LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SUPER BRIGHT TOWER TYPE LED LAMPS
LSE11241
DATA SHEET
DOC. NO :
REV.
DATE
:
:
QW0905-LSE11241
A
16 - May - 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSE11241
Page 1/4
Package Dimensions
2.4
R1.7
3.3
1.8
3.0
1.6
1.5MAX
□
0.5
TYP
25.0MIN
1.0MIN
2.54TYP
Note : 1.All dimension are in millimeter tolerance is
±
0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0
°
-30
°
30
°
-60
°
60
°
100% 75% 50%
25%
0
25%
50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSE11241
Page 2/4
Absolute Maximum Ratings at Ta=25
℃
Ratings
Parameter
Symbol
SE
Forward Current
Peak Forward Current
Duty 1/10@10KHz
Power Dissipation
Reverse Current @5V
Operating Temperature
Storage Temperature
Soldering Temperature
I
F
I
FP
PD
Ir
T
opr
Tstg
Tsol
20
80
80
10
-40 ~ +85
-40 ~ +100
Max 260
℃
for 5 sec Max
(2mm from body)
mA
mA
mW
UNIT
μ
A
℃
℃
Typical Electrical & Optical Characteristics (Ta=25
℃
)
COLOR
PART NO
MATERIAL
Emitted
LSE11241
Forward
Peakt
Spectral
voltage
wave
halfwidth
length
△λ
nm
@20mA(V)
λ
Pnm
Luminous
intensity
@10mA(mcd)
Viewing
angle
2
θ
1/2
(deg)
Lens
Orange Transparent
Min. Max. Min.
610
45
1.7
2.6
12
Typ.
22
20
GaAsP/GaP
Orange
Note : 1.The forward voltage data did not including
±
0.1V testing tolerance.
2. The luminous intensity data did not including
±
15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSE11241
Page3/4
Typical Electro-Optical Characteristics Curve
SE CHIP
Fig.1 Forward current vs. Forward Voltage
1000
Fig.2 Relative Intensity vs. Forward Current
3.0
Forward Current(mA)
Relative Intensity
Normalize @20mA
1.0
2.0
3.0
4.0
5.0
100
2.5
2.0
1.5
1.0
0.5
0.0
1.0
10
100
1000
10
1.0
0.1
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA)
Fig.4 Relative Intensity vs. Temperature
3.0
Relative Intensity@20mA
Normalize @25
℃
Forward Voltage@20mA
Normalize @25
℃
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
100
Ambient Temperature(
℃
)
Ambient Temperature(
℃
)
Fig.5 Relative Intensity vs. Wavelength
1.0
Relative Intensity@20mA
0.5
0.0
550
600
650
700
750
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSE11241
Page 4/4
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
Reference
Standard
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
High Temperature
Storage Test
1.Ta=105
℃±
5
℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under ondition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40
℃±
5
℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
JIS C 7021: B-12
High Temperature
High Humidity Test
1.Ta=65
℃±
5
℃
2.RH=90 %~95%
3.t=240hrs
±
2hrs
The purpose of this test is the resistance
of the device under tropical for hous.
MIL-STD-202:103B
JIS C 7021: B-11
Thermal Shock Test
1.Ta=105
℃±
5
℃
&-40
℃±
5
℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260
℃±
5
℃
2.Dwell time= 10
±
1sec.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230
℃±
5
℃
2.Dwell time=5
±
1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
