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LPC4045ATED331N

General Purpose Inductor, 330uH, 30%, 1 Element, SMD,

器件类别:无源元件    电感器   

厂商名称:KOA Speer

厂商官网:http://www.koaspeer.com/

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
KOA Speer
Reach Compliance Code
compliant
ECCN代码
EAR99
直流电阻
3.71 Ω
标称电感 (L)
330 µH
电感器应用
RF INDUCTOR
电感器类型
GENERAL PURPOSE INDUCTOR
JESD-609代码
e2
制造商序列号
LPC4045
功能数量
1
端子数量
2
最高工作温度
80 °C
最低工作温度
-30 °C
最小质量因数(标称电感时)
40
最大额定电流
0.15 A
自谐振频率
3 MHz
形状/尺寸说明
CYLINDRICAL PACKAGE
屏蔽
NO
表面贴装
YES
端子面层
Tin/Silver (Sn/Ag)
端子位置
DUAL ENDED
端子形状
NO LEAD
测试频率
1 MHz
容差
30%
文档预览
KOA SPEER ELECTRONICS, INC.
SS-194 R2
AHA 11/27/02
Power Chip Inductors
Type LPC4045
1. Scope
This specification shall be applied to the LPC4045 manufactured by KOA Corporation.
2. Type Designation
The type designation shall be the following form:
Old Type
CERTIFIED
LPC
Type
4045
Size
TED
Packaging
101
Nominal
Inductance
K
Tolerance
New Type
LPC
Type
4045
Size
L
Termination
Material
L: SnPb
A: SnAg
TED
Packaging
TED: 10" Embossed Plastic
2,500 pcs/reel
101
Nominal
Inductance
101: 100µH
221: 220µH
K
Tolerance
K: ±10%
M: ±20%
N: ±30%
4045
3. Rating
Ordering
Code
LPC4045TE 100K
LPC4045TE 150K
LPC4045TE 220K
LPC4045TE 330K
LPC4045TE 470K
LPC4045TE 680K
LPC4045TE 101K
LPC4045TE 151K
LPC4045TE 221K
LPC4045TE 331K
LPC4045TE 471K
LPC4045TE 681K
Inductance Inductance
Quality
Self Resonance
(µH)
Tolerance (%) Factor Min. Freq. Min. (MHz)
10
15
22
33
47
68
100
150
220
330
470
680
23.5
18.5
14.0
12.0
10.5
8.0
6.3
5.2
3.9
3.0
2.7
2.2
DC Resistance
Maximum (Ω)
0.08
0.13
0.18
0.35
0.45
0.58
0.80
1.56
1.95
3.71
4.55
5.80
Allowable DC
Current Max. (A)
1.02
0.84
0.70
0.52
0.46
0.40
0.28
0.25
0.18
0.15
0.14
0.12
PAGE 1 OF 4
Bolivar Drive
I
20
10
40
P.O. Box 547
I
Bradford, PA 16701
I
USA
I
814-362-5536
I
Fax 814-362-8883
I
www.koaspeer.com
KOA SPEER ELECTRONICS, INC.
SS-194 R2
3.1 Rating
No.
1
2
3
4
5
6
Item
Nominal inductance range
Nominal inductance tolerance
Q (Quality factor)
Self-resonance frequency of (MHz)
DC resistance Rdc (ohm)
Allowable current I (mA)
Specification
10
µ
~ 680
µ
H (E-6 series)
The rating shall be shown in 6.
Measuring Conditions: Normal testing is conducted at normal temperatures (5°C ~ 35°C) and at nominal humidity
(45% ~ 85% R. H.). If there is concern, the test may be conducted at a temperature of 20 ± 2°C and at a relative
humidity of 65 ± 5% R. H.
4. External Appearance, Design and Rating
(unit: mm)
Ceramic
1.8
-0.1
+0
4.1 Circuit Diagram
1
±
0.3
4.5
±
0.2
4.5 Max.
3.0
±
0.2
4.0
±
0.2
1
±
0.3
5. Environmental Characteristics
No.
1
2
3
4
5
6
7
8
9
10
Item
High temperature, leaving test
Low temperature, leaving test
Moisture leaving test
Heat shock test
Dropping test
Vibration test
Operating temperature range
Storage temperature range
Resistance to soldering heat
Resistance to solvent
Test Methods
85 ± 2°C 500 Hr
-40 ± 2°C 500 Hr
40 ± 2°C 90 ~ 95% R. H. 500 Hr
-40 ± 4°C/0.5 Hr
85 ± 2°C/0.5 Hr
85°C
0.5 Hr
100 cycles
-40°C
1 dropped from height of 1 meter to top of board.
2 hours in each direction of X, Y, Z at a frequency
range of 10 ~ 55 Hz with 1.5 mm amplitude.
-30°C ~ +80°C
-40°C ~ +85°C
With the temperature of the solder at 250°C,
soak for 6 seconds. There shall be no abnormalities.
MIL-STD-202F Method 215
Q (Quality factor)
PAGE 2 OF 4
I
There shall be no abnormalities under the above conditions.
Measurement: Inductance DC Superposed characteristics LCR Meter HP4284A
Frequency: Inductance 1 MHz DC Superposed characteristics 10 KHz
