型号
- 型号
- 关键词
High-Side Micropower MOSFET Driver
厂商名称：Linear ( ADI )
厂商官网：http://www.analog.com/cn/index.html
下载文档| 型号 | LTC1154CS8 | LTC1154CN8 | LTC1154C | LTC1154HS8#TRPBF | LTC1154CS8#TRPBF | LTC1154CN8#PBF | LTC1154CS8#PBF | P0402H2940DGTB |
|---|---|---|---|---|---|---|---|---|
| 描述 | High-Side Micropower MOSFET Driver | High-Side Micropower MOSFET Driver | High-Side Micropower MOSFET Driver | IC MOSFET DRIVER HIGH-SIDE 8SOIC | IC MOSFET DRIVER HIGH-SIDE 8SOIC | IC MOSFET DRIVER HIGH-SIDE 8-DIP | IC MOSFET DRIVER HIGH-SIDE 8SOIC | Fixed Resistor, Thin Film, 0.063W, 294ohm, 50V, 0.5% +/-Tol, 50ppm/Cel, Surface Mount, 0402, CHIP |
| Brand Name | Linear Technology | Linear Technology | - | Linear Technology | Linear Technology | Linear Technology | Linear Technology | - |
| 是否Rohs认证 | 不符合 | 不符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Linear ( ADI ) | Linear ( ADI ) | - | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | - |
| 零件包装代码 | SOIC | DIP | - | SOIC | SOIC | DIP | SOIC | - |
| 包装说明 | SOP, SOP8,.25 | DIP, DIP8,.3 | - | SOP, SOP8,.25 | SOP, SOP8,.25 | DIP, DIP8,.3 | SOP, SOP8,.25 | CHIP |
| 针数 | 8 | 8 | - | 8 | 8 | 8 | 8 | - |
| 制造商包装代码 | S8 | N | - | S8 | S8 | N | S8 | - |
| Reach Compliance Code | _compli | _compli | - | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 高边驱动器 | YES | YES | - | YES | YES | YES | YES | - |
| 接口集成电路类型 | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | - | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | - |
| JESD-30 代码 | R-PDSO-G8 | R-PDIP-T8 | - | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | - |
| JESD-609代码 | e0 | e0 | - | e3 | e3 | e3 | e3 | e4 |
| 湿度敏感等级 | 1 | 1 | - | 1 | 1 | 1 | 1 | - |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 | 1 | - |
| 端子数量 | 8 | 8 | - | 8 | 8 | 8 | 8 | 2 |
| 最高工作温度 | 70 °C | 70 °C | - | 150 °C | 70 °C | 70 °C | 70 °C | 155 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | SOP | DIP | - | SOP | SOP | DIP | SOP | - |
| 封装等效代码 | SOP8,.25 | DIP8,.3 | - | SOP8,.25 | SOP8,.25 | DIP8,.3 | SOP8,.25 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE | IN-LINE | - | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMT |
| 峰值回流温度（摄氏度） | 235 | NOT SPECIFIED | - | 260 | 260 | NOT SPECIFIED | 260 | - |
| 电源 | 4.5/18 V | 4.5/18 V | - | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | - |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 1.752 mm | 3.937 mm | - | 1.752 mm | 1.752 mm | 3.937 mm | 1.752 mm | - |
| 最大供电电压 | 18 V | 18 V | - | 18 V | 18 V | 18 V | 18 V | - |
| 最小供电电压 | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
| 标称供电电压 | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V | - |
| 表面贴装 | YES | NO | - | YES | YES | NO | YES | YES |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | THIN FILM |
| 温度等级 | COMMERCIAL | COMMERCIAL | - | AUTOMOTIVE | COMMERCIAL | COMMERCIAL | COMMERCIAL | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Gold (Au) - with Nickel (Ni) barrier |
| 端子形式 | GULL WING | THROUGH-HOLE | - | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | - |
| 端子节距 | 1.27 mm | 2.54 mm | - | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | - |
| 端子位置 | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | 20 | NOT SPECIFIED | - | 30 | 30 | NOT SPECIFIED | 30 | - |
| 断开时间 | 60 µs | 60 µs | - | 60 µs | 60 µs | 60 µs | 60 µs | - |
| 接通时间 | 1000 µs | 1000 µs | - | 1000 µs | 1000 µs | 1000 µs | 1000 µs | - |
| 宽度 | 3.899 mm | 7.62 mm | - | 3.899 mm | 3.899 mm | 7.62 mm | 3.899 mm | - |
stm32/stm8
测试/测量
传感器
编程基础
RF/无线
电路观察室