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LPC1754FBD80,518

工作电压:2.4V ~ 3.6V CPU位数:32-Bit CPU内核:ARM® Cortex®-M3 主频(MAX):100MHz ROM类型:FLASH MCU ARM 128KB FLASH

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

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器件参数
参数名称
属性值
Brand Name
NXP Semiconductor
厂商名称
NXP(恩智浦)
零件包装代码
QFP
包装说明
LFQFP, QFP80,.55SQ,20
针数
80
制造商包装代码
SOT315-1
Reach Compliance Code
compliant
具有ADC
YES
地址总线宽度
位大小
32
最大时钟频率
25 MHz
DAC 通道
NO
DMA 通道
YES
外部数据总线宽度
JESD-30 代码
S-PQFP-G80
JESD-609代码
e3
长度
12 mm
湿度敏感等级
2
I/O 线路数量
52
端子数量
80
最高工作温度
85 °C
最低工作温度
-40 °C
PWM 通道
YES
封装主体材料
PLASTIC/EPOXY
封装代码
LFQFP
封装等效代码
QFP80,.55SQ,20
封装形状
SQUARE
封装形式
FLATPACK, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度)
260
电源
3.3 V
认证状态
Not Qualified
RAM(字节)
32768
ROM(单词)
131072
ROM可编程性
FLASH
座面最大高度
1.6 mm
速度
100 MHz
最大压摆率
100 mA
最大供电电压
3.6 V
最小供电电压
2.4 V
标称供电电压
3.3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin (Sn)
端子形式
GULL WING
端子节距
0.5 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
12 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER, RISC
Base Number Matches
1
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LPC1759/58/56/54/52/51
32-bit ARM Cortex-M3 MCU; up to 512 kB flash and 64 kB
SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN
Rev. 04 — 26 January 2010
Product data sheet
1. General description
The LPC1759/58/56/54/52/51 are ARM Cortex-M3 based microcontrollers for embedded
applications featuring a high level of integration and low power consumption. The ARM
Cortex-M3 is a next generation core that offers system enhancements such as enhanced
debug features and a higher level of support block integration.
The LPC1758/56/57/54/52/51 operate at CPU frequencies of up to 100 MHz. The
LPC1759 operates at CPU frequencies of up to 120 MHz. The ARM Cortex-M3 CPU
incorporates a 3-stage pipeline and uses a Harvard architecture with separate local
instruction and data buses as well as a third bus for peripherals. The ARM Cortex-M3
CPU also includes an internal prefetch unit that supports speculative branching.
The peripheral complement of the LPC1759/58/56/54/52/51 includes up to 512 kB of flash
memory, up to 64 kB of data memory, Ethernet MAC, USB Device/Host/OTG interface,
8-channel general purpose DMA controller, 4 UARTs, 2 CAN channels, 2 SSP controllers,
SPI interface, 2 I
2
C-bus interfaces, 2-input plus 2-output I
2
S-bus interface, 6 channel
12-bit ADC, 10-bit DAC, motor control PWM, Quadrature Encoder interface, 4 general
purpose timers, 6-output general purpose PWM, ultra-low power Real-Time Clock (RTC)
with separate battery supply, and up to 52 general purpose I/O pins.
2. Features
ARM Cortex-M3 processor, running at frequencies of up to 100 MHz
(LPC1758/56/57/54/52/51) or of up to 120 MHz (LPC1759). A Memory Protection Unit
(MPU) supporting eight regions is included.
ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).
Up to 512 kB on-chip flash programming memory. Enhanced flash memory accelerator
enables high-speed 120 MHz operation with zero wait states.
In-System Programming (ISP) and In-Application Programming (IAP) via on-chip
bootloader software.
On-chip SRAM includes:
Up to 32 kB of SRAM on the CPU with local code/data bus for high-performance
CPU access.
Two/one 16 kB SRAM blocks with separate access paths for higher throughput.
These SRAM blocks may be used for Ethernet (LPC1758 only), USB, and DMA
memory, as well as for general purpose CPU instruction and data storage.
Eight channel General Purpose DMA controller (GPDMA) on the AHB multilayer
matrix that can be used with the SSP, I
2
S-bus, UART, the Analog-to-Digital and
Digital-to-Analog converter peripherals, timer match signals, and for
memory-to-memory transfers.
NXP Semiconductors
LPC1759/58/56/54/52/51
32-bit ARM Cortex-M3 microcontroller
Multilayer AHB matrix interconnect provides a separate bus for each AHB master.
