MicroSMD-36 Package, 3.0 x 3.0 x 0.6 mm, 0.5 mm pitch NS Package Number TLA36AAA or
MicroSMDxt-36 Package, 3.0 x 3.0 x 0.65 mm, 0.5 mm pitch NS Package Number RLA36AAA
30008503
30008504
PACKAGE MARK
30008505
Ordering Information
Order Number
LP39542TL
LP39542TLX
LP39542RL
LP39542RLX
Package Marking
D58B
D58B
D58B
D58B
Supplied As
TNR 250
TNR 1000
TNR 250
TNR 1000
Spec/Flow
NoPb
NoPb
NoPb
NoPb
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2
LP39542
Pin Descriptions
Pin #
6F
6E
6D
6C
6B
6A
5F
5E
5D
5C
5B
5A
4F
4E
4D
4C
4B
4A
3F
3E
3D
3C
3B
3A
2F
2E
2D
2C
2B
2A
1F
1E
1D
1C
1B
1A
Name
SW
FB
FLASH
R1
G1
B1
GND_SW
GND
V
DDIO
SDA
IRGB
GND_RGB
GND_WLED
IFLASH
SYNC_PWM
ADDR_SEL
NRST
R2
WLED5
WLED6
V
DD1
FLASH_EN
SCL
G2
WLED3
WLED4
ASE
IRT
GNDT
B2
WLED1
WLED2
GNDA
VREF
V
DDA
V
DD2
Type
Output
Input
Output
Output
Output
Output
Ground
Ground
Power
Logic Input/Output
Input
Ground
Ground
Input
Logic Input
Logic Input
Logic Input
Output
Output
Output
Power
Logic Input
Logic Input
Output
Output
Output
Input
Input
Ground
Output
Output
Output
Ground
Output
Power
Power
Boost Converter Power Switch
Boost Converter Feedback
High Current Flash Output
Red LED 1 Output
Green LED 1 Output
Blue LED 1 Output
Power Switch Ground
Ground
Supply Voltage for Logic Input/Output Buffers and Drivers
Serial Data In/Out (I
2
C)
Bias Current Set Resistor for RGB Drivers
Ground for RGB Currents
Ground for WLED Currents
High Current Flash Current Set Resistor
External PWM Control for LEDs or External Clock for RGB Sync
Address Select (I
2
C)
Reset Pin
Red LED 2 Output
White LED 5 Output
White LED 6 Output
Supply Voltage
Enable for High Current Flash
Clock (I
2
C)
Green LED 2 Output
White LED 3 Output
White LED 4 Output
Audio Synchronization Input
Oscillator Frequency Resistor
Ground
Blue LED 2 Output
White LED 1 Output
White LED 2 Output
Ground for Analog Circuitry
Reference Voltage
Internal LDO Output
Supply Voltage
Description
3
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LP39542
Absolute Maximum Ratings
(Notes 1, 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
V (SW, FB, R1-2, G1-2, B1-2,
FLASH, WLED1-6)(Notes 3, 4)
V
DD1
, V
DD2
, V
DDIO
, V
DDA
Voltage on ASE, IRT, IFLASH,
IRGB, VREF
Voltage on Logic Pins
V(all other pins): Voltage to GND
I (V
REF
)
I(R1, G1, B1, R2, G2, B2)
I(FLASH)(Note 5)
Continuous Power Dissipation
(Note 6)
Junction Temperature (T
J-MAX
)
Storage Temperature Range
Maximum Lead Temperature
(Soldering) (Note 7)
ESD Rating (Note 8)
Human Body Model:
-0.3V to +7.2V
-0.3V to +6.0V
-0.3V to V
DD1
+0.3V
with 6.0V max
-0.3V to V
DDIO
+0.3V
with 6.0V max
-0.3V to 6.0V
10 μA
100 mA
400 mA
Internally Limited
150°C
-65°C to +150°C
260°C
Operating Ratings
(Notes 1, 2)
0 to 6.0V
2.7 to 5.5V
3.0 to 5.5V
2.7 to 2.9V
1.65V to V
DD1
0.1V to V
DDA
–0.1V
0 mA to 400 mA
-30°C to +125°C
-30°C to +85°C
V (SW, FB, WLED1-6, R1-2, G1-2,
B1-2, FLASH)
V
DD1,2
with external LDO
V
DD1,2
with internal LDO
V
DDA
V
DDIO
Voltage on ASE
Recommended Load Current
Junction Temperature (T
J
) Range
Ambient Temperature (T
A
) Range
(Note 9)
Thermal Properties
Junction-to-Ambient Thermal
Resistance(θ
JA
), TLA36AAA or
RLA36AAA Package
(Note 10)
60°C/W
2 kV
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4
LP39542
(Notes 2, 11)
Limits in standard typeface are for T
J
= 25°C. Limits in
boldface
type apply over the operating ambient temperature range (-30°C
< T
A
< +85°C). Unless otherwise noted, specifications apply to the LP39542 Block Diagram with: V
DD1
= V
DD2
= 3.6V, V
DDIO
= 2.8V,
C
VDD
= C
VDDIO
= 100 nF, C
OUT
= C
IN
= 10 μF,
C
VDDA
= 1 μF,
C
REF
= 100 nF, L
1
= 4.7 μH,
R
FLASH
= 910Ω,
R
RGB
= 5.6 kΩ and R
RT
= 82 kΩ
(Note
12).
