC210P
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
LOC210P
Maximum Temperature x Time
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after soldering processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
4
www.ixysic.com
R07
I
NTEGRATED
C
IRCUITS
D
IVISION
Mechanical Dimensions
LOC210P
10.160±0.381
(0.400±0.015)
PIN 16
10.363±0.127
(0.408±0.005)
7.493±0.127
(0.295±0.005)
0.635 X 45°
(0.025 X 45°)
1.016 TYP
(0.040 TYP)
0.254 ±0.0127
(0.010±0.0005)
LOC210P
PCB Land Pattern
1.90
(0.075)
9.30
(0.366)
PIN 1
1.27
(0.050)
2.057±0.051
(0.081±0.002)
0.60
(0.024)
DIMENSIONS
mm
(inches)
1.270 TYP
(0.050 TYP)
0.406 TYP
(0.016 TYP)
8.890 TYP
(0.350 TYP)
0.508±0.1016
(0.020±0.004)
Lead to Package Standoff:
MIN: 0.0254 (0.001)
MAX: 0.102 (0.004)
NOTES:
1. Coplanarity = 0.1016 (0.004) max.
2. Leadframe thickness does not include solder plating
(1000 microinch maximum).
LOC210PTR Tape & Reel
330.2 DIA.
(13.00 DIA.)
W=16
(0.630)
B
0
=10.70
(0.421)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
K
0
=3.20
(0.126)
K
1
=2.70
(0.106)
A
0
=10.90
(0.429)
P=12.00
(0.472)
Embossed Carrier
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions
listed on page 5 of EIA-481-2
Dimensions
mm
(inches)
Embossment
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