AHB masters include the CPU, General Purpose DMA controller, Ethernet MAC
(LPC1758 only), and the USB interface. This interconnect provides communication
with no arbitration delays.
Split APB bus allows high throughput with few stalls between the CPU and DMA.
Serial interfaces:
On the LPC1758 only, Ethernet MAC with RMII interface and dedicated DMA
controller.
USB 2.0 full-speed device/Host/OTG controller with dedicated DMA controller and
on-chip PHY for device, Host, and OTG functions. The LPC1752/51 include a USB
device controller only.
Four UARTs with fractional baud rate generation, internal FIFO, and DMA support.
One UART has modem control I/O and RS-485/EIA-485 support, and one UART
has IrDA support.
CAN 2.0B controller with two (LPC1759/58/56) or one (LPC1754/52/51) channels.
SPI controller with synchronous, serial, full duplex communication and
programmable data length.
Two SSP controllers with FIFO and multi-protocol capabilities. The SSP interfaces
can be used with the GPDMA controller.
Two I
2
C-bus interfaces supporting fast mode with a data rate of 400 kbit/s with
multiple address recognition and monitor mode.
On the LPC1759/58/56 only, I
2
S (Inter-IC Sound) interface for digital audio input or
output, with fractional rate control. The I
2
S-bus interface can be used with the
GPDMA. The I
2
S-bus interface supports 3-wire and 4-wire data transmit and
receive as well as master clock input/output.
Other peripherals:
52 General Purpose I/O (GPIO) pins with configurable pull-up/down resistors. All
GPIOs support a new, configurable open-drain operating mode. The GPIO block is
accessed through the AHB multilayer bus for fast access and located in memory
such that it supports Cortex-M3 bit banding and use by the General Purpose DMA
Controller.
12-bit Analog-to-Digital Converter (ADC) with input multiplexing among six pins,
conversion rates up to 200 kHz, and multiple result registers. The 12-bit ADC can
be used with the GPDMA controller.
On the LPC1759/58/56/54 only, 10-bit Digital-to-Analog Converter (DAC) with
dedicated conversion timer and DMA support.
Four general purpose timers/counters, with a total of three capture inputs and ten
compare outputs. Each timer block has an external count input. Specific timer
events can be selected to generate DMA requests.
One motor control PWM with support for three-phase motor control.
Quadrature encoder interface that can monitor one external quadrature encoder.
One standard PWM/timer block with external count input.
Real-Time Clock (RTC) with a separate power domain and dedicated RTC
oscillator. The RTC block includes 20 bytes of battery-powered backup registers.
Watchdog Timer (WDT). The WDT can be clocked from the internal RC oscillator,
the RTC oscillator, or the APB clock.
ARM Cortex-M3 system tick timer, including an external clock input option.
LPC1759_58_56_54_52_51_4
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 — 26 January 2010
2 of 64
NXP Semiconductors
LPC1759/58/56/54/52/51
32-bit ARM Cortex-M3 microcontroller
Repetitive Interrupt Timer (RIT) provides programmable and repeating timed
interrupts.
Each peripheral has its own clock divider for further power savings.
Standard JTAG test/debug interface for compatibility with existing tools. Serial Wire
Debug and Serial Wire Trace Port options.
Emulation trace module enables non-intrusive, high-speed real-time tracing of
instruction execution.
Integrated PMU (Power Management Unit) automatically adjusts internal regulators to
minimize power consumption during Sleep, Deep sleep, Power-down, and Deep
power-down modes.
Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep power-down.
Single 3.3 V power supply (2.4 V to 3.6 V).
One external interrupt input configurable as edge/level sensitive. All pins on Port 0 and
Port 2 can be used as edge sensitive interrupt sources.
Non-maskable Interrupt (NMI) input.
The Wakeup Interrupt Controller (WIC) allows the CPU to automatically wake up from
any priority interrupt that can occur while the clocks are stopped in Deep sleep,
Power-down, and Deep power-down modes.
Processor wake-up from Power-down mode via any interrupt able to operate during
Power-down mode (includes external interrupts, RTC interrupt, USB activity, Ethernet
wake-up interrupt (LPC1758 only), CAN bus activity, Port 0/2 pin interrupt, and NMI).
Brownout detect with separate threshold for interrupt and forced reset.
Power-On Reset (POR).
