LX7205
TM
®
Integrated EMI Filter & ESD Protection For
Earpiece Speaker Ports
P
RODUCTION
D
ATA
S
HEET
DESCRIPTION
KEY FEATURES
Flip Chip construction
Bi-directional EMI/RFI low-pass
filter
ESD protection with integrated
line termination resistor
Bi-directional TVS protects
against negative ESD voltages
in audio applications
Low TVS operating voltage
(5.0V)
Low leakage current
0.5mm Pitch Chip Scale
Package designed for direct
assembly on FR4 PCB using
conventional assembly
techniques
APPLICATIONS
Proliferation of digital portable
electronic equipment has created a
noisy environment in which all
devices become susceptible to
Electromagnetic Interference (EMI).
Interference
form
cell
phone
frequencies of 800-900 MHz and
1.9GHz as well as the growing
wireless LAN frequencies of 2.4-
6GHz can couple into the speaker port
of a handheld device and adversely
affect its performance. FCC Part 15
sets maximum allowable emission and
immunity levels for all digital devices.
LX7205 is an integrated low pass
filter with ESD protection that filters
out the undesired frequencies as well as
protecting the port against both positive
and negative ESD voltages. The device
is a 3x2 array flip chip and measures
1.5 x 1.0 x 0.65 mm. The small size
and profile of this device is ideally
suited for portable applications. The
absence of leadframe and bondwires
minimizes inductance and optimizes the
high frequency filter performance.
LX7205 exceeds the requirements of
IEC61000-4-2 (15KV air discharge and
8KV contact discharge).
WWW .
Microsemi
.C
OM
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
BENEFITS
Filter response characterized up to 6 GHz
<2dB insertion loss in the pass band
>20dB attenuation in the 800-900 MHz range
>12dB attenuation in the WLAN frequencies of 2.4GHz and 5.0-6.0 GHz
Cell phones and Accessories
Personal Digital Assistants
(PDA’s)
Pagers
MP3 Players
Desktops and Notebook
Computers
Digital Camcorders
PRODUCT HIGHLIGHT
Device Schematic
A1
10
Ω
B1
Earpiece 1
Input
C
C
Earpiece 1
Output
B
GND
A2, B2
A3
10
Ω
B3
A
1
2
3
LX7205 Bumps up (Not to Scale)
Earpiece 2
Input
C
C
Earpiece 2
Output
LX7205
LX7205
GND
A2, B2
PACKAGE ORDER INFO
T
J
(°C)
-40 to 125
SP
0.5mm Pitch Chip Scale
Package (CSP)
LX7205ISP
Note: Available in Tape & Reel. Append the letters “TR” to the part
number. (i.e. LX7205ISP-TR)
Copyright
©
2004
Rev. 1.0, 2004-10-05
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1
LX7205
TM
®
Integrated EMI Filter & ESD Protection For
Earpiece Speaker Ports
P
RODUCTION
D
ATA
S
HEET
ABSOLUTE MAXIMUM RATINGS
PACKAGE PIN OUT
WWW .
Microsemi
.C
OM
Peak Pulse Power (tp = 8/20 µs ) IEC61000-4-5 .......................................... 250W
Peak Pulse Current (tp = 8/20 µs ) IEC61000-4-5 ...........................................26A
ESD Air Discharge per IEC61000-4-2 ......................................................... 30KV
ESD Contact Discharge per IEC61000-4-2 .................................................. 30KV
Operating Temperature ................................................................-40°C to +125°C
Storage Temperature Range.........................................................-55°C to +150°C
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
SP P
ACKAGE
(Bump Up Angle)
FUNCTIONAL PIN DESCRIPTION
Name
A1
B1
A2 & B2
A3
B3
Line 1 Input
Line 1 Output
Ground
Line 2 Input
Line 2 Output
Description
ELECTRICAL CHARACTERISTICS
Unless otherwise specified, the following specifications apply over the operating ambient temperature -40°C
≤
T
A
where otherwise noted and the following test conditions:.
