Output voltage for connection to termination resistors.
Exposed pad thermal connection. Connect to soft Ground (PSOP-8 only).
Function
Ordering Information
Order Number
LP2998MA
LP2998MAX
LP2998MAE
LP2998MR
LP2998MRX
LP2998MRE
Package Type
SO-8
SO-8
SO-8
PSOP-8
PSOP-8
PSOP-8
NSC Package Drawing
M08A
M08A
M08A
MRA08A
MRA08A
MRA08A
Supplied As
95 Units per Rail
2500 Units Tape and Reel
250 Units Tape and Reel
95 Units per Rail
2500 Units Tape and Reel
250 Units Tape and Reel
www.national.com
2
LP2998
Absolute Maximum Ratings
(Note
1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
PVIN, AVIN, VDDQ to GND
No pin should exceed AVIN
Storage Temp. Range
Junction Temperature
Lead Temperature (Soldering, 10 sec)
−0.3V to +6V
−65°C to +150°C
150°C
260°C
SO-8 Thermal Resistance (θ
JA
)
PSOP-8 Thermal Resistance (θ
JA
)
Minimum ESD Rating (Note
2)
151°C/W
43°C/W
1kV
Operating Range
Junction Temp. Range (Note
3)
AVIN to GND
-40°C to +125°C
2.2V to 5.5V
Electrical Characteristics
Symbol
V
REF
Voltage (DDR I)
Specifications with standard typeface are for T
J
= 25°C and limits in
boldface type
apply over the full
Operating Temperature Range
(T
J
= -40°C to +125°C) (Note
4).
Unless otherwise specified,
VIN = AVIN = PVIN = 2.5V.
Parameter
Conditions
VIN = VDDQ = 2.3V
VIN = VDDQ = 2.5V
VIN = VDDQ = 2.7V
PVIN = VDDQ = 1.7V
PVIN = VDDQ = 1.8V
PVIN = VDDQ = 1.9V
I
REF
= -30 to +30 µA
I
OUT
= 0A
VIN = VDDQ = 2.3V
VIN = VDDQ = 2.5V
VIN = VDDQ = 2.7V
I
OUT
= +/- 1.5A
VIN = VDDQ = 2.3V
VIN = VDDQ = 2.5V
VIN = VDDQ = 2.7V
I
OUT
= 0A, AVIN = 2.5V
PVIN = VDDQ = 1.7V
0.822
0.856
0.887
PVIN = VDDQ = 1.8V
0.874
0.908
0.939
PVIN = VDDQ = 1.9V
0.923
0.957
0.988
I
OUT
= +/- 0.5A, AVIN = 2.5V
PVIN = VDDQ = 1.7V
PVIN = VDDQ = 1.8V
PVIN = VDDQ = 1.9V
V
TT
Output Voltage Offset (V
REF
– V
TT
) for DDR I (Note
7)
I
OUT
= 0A
I
OUT
= -1.5A
I
OUT
= +1.5A
0.820
0.856
0.890
0.870
0.908
0.940
0.920
0.957
0.990
-30
-30
-30
-30
-30
-30
0
0
0
0
0
0
320
100
SD = 0V
SD = 0V
1.9
0.8
SD = 0V
V
TT
= 1.25V
1
13
3
Min
Typ
Max
Units
V
V
V
V
V
V
kΩ
V
V
V
V
V
V
V
V
V
V
V
V
mV
mV
mV
mV
mV
mV
µA
kΩ
µA
µA
V
V
µA
nA
V
REF
1.135
1.158
1.185
1.235
1.258
1.285
1.335
1.358
1.385
0.837
0.860
0.887
0.887
0.910
0.937
0.936
0.959
0.986
2.5
1.120
1.159
1.190
1.210
1.259
1.290
1.320
1.359
1.390
1.125
1.159
1.190
1.225
1.259
1.290
1.325
1.359
1.390
V
REF
Voltage (DDR II)
Z
VREF
V
REF
Output Impedance
V
TT
Output Voltage (DDR I) (Note
7)
V
TT
V
TT
Output Voltage (DDR II) (Note
7)
30
30
30
30
30
30
500
150
5
VOS
Vtt
V
TT
Output Voltage Offset (V
REF
– V
TT
) for DDR II (Note
7)
I
OUT
= 0A
I
OUT
= -0.5A
I
OUT
= +0.5A
I
Q
Z
VDDQ
I
SD
I
Q_SD
V
IH
V
IL
Iv
I
SENSE
Quiescent Current (Note
5)
VDDQ Input Impedance
Quiescent current in shutdown (Note
5)
Shutdown leakage current
Minimum Shutdown High Level
Maximum Shutdown Low Level
V
TT
leakage current in shutdown
V
SENSE
Input current
I
OUT
= 0A
115
2
10
www.national.com
LP2998
Symbol
T
SD
Parameter
Thermal Shutdown (Note
6)
Conditions
Min
Typ
165
10
Max
Units
°C
°C
T
SD_HYS
Thermal Shutdown Hysteresis
Note 1:
Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating range indicates conditions for which the device is
intended to be functional, but does not guarantee specific performance limits. For guaranteed specifications and test conditions see Electrical Characteristics.
The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under
the listed test conditions.
Note 2:
The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
Note 3:
At elevated temperatures, devices must be derated based on thermal resistance. The device in the SO-8 package must be derated at
θ
JA
= 151.2° C/W
junction to ambient with no heat sink.
Note 4:
Limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlation using Statistical Quality
Control (SQC) methods. The limits are used to calculate National's Average Outgoing Quality Level (AOQL).
Note 5:
Quiescent current is defined as the current flow into AVIN.
Note 6:
The maximum allowable power dissipation is a function of the maximum junction temperature, T
J(MAX)
, the junction to ambient thermal resistance,
θ
JA
,
and the ambient temperature, T
A
. Exceeding the maximum allowable power dissipation will cause excessive die temperature and the regulator will go into thermal
shutdown.
Note 7:
V
TT
load regulation is tested by using a 10 ms current pulse and measuring V