Crystal oscillator with an operating range of 1 MHz to 25 MHz.
4 MHz internal RC oscillator trimmed to 1 % accuracy that can optionally be used as a
system clock.
PLL allows CPU operation up to the maximum CPU rate without the need for a
high-frequency crystal. May be run from the main oscillator, the internal RC oscillator,
or the RTC oscillator.
USB PLL for added flexibility.
Code Read Protection (CRP) with different security levels.
Unique device serial number for identification purposes.
Available as 80-pin LQFP package (12 mm
×
12 mm
×
1.4 mm).
3. Applications
eMetering
Lighting
Industrial networking
Alarm systems
White goods
Motor control
LPC1759_58_56_54_52_51_4
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 — 26 January 2010
3 of 64
NXP Semiconductors
LPC1759/58/56/54/52/51
32-bit ARM Cortex-M3 microcontroller
4. Ordering information
Table 1.
Ordering information
Package
Name
LPC1759FBD80
LPC1758FBD80
LPC1756FBD80
LPC1754FBD80
LPC1752FBD80
LPC1751FBD80
LQFP80
LQFP80
LQFP80
LQFP80
LQFP80
LQFP80
Description
plastic low-profile quad package; 80 leads; body 12
×
12
×
1.4 mm
plastic low-profile quad package; 80 leads; body 12
×
12
×
1.4 mm
plastic low-profile quad package; 80 leads; body 12
×
12
×
1.4 mm
plastic low-profile quad package; 80 leads; body 12
×
12
×
1.4 mm
plastic low-profile quad package; 80 leads; body 12
×
12
×
1.4 mm
plastic low-profile quad package; 80 leads; body 12
×
12
×
1.4 mm
Version
SOT315-1
SOT315-1
SOT315-1
SOT315-1
SOT315-1
SOT315-1
Type number
4.1 Ordering options
Table 2.
Ordering options
Flash
SRAM in kB
CPU AHB
AHB
Total
SRAM0 SRAM1
LPC1759FBD80 512 kB 32
LPC1758FBD80 512 kB 32
LPC1756FBD80 256 kB 16
LPC1754FBD80 128 kB 16
LPC1752FBD80 64 kB
LPC1751FBD80 32 kB
16
8
16
16
16
16
-
-
16
16
-
-
-
-
64
64
32
32
16
8
no
yes
no
no
no
no
Ethernet USB
CAN I
2
S-bus DAC Maximum
CPU
operating
frequency
yes
yes
yes
no
no
no
yes
yes
yes
yes
no
no
120 MHz
100 MHz
100 MHz
100 MHz
100 MHz
100 MHz
Type number
Device/Host/OTG 2
Device/Host/OTG 2
Device/Host/OTG 2
Device/Host/OTG 1
Device only
Device only
1
1
LPC1759_58_56_54_52_51_4
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 — 26 January 2010
4 of 64
NXP Semiconductors
LPC1759/58/56/54/52/51
32-bit ARM Cortex-M3 microcontroller
5. Block diagram
debug
port
JTAG
interface
XTAL1
XTAL2
RESET
RMII pins
USB pins
EMULATION
TRACE MODULE
TEST/DEBUG
INTERFACE
ARM
CORTEX-M3
LPC1759/58/56/54/52/51
USB PHY
CLOCK
GENERATION,
POWER CONTROL,
SYSTEM
FUNCTIONS
clocks and
controls
DMA
CONTROLLER
master
ETHERNET
CONTROLLER
WITH DMA
(2)
master
USB HOST/
DEVICE/OTG
CONTROLLER
WITH DMA
(4)
master
slave
I-code
bus
D-code
bus
system
bus
MPU
ROM
slave
MULTILAYER AHB MATRIX
SRAM
64/32/
16/8 kB
slave
FLASH
ACCELERATOR
FLASH
512/256/128/64/32 kB
APB slave group 1
SSP0
SCK0
SSEL0
MISO0
MOSI0
RXD2/3
TXD2/3
1
×
I2SRX
3
×
I2STX
TX_MCLK
RX_MCLK
SCL2
SDA2
P0, P1,
P2, P4
HIGH-SPEED
GPIO
slave
slave
AHB TO
APB
BRIDGE 0
slave
AHB TO
APB
BRIDGE 1
SCK1
SSEL1
MISO1
MOSI1
RXD0/TXD0
8
×
UART1
RD1/2
TD1/2
SCL1
SDA1
SCK/SSEL
MOSI/MISO
2
×
MAT0/1
1
×
CAP0,
2
×
CAP1
PWM1[6:1]
PCAP1[1:0]
AD0[7:2]
APB slave group 0
SSP1
UART0/1
CAN1/CAN2
(1)
I2C1
SPI0
TIMER 0/1
WDT
PWM1
12-bit ADC
PIN CONNECT
UART2/3
I2S
(1)
I2C2
RI TIMER
TIMER2/3
EXTERNAL INTERRUPTS
SYSTEM CONTROL
MOTOR CONTROL PWM
DAC
(3)
QUADRATURE ENCODER
(1)
(2)
(3)
(4)
4
×
MAT2
2
×
MAT3
EINT0
MCOA[2:0]
MCOB[2:0]
MCI[2:0]
AOUT
PHA, PHB
INDEX
P0, P2
RTCX1
RTCX2
VBAT
GPIO INTERRUPT CONTROL
32 kHz
OSCILLATOR
RTC
BACKUP REGISTERS
RTC POWER DOMAIN
LPC1759/58/56 only
LPC1758 only
LPC1759/58/56/54 only
LPC1752/51 USB device only
002aae153
Grey-shaded blocks represent peripherals with connection to the GPDMA.
