型号
- 型号
- 关键词
| 型号 | LR3220GM-33 | LR3220GM-25 | LR3220QC-25 | LR3220QC-33 |
|---|---|---|---|---|
| 描述 | Memory IC, CMOS, CPGA180, | Memory Circuit, CMOS, CPGA180, | Memory Circuit, CMOS, PQFP184 | Memory IC, CMOS, PQFP184, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Broadcom(博通) | Broadcom(博通) | Broadcom(博通) | Broadcom(博通) |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 代码 | S-XPGA-P180 | S-XPGA-P180 | S-PQFP-G184 | S-PQFP-G184 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 混合内存类型 | N/A | N/A | N/A | N/A |
| 端子数量 | 180 | 180 | 184 | 184 |
| 最高工作温度 | 125 °C | 125 °C | 70 °C | 70 °C |
| 封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | PGA | PGA | QFP | QFP |
| 封装等效代码 | PGA180M,15X15 | PGA180M,15X15 | QFP184,1.26SQ,20 | QFP184,1.26SQ,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | FLATPACK | FLATPACK |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 0.17 mA | 0.16 mA | 0.16 mA | 0.17 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | PIN/PEG | PIN/PEG | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 0.5 mm | 0.5 mm |
| 端子位置 | PERPENDICULAR | PERPENDICULAR | QUAD | QUAD |