首页 > 器件类别 > 嵌入式处理器和控制器 > 微控制器和处理器

LS1023AXE8PQB

Multifunction Peripheral, CMOS, PBGA780

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

器件标准:

下载文档
LS1023AXE8PQB 在线购买

供应商:

器件:LS1023AXE8PQB

价格:-

最低购买:-

库存:点击查看

点击购买

器件参数
参数名称
属性值
是否Rohs认证
符合
Objectid
8302773367
包装说明
FBGA,
Reach Compliance Code
compliant
ECCN代码
5A002.A.1
Factory Lead Time
52 weeks
Samacsys Manufacturer
NXP
Samacsys Modified On
2022-12-27 12:55:46
YTEOL
7.63
其他特性
ALSO OPERATES AT 1V SUPPLY NOM
JESD-30 代码
S-PBGA-B780
JESD-609代码
e1
长度
23 mm
湿度敏感等级
3
端子数量
780
最高工作温度
105 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
FBGA
封装形状
SQUARE
封装形式
GRID ARRAY, FINE PITCH
峰值回流温度(摄氏度)
250
座面最大高度
2.07 mm
最大供电电压
1.03 V
最小供电电压
0.97 V
标称供电电压
1 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Silver/Copper (Sn/Ag/Cu)
端子形式
BALL
端子节距
0.8 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
30
宽度
23 mm
uPs/uCs/外围集成电路类型
SoC
文档预览
NXP Semiconductors
Data Sheet: Technical Data
Document Number LS1043A
Rev. 2, 01/2017
QorIQ LS1043A, LS1023A
Data Sheet
Features
• LS1043A contains 32-bit /64-bit ARM® Cortex®-A53
MPCore Processor with the following capabilities:
– Speed up to 1.6 GHz
– 32 KB L1 Instruction Cache w/parity
– 32 KB L1 Data Cache w/ECC
– Neon SIMD Co-processor
– ARM v8 Cryptography Extensions
• 1 MB unified I/D L2 Cache w/ECC
• Hierarchical interconnect fabric
– Hardware Managed Data coherency
– Up to 400 MHz operation
• One 32-bit DDR3L/DDR4 SDRAM memory controller
– ECC and interleaving support
– Up to 1.6 GT/s
• Data Path Acceleration Architecture (DPAA)
incorporating acceleration for the following functions:
– Packet parsing, classification, and distribution
(FMan)
– Queue management for scheduling, packet
sequencing, and congestion management (QMan)
– Hardware buffer management for buffer allocation
and de-allocation (BMan)
– Cryptography acceleration (SEC)
• Parallel Ethernet interfaces
– Up to two RGMII interfaces
– IEEE 1588 support
LS1043A
• Four SerDes lanes for high-speed peripheral interfaces
– Three PCI Express 2.0 controllers supporting x4
operation
– One Serial ATA (SATA 3.0) controller
– Up to four SGMII supporting 1000 Mbit/s
– Up to two SGMII supporting 2500 Mbit/s
– Up to one XFI (10 GbE) interface
– Up to one QSGMII
– Supports 1000Base-KX
• Additional peripheral interfaces
– One Quad Serial Peripheral Interface (QSPI)
controller, one Deserial Serial Peripheral Interface
(DSPI) controller
– Integrated Flash Controller (IFC) supporting NAND
and NOR flash with 28-bit addressing and 16-bit
data
– Three USB 3.0 controllers with integrated PHY
– Enhanced Secure Digital Host Controller (eSDHC)
supporting SD 3.0, eMMC 4.4, and eMMC 4.5
modes
– uQE supporting TDM/HDLC
– Four I2C controllers
– Two 16550 compliant DUARTs and six low-power
UARTs (LPUARTs)
– General Purpose IO (GPIO), eight Flextimers, five
Watchdog timer, four independent PWM/counters/
timer
– Trust Architecture
– Debug supporting run control, data acquisition,
high-speed trace, and performance/event monitoring
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
Table of Contents
1 Introduction.......................................................................................... 3
2 Pin assignments.................................................................................... 4
2.1
2.2
2.3
2.4
621 ball layout diagrams........................................................... 4
Pinout list (21x21)..................................................................... 10
780 ball layout diagrams........................................................... 48
Pinout list...................................................................................54
3.17 Flextimer interface.....................................................................182
