Elastic Buffer, CMOS, PDIP16, PLASTIC, DIP-16
厂商名称:Intel(英特尔)
厂商官网:http://www.intel.com/
下载文档型号 | LXP2175NC | LXP2175NE | LXP2175SC | LXP2175SE |
---|---|---|---|---|
描述 | Elastic Buffer, CMOS, PDIP16, PLASTIC, DIP-16 | Elastic Buffer, CMOS, PDIP16, PLASTIC, DIP-16 | Elastic Buffer, CMOS, PDSO16, PLASTIC, SOP-16 | Elastic Buffer, CMOS, PDSO16, PLASTIC, SOP-16 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) |
零件包装代码 | DIP | DIP | SOIC | SOIC |
包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.3 | SOP, SOP16,.4 |
针数 | 16 | 16 | 16 | 16 |
Reach Compliance Code | compliant | compliant | compliant | compliant |
JESD-30 代码 | R-PDIP-T16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 |
JESD-609代码 | e0 | e0 | e0 | e0 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 |
最高工作温度 | 70 °C | 85 °C | 70 °C | 85 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | SOP | SOP |
封装等效代码 | DIP16,.3 | DIP16,.3 | SOP16,.3 | SOP16,.4 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.84 mm | 5.84 mm | 2.65 mm | 2.65 mm |
标称供电电压 | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
电信集成电路类型 | ELASTIC BUFFER | ELASTIC BUFFER | ELASTIC BUFFER | ELASTIC BUFFER |
温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 7.62 mm | 7.62 mm | 7.5 mm | 7.5 mm |
Base Number Matches | - | 1 | 1 | 1 |