Parameter
Stand-Off Voltage
Breakdown Voltage
Leakage Current
Series Resistance, A1 to B1
Series Resistance, A3 to B3
Temperature Coefficient of RS
Capacitor, A1 or B1 to GND
Capacitor, A3 or B3 to GND
Symbol
V
RWM
V
BR
I
R
R
S
R
S
T
COEFF
C
C
Test Conditions
I
R
= 1mA
VRWM = ±5.0V, TA = 25°C
Each Line
V
R
= 2.5V, f = 1MHz
V
R
= 2.5V, f = 1MHz
≤
+125°C except
Min
6
-1
9
9
115
115
LX7205
Typ
Max
5.0
1
11
11
175
175
Units
V
V
µA
Ω
Ω
Ppm
pF
pF
10
10
200
145
145
P
ACKAGE
D
ATA
P
ACKAGE
D
ATA
Copyright
©
2004
Rev. 1.0, 2004-10-05
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
LX7205
TM
®
Integrated EMI Filter & ESD Protection For
Earpiece Speaker Ports
P
RODUCTION
D
ATA
S
HEET
RECOMMENDED PCB PARAMETERS
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Microsemi
.C
OM
Parameter
Cu pad size
Pad Pitch
Pad Definition
Solder Mask Opening
Solder Stencil
Pad Protective Finish
0.275 +0.0/-0.025 mm
0.5mm
Value
Non-Solder Mask Defined
0.325 ± 0.025 mm
0.25 x 0.25 mm square,
0.125 mm thick, laser cut, electro-polished
OSP (Organic Surface Preservative)
Non-Solder Mask Defined Cu
Pad (OSP finish)
0.275 mm dia.
Solder Mask Opening
0.325 mm dia.
Figure 1 –
Recommended Non-Solder Mask Defined Pad
240
o
C max
Temperature (
o
C)
183
o
C
150
o
C
A
PPLICATIONS
A
PPLICATIONS
Preheat Zone
Flux Activation
Zone
Solder Reflow
Zone
Cooling Zone
~ 1min
~2 min
~ 1min
Time (s)
Figure 2 –
Solder Reflow Profile. Max Temperature is 240°C and maximum time above liquious (183°C) is 60 seconds
Copyright
©
2004
Rev. 1.0, 2004-10-05
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 3
LX7205
TM
®
Integrated EMI Filter & ESD Protection For
Earpiece Speaker Ports
P
RODUCTION
D
ATA
S
HEET
TEK Preview Single Seq
8KV Contact ESD
0 Acqs
TEK Stopped Single Seq
1Acqs
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Microsemi
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OM
5.0V
M 40.0ns
Chart 1 –
8KV ESD Input pulse as per IEC61000-4-2. Vertical scale
is equivalent to 5A/DIV
Ch1 5.0V
M 40.0ns
Chart 2 –
Clamping Characteristics when device subjected to an 8KV
ESD pulse.
S21
0 dB
log 5dB/
REF 0dB
Clamping Voltage V
C
(V)
12
10
8
6
Line To GND
Insertion Loss
-10 dB
4
2
0
5
10
GND t o Line
-20 dB
15
20
25
30
-30 dB
P e a k P uls e C urre nt _ I
P P
( A )
-40 dB
1
10
1000
6000
Chart 4 –
Clamping Voltage vs. Peak Pulse Current.
Waveform parameters: Tr = 8µs, td = 20µs. Per
IEC61000-4-5
0.3
100
C
HARTS
C
HARTS
Frequency (MHz)
Chart 3 –
Typical frequency response curve of the EMI filter
(A1 – B1 or A3 – B3)
Copyright
©
2004
Rev. 1.0, 2004-10-05
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 4
LX7205
TM
®
Integrated EMI Filter & ESD Protection For
Earpiece Speaker Ports
P
RODUCTION
D
ATA
S
HEET
PACKAGE DIMENSIONS & MARKING
WWW .
Microsemi
.C
OM
SP
0.5mm Chip Scale Package
1.5mm
0.5mm
Pin A1 Identification Mark
0.25mm dia. 63/37 Sn/Pb
Eutectic Solder Bumps
B
0.5mm
1.0 mm
05
YWWA
Y = Year | WW = Work Week | A = Lot Code
SP Package – Bump Side Down
A
1
2
3
Bumps Up View
YWWA
Copyright
©
2004
Rev. 1.0, 2004-10-05
YWWA
YWWA
05
Part Orientation in Tape
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
05
05
M
ECHANICALS
M
ECHANICALS
Page 5