3.18 SPI interface.............................................................................. 185
3.19 QuadSPI interface......................................................................187
3.20 Enhanced secure digital host controller (eSDHC).....................189
3.21 JTAG controller.........................................................................198
3.22 I2C interface.............................................................................. 201
3.23 GPIO interface...........................................................................204
3.24 GIC interface............................................................................. 208
3.25 High-speed serial interfaces (HSSI).......................................... 210
4 Hardware design considerations...........................................................232
4.1
4.2
System clocking........................................................................ 233
Connection recommendations................................................... 242
3 Electrical characteristics.......................................................................96
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
Overall DC electrical characteristics......................................... 96
Power sequencing......................................................................104
Power down requirements......................................................... 106
Power characteristics................................................................. 107
Low power mode saving estimation..........................................110
I/O power dissipation................................................................ 111
Power-on ramp rate................................................................... 113
Input clocks............................................................................... 113
RESET initialization..................................................................120
5 Thermal................................................................................................ 247
5.1
5.2
5.3
Recommended thermal model...................................................249
Temperature diode.....................................................................249
Thermal management information............................................ 249
3.10 DDR4 and DDR3L SDRAM controller.................................... 121
3.11 Ethernet interface, Ethernet management interface, IEEE Std
1588........................................................................................... 128
3.12 QUICC engine specifications.................................................... 153
3.13 USB 3.0 interface...................................................................... 158
3.14 Integrated Flash Controller........................................................162
3.15 LPUART interface.....................................................................179
3.16 DUART interface...................................................................... 181
6 Package information.............................................................................252
6.1
6.2
Package parameters for the FC-PBGA......................................252
Mechanical dimensions of the FC-PBGA................................. 252
7 Security fuse processor.........................................................................255
8 Ordering information............................................................................255
8.1
8.2
Part numbering nomenclature....................................................255
Part marking ............................................................................. 256
9 Revision history....................................................................................257
QorIQ LS1043A, LS1023A Data Sheet, Rev. 2, 01/2017