Symbol
I
VDD
Parameter
Standby supply current
(V
DD1
+ V
DD2
)
Condition
NSTBY (bit) = L, NRST (pin) = H
SCL=H, SDA = H
Min
Typ
1
Max
8
450
Units
μA
μA
Electrical Characteristics
No-boost supply current NSTBY (bit) = H,
(V
DD1
+ V
DD2
)
EN_BOOST(bit) = L
SCL = H, SDA = H
Audio sync and LEDs OFF
No-load supply current
(V
DD1
+ V
DD2
)
NSTBY (bit) = H,
EN_BOOST (bit) = H
SCL = H, SDA = H
Audio sync and LEDs OFF
Autoload OFF
CC mode at R1, G1, B1 and R2, G2, B2 set to 15 mA
SW mode
4+2 banks I
OUT
= 25.5 mA per LED
Audio sync ON
V
DD1,2
= 2.8V
V
DD1,2
= 3.6V
Flash
(V
DD1
+ V
DD2
)
I
VDDIO
I
EXT_LDO
V
DDIO
Standby Supply
current
External LDO output
current
(V
DD1
, V
DD2
, V
DDA
)
I(R
FLASH
) = 1 mA
Peak current during flash
NSTBY (bit)=L
SCL = H, SDA = H
7V tolerant application only
I
BOOST
= 300 mA
2.72
-3
2.80
150
150
500
1
mA
RGB drivers
(V
DD1
+ V
DD2
)
WLED drivers
(V
DD1
+ V
DD2
)
Audio synchronization
(V
DD1
+ V
DD2
)
μA
μA
390
700
2
1
6.5
μA
mA
μA
mA
V
DDA
Output voltage of internal (Note 13)
LDO for analog parts
2.88
+3
V
%
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation
of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions,
see the Electrical Characteristics tables.
Note 2:
All voltages are with respect to the potential at the GND pins.
Note 3:
Battery/Charger voltage should be above 6V no more than 10% of the operational lifetime.
Note 4:
Voltage tolerance of LP39542 above 6.0V relies on fact that V
DD1
and V
DD2
(2.8V) are available (ON) at all conditions. If V
DD1
and V
DD2
are not available
(ON) at all conditions, National Semiconductor does not guarantee any parameters or reliability for this device.
Note 5:
The total load current of the boost converter in worst-case conditions is limited to 300 mA (min. input and max. output voltage).
Note 6:
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
J
=160°C (typ.) and disengages at
T
J
=140°C (typ.).
Note 7:
For detailed soldering specifications and information, please refer to National Semiconductor Application Note AN1112 : Micro SMD Wafer Level Chip
Scale Package or Application note AN1412: Micro SMDxt Wafer Lever Chip Scale Package
Note 8:
The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
Note 9:
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
= 125°C), the maximum power
dissipation of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the part/package in the application (θ
JA
), as given by the
following equation: T
A-MAX
= T
J-MAX-OP
– (θ
JA
× P
D-MAX
).
Note 10:
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,
special care must be paid to thermal dissipation issues in board design.
Note 11:
Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Note 12:
Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics.