Fig 1.
Block diagram
© NXP B.V. 2010. All rights reserved.
LPC1759_58_56_54_52_51_4
Product data sheet
Rev. 04 — 26 January 2010
5 of 64
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参数对比
与LPC1754FBD80,518相近的元器件有:LPC1752、LPC1751FBD80,551。描述及对比如下:
型号 LPC1754FBD80,518 LPC1752 LPC1751FBD80,551
描述 工作电压:2.4V ~ 3.6V CPU位数:32-Bit CPU内核:ARM® Cortex®-M3 主频(MAX):100MHz ROM类型:FLASH MCU ARM 128KB FLASH NXP Microcontrollers Selection Guide 工作电压:2.4V ~ 3.6V CPU位数:32-Bit CPU内核:ARM® Cortex®-M3 主频(MAX):100MHz ROM类型:FLASH
Brand Name NXP Semiconductor - NXP Semiconductor
厂商名称 NXP(恩智浦) - NXP(恩智浦)
零件包装代码 QFP - QFP
包装说明 LFQFP, QFP80,.55SQ,20 - LFQFP, QFP80,.55SQ,20
针数 80 - 80
制造商包装代码 SOT315-1 - SOT315-1
Reach Compliance Code compliant - compliant
具有ADC YES - YES
位大小 32 - 32
最大时钟频率 25 MHz - 25 MHz
DAC 通道 NO - YES
DMA 通道 YES - YES
JESD-30 代码 S-PQFP-G80 - S-PQFP-G80
JESD-609代码 e3 - e3
长度 12 mm - 12 mm
湿度敏感等级 2 - 2
I/O 线路数量 52 - 52
端子数量 80 - 80
最高工作温度 85 °C - 85 °C
最低工作温度 -40 °C - -40 °C
PWM 通道 YES - YES
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY
封装代码 LFQFP - LFQFP
封装等效代码 QFP80,.55SQ,20 - QFP80,.55SQ,20
封装形状 SQUARE - SQUARE
封装形式 FLATPACK, LOW PROFILE, FINE PITCH - FLATPACK, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度) 260 - 260
电源 3.3 V - 3.3 V
认证状态 Not Qualified - Not Qualified
RAM(字节) 32768 - 8192
ROM(单词) 131072 - 32768
ROM可编程性 FLASH - FLASH
座面最大高度 1.6 mm - 1.6 mm
速度 100 MHz - 100 MHz
最大压摆率 100 mA - 100 mA
最大供电电压 3.6 V - 3.6 V
最小供电电压 2.4 V - 2.4 V
标称供电电压 3.3 V - 3.3 V
表面贴装 YES - YES
技术 CMOS - CMOS
温度等级 INDUSTRIAL - INDUSTRIAL
端子面层 Tin (Sn) - Tin (Sn)
端子形式 GULL WING - GULL WING
端子节距 0.5 mm - 0.5 mm
端子位置 QUAD - QUAD
处于峰值回流温度下的最长时间 NOT SPECIFIED - NOT SPECIFIED
宽度 12 mm - 12 mm
uPs/uCs/外围集成电路类型 MICROCONTROLLER, RISC - MICROCONTROLLER, RISC
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