Bolivar Drive
I
P.O. Box 547
I
Bradford, PA 16701
I
USA
I
814-362-5536
I
Fax 814-362-8883
www.koaspeer.com
KOA SPEER ELECTRONICS, INC.
SS-194 R2
6. Packaging
6.1 Bulk Packaging
(1) 1,000 chip inductors are packed in a poly bag.
6.2 Taping
The taping shall be embossed carrier tapes of 12 mm width
and 8 mm pitches. The standard quantity per reel shall be 1,000 pieces.
6.3 Dimensions of Taping
12.0
±
0.1
1.75
±
0.1
8.0
±
0.1
4.0
±
0.1
4.6
±
0.1
Ø1.5
±
0.1 0.4
Ø21.0
±
0.5
Ø13.0
±
0.5
(2) None: Bulk
80.0
±
2.0
5.5
±
0.1
4.75
±
0.2
4.15
±
0.2
2.0
±
0.3
ø250
13
±
1.0
Blank
over 50 mm
Products
1,000 pieces
Blank
Tape leader
over 50 mm 50 ~ 200 mm
Feed Direction
6.4 Packaging Method
A specially designed cardboard box is used
for the external packaging and can hold a
maximum of 20 reels.
6.5 Markings
The following information is provided
on the reel.
(1) Product name (2) Part number (3) Quality
(4) Lot number (5) Manufacture origin
6.6 Lot Number
(Example) January 22, 1992
53
Year and
Month of
Manufacture
22
Day of
Manufacture
D
Manufacture
Plant
K
Additional
Number
53 ...1992.1 54...1992.2 55...1992.3
PAGE 3 OF 4
Bolivar Drive
I
P.O. Box 547
I
Bradford, PA 16701
I
USA
I
814-362-5536
I
Fax 814-362-8883
I
www.koaspeer.com
KOA SPEER ELECTRONICS, INC.
SS-194 R2
7. General Information
7.1 Storage
Chip inductors shall not be stored under high
temperature and high humidity conditions.
Especially, do not store taping where they are
exposed to heat or direct sunlight. Otherwise,
material may be deformed, causing problems
during mounting.
7.2 Mounting
Placement force should not be excessive.
7.3 Soldering
Soldering should be done at 250°C for less
than 6 seconds. When using a soldering iron,
temperature shall not exceed 350°C and
within 3 seconds. Soldering iron time shall
be allowed only one time. After soldering, chip
inductors shall not be stressed excessively.
7.4 Cleaning
There is no problem using organic solvents.
Since these chip inductors are a coil of
ultra-thin wire, they are susceptible to
vibration. If an ultrasonic cleaning unit is
used, check for any possibility of problem
generation before practical use, since such
cleaning units differ considerably in vibration
level and mode. Although the conditions
vary depending on the printed board size,
Ultrasonic cleaning is generally used in
the conditions described in the following
examples:
Power: Within 20W/L
Cleaning times:
Within 5 minutes
7.5 Pattern Design
A land pattern gap is recommended of
2.0 mm to 2.5 mm. When low or more chip
inductors are closely mounted, they must
be separated by means of solder resists
to prevent excessive solder.
9. Land Pattern Design
9.1 Pattern Design
A land pattern gap is recommended of
2.0 mm to 2.5 mm. When low or more chip
inductors are closely mounted, they must be
separated by means of solder resists to
prevent excessive solder.
(unit: mm)
Time
Within 90
seconds
Within 45
seconds
Within 30
seconds
Within 6
seconds
2.0
2.0
2.0
8. Soldering
8.1 Conditions for Reflow Soldering
The time and temperature for reflow solder
applications are as shown below.
Temperature (°C)
230
200
160
4.5
Clean solder film 300
±
100 micron
PAGE 4 OF 4
Bolivar Drive
I
P.O. Box 547
I
Bradford, PA 16701
I
USA
I
814-362-5536
I
Fax 814-362-8883
I
www.koaspeer.com
Notice: The information contained in this Spec Sheet is believed to be accurate and up-to-date. KOA Speer Electronics reserves this right to change these specifications without notice.
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