2
NXP Semiconductors
Introduction
1 Introduction
LS1043A is a cost-effective, power-efficient, and highly integrated system-on-chip (SoC)
design that extends the reach of the NXP value-performance line of QorIQ
communications processors. Featuring extremely power-efficient 64-bit ARM®
Cortex®-A53 cores with ECC-protected L1 and L2 cache memories for high reliability,
running up to 1.6 GHz.
This chip can be used for networking and wireless access points, industrial gateways,
industrial automation, M2M for enterprise, consumer networking and router applications.
This figure shown below represents the block diagram of the LS1043A chip.
ARM
®
ARM Cortex-
Cortex
®
-A53
ARM Cortex-
64-bit Core
A53 64b Cores
A53 ARMCores
64b Cortex-
A53 64b Cores
ARM Cortex-
32 KB
32 KB
D-Cache
32 KB
32 KB
A53 64b32 KB
Cores
I-Cache
32 KB
I-Cache
D-Cache
I-Cache
D-Cache
32 KB
32 KB
I-Cache
D-Cache
1 MB L2 - Cache
32-bit
DDR3L/4
Memory Controller
Secure Boot
Trust Zone
Power Management
IFC, QuadSPI, SPI
SD/SDIO/eMMC
DMA
2x DUART
4x I2C, 4x GPIO
8x FlexTimer
3x USB3.0 w/PHY
6x LPUART
DPAA Hardware
4-Lane, 10 GHz SerDes
Buffer
Manager
1G
1G
1G
1G
1G
1/2.5G
Security
Engine
(SEC)
CCI-400™ Coherency Fabric
SMMUs
Real Time Debug
PCI Express 2.0
PCI Express 2.0
PCI Express 2.0
QUICC Engine
Queue
Manager
Frame Manager
SATA 3.0
Parse, classify,
distribute
Watchpoint
Cross
Trigger
Perf
Monitor
Trace
1/2.5/10G
Core Complex
Accelerators and Memory Control
Basic Peripherals, Interconnect and Debug
Networking Elements
Figure 1. LS1043A Block Diagram
QorIQ LS1043A, LS1023A Data Sheet, Rev. 2, 01/2017
NXP Semiconductors
3
Pin assignments
This figure shown below represents the block diagram of the LS1023A chip.
ARM®
ARM Cortex-
Cortex®-A53
ARM Cortex-
64-bit Core
A53 64b Cores
A53 ARMCores
64b Cortex-
A53 64b Cores
ARM Cortex-
32 KB
32 KB
32 KB
D-Cache
32 KB
32 KB
A53 64b32 KB
Cores
I-Cache
KB
32 KB
32
I-Cache
D-Cache
I-Cache
D-Cache
I-Cache
D-Cache
1 MB L2 - Cache
32-bit
DDR3L/4
Memory Controller
Secure Boot
Trust Zone
Power Management
IFC, QuadSPI, SPI
PCI Express 2.0
PCI Express 2.0
PCI Express 2.0
SD/SDIO/eMMC
DMA
2x DUART
4x I2C, 4x GPIO
8x FlexTimer
3x USB3.0 w/PHY
6x LPUART
DPAA Hardware
4-Lane 10 GHz SerDes
Buffer
Manager
1G
1G
1G
1G
1G
1/2.5G
Security
Engine
(SEC)
CCI-400™ Coherency Fabric
SMMUs
Real Time Debug
QUICC Engine
Queue
Manager
Frame Manager
SATA 3.0
Parse, classify,
distribute
Watchpoint
Cross
Trigger
Perf
Monitor
Trace
1/2.5/10G
Core Complex
Accelerators and Memory Control
Basic Peripherals, Interconnect and Debug
Networking Elements
Figure 2. LS1023A Block Diagram
2 Pin assignments
This section describes the ball map diagram and pin list table for both 21x21 and 23x23
packages of LS1043A.
2.1 621 ball layout diagrams
This figure shows the complete view of the LS1043A ball map diagram for the 21x21
package.
Figure 4, Figure 5, Figure 6,
and
Figure 7
show quadrant views.
QorIQ LS1043A, LS1023A Data Sheet, Rev. 2, 01/2017
4
NXP Semiconductors
Pin assignments
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
1
2
3
4
5
6
IFC
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
A
B
C
D
E
SEE DETAIL A
SEE DETAIL B
F
G
H
J
K
L
M
N
P
R
T
U
SEE DETAIL C
SEE DETAIL D
V
W
Y
AA
AB
AC
AD
AE
7
8
9
10
11
12
13
14
15
eSPI
16
17
18
19
20
21
22
23
24
25
DDR Interface 1
DUART
eSDHC
Interrupts
Battery Backed Trust
Trust
System Control
ASLEEP
SYSCLK
DDR Clocking
RTC
Debug
DFT
JTAG
Analog Signals
Serdes 1
USB3 PHY 1
USB3 PHY 2
USB PHY 3
Ethernet MI 1
Ethernet MI 2
Ethernet Cont. 1
Ethernet Cont. 2
I2C
USB
TA_BB_RTC
DIFF_SYSCLK
Power
Ground
No Connects
Figure 3. Complete BGA Map for the LS1043A
QorIQ LS1043A, LS1023A Data Sheet, Rev. 2, 01/2017
NXP Semiconductors
5
查看更多>
热门器件
热门资源推荐
器件捷径:
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ
需要登录后才可以下载。
登录取消