Reference Only
Spec No. JELF243B-0017H-01
P.1/9
CHIP COIL (CHIP INDUCTORS)
1. Scope
LQM21FN□□□□80L
REFERENCE
SPECIFICATION
This reference specification applies to LQM21FN_80L series, Chip coil (Chip Inductors).
2. Part Numbering
(ex)
LQ
M
21
F
N
4R7
M
8
0
L
Packaging
L: Taping
*B: BULK
Product ID Structure Dimension Applications Category
(L×W) and
Characteristics
Inductance Tolerance Features Electrode
*B: Bulk packing also available
3. Rating
Operating
Temperature Range
Storage
Temperature Range
–55°C to + 125°C
–55°C to + 125°C
Inductance
(H)
4.7
10
±20%
Tolerance
DC
Resistance
(Ω)
0.18±30%
0.30±30%
Self
Resonant
Frequency
(MHz min.)
25
15
Rated
Current
(mA)
120
100
Customer
Part Number
MURATA
Part Number
LQM21FN4R7M80L
LQM21FN100M80L
4. Appearance and Dimensions
0.5±0.3
Ferrite
Electrode
1.25±0.2
2.0±0.2
1.25±0.2
■Unit
Mass (Typical value)
0.016g
(in mm)
5. Testing Conditions
《Unless
otherwise specified》
《In
case of doubt》
Temperature : Ordinary Temperature / 15°C to 35°C
Temperature : 20°C ± 2°C
Humidity
: Ordinary Humidity
/ 25%(RH) to 85%(RH)
Humidity
: 60%(RH) to 70%(RH)
Atmospheric Pressure : 86kPa to 106kPa
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0017H-01
P.2/9
6. Electrical Performance
No.
6.1
Item
Inductance
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment:
KEYSIGHT
4294A or equivalent
(1mA)
Measuring Frequency: 1MHz
Measuring Equipment: Digital multi meter
Digital multi meter
(TR6846 or equivalent)
a
terminal1
SW
b
terminal2
6.2
DC Resistance
DC Resistance shall meet item 3.
DC resistance shall be measured after
putting chip coil between the terminal 2
under the condition of opening between
a and b.
Every measurement the terminal 1 shall
be shorted between a and b when
changing chip coil.
6.3
6.4
Self Resonant
Frequency
(S.R.F)
Rated Current
S.R.F shall meet item 3.
Self temperature rise shall be limited
to 25°C max.
Inductance Change: within ±50%
Measuring Equipment:
KEYSIGHT
4291A or equivalent
The rated current is applied.
7. Mechanical Performance
No.
7.1
Item
Shear Test
Specification
Chip coil shall not be damaged after
tested as follows.
Test Method
Applied Direction
Chip Coil
F
Substrate
7.2
Bending Test
Force: 10N
Hold Duration: 5s±1s
Applied Direction: Parallel to PCB
Substrate: Glass-epoxy substrate
(100mm×40mm×1.0mm)
Pressure jig
R340
F
Deflection
45
45
Product
(in mm)
7.3
Vibration
Speed of Applying Force: 1mm/s
Deflection: 2mm
Hold Duration: 30s
Oscillation Frequency:
10Hz to 55Hz to 10Hz for 1 min
Total Amplitude:1.5mm
Testing Time:
A period of 2h in each of 3 mutually
perpendicular directions.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0017H-01
P.3/9
No.
7.4
Item
Solderability
Specification
The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Test Method
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 240°C±5°C
Immersion Time: 3s±1s
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 270°C±5°C
Immersion Time: 10s±1s
Then measured after exposure in the room
condition for 24h±2h.
7.5
Resistance to
Soldering Heat
Appearance: No damage
Inductance Change: within ±20%
8. Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
8.1 Heat
Appearance: No damage
Resistance
Inductance Change: within ±20%
Test Method
Temperature: 125°C±2°C
Time: 1000h (+48h, -0h)
Then measured after exposure in the room
condition for 24h±2h.
Temperature: 70°C±2°C
Humidity: 90%(RH) to 95%(RH)
Time: 1000h (+48h, -0h)
Then measured after exposure in the room
condition for 24h±2h.
1 cycle:
1 step: -55°C±2°C / 30 min±3 min
2 step: Ordinary temp. / 10 min to 15 min
3 step: 125°C±2°C / 30 min to 3 min
4 step: Ordinary temp. / 10 min to15 min
Total of 10 cycles
Then measured after exposure in the room
condition for 24 h±2 h.
8.2
Humidity
8.3
Temperature
Cycle
9. Specification of Packaging
9.1 Appearance and Dimensions of paper tape / plastic tape
2.0±0.05
4.0±0.1 4.0±0.1
1 .7 5 ±0 .1
1.45±0.05
0.2±0.1
0.1
φ
1.5±
0
3 .5 ±0 .0 5
Direction of feed
1.45±0.05
2 .2 5 ±0 .1
8 .0 ±0 .3
(in mm)
・Dimension of the Cavity is measured at the bottom side.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0017H-01
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
3,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Plastic tape
Cover tape
9.4 Peeling off force of cover tape
Speed of Peeling off
Peeling off force
300mm / min
0.2N to 0.7N
(minimum value is typical)
165 to 180 degree
F
Cover tape
P.4/9
10N min.
Plastic tape
9.5 Dimensions of Leader-tape,Trailer and Reel
There shall be leader-tape ( cover tape ) and trailer-tape (empty tape) as follows.
Trailer
2.0±0.5
160 min.
Leader
Label
190 min.
Empty tape
13.0±0.2
210 min.
Cover tape
60±
0
21.0±0.8
1
9±
1
0
13±1.4
180±
3
0
Direction of feed
(in mm)
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number (1), RoHS Marking (2),
Quantity etc
½½½
1)
<Expression of Inspection No.>
(1)
Factory Code
□□
OOOO
(1)
(2)
(3)
(2) Date
(3)
Serial No.
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep.
1 to 9, Oct. to Dec.
O, N, D
Third, Fourth digit : Day
2)
<Expression of RoHS Marking >
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
ROHS – Y (△)
(1) (2)
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS
Marking (2) ,Quantity, etc
½½½
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0017H-01
9.8. Specification of Outer Case
Outer Case Dimensions
(mm)
W
D
H
186
186
93
Standard Reel Quantity
in Outer Case (Reel)
P.5/9
Label
H
W
5
D
Above
Outer Case size is typical. It depends on a quantity of an order
10.
！
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require
especially high reliability for the prevention of defects which might directly cause damage to the
third party's life, body or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(2) Aerospace equipment
(3) Undersea equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
c
Chip Coil
Land
Solder Resist
a
b
a
b
c
1.2
3.0 to 4.0
1.0
(in mm)
11.2 Flux, Solder
Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).
Don’t use water-soluble flux.
Use Sn-3.0Ag-0.5Cu solder.
Standard thickness of solder paste: 100m to 150m.
11.3 Flow soldering / Reflow soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and product
surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way
that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products
quality.
Standard
soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in
the deterioration of product quality.
MURATA MFG.CO., LTD
