描述 |
Support Circuit, 1-Func, PDSO16, QSOP-16 |
Support Circuit, 1-Func, PDSO16, ROHS COMPLIANT, QSOP-16 |
Support Circuit, 1-Func, PDSO16, QSOP-16 |
Support Circuit, 1-Func, PDSO16, ROHS COMPLIANT, QSOP-16 |
是否无铅 |
含铅 |
不含铅 |
含铅 |
不含铅 |
是否Rohs认证 |
不符合 |
符合 |
不符合 |
符合 |
零件包装代码 |
SOIC |
SOIC |
SOIC |
SOIC |
包装说明 |
LSSOP, |
LSSOP, SSOP16,.25 |
LSSOP, |
LSSOP, SSOP16,.25 |
针数 |
16 |
16 |
16 |
16 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
JESD-30 代码 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
JESD-609代码 |
e0 |
e3 |
e0 |
e3 |
长度 |
4.95 mm |
4.95 mm |
4.95 mm |
4.95 mm |
功能数量 |
1 |
1 |
1 |
1 |
端子数量 |
16 |
16 |
16 |
16 |
最高工作温度 |
85 °C |
85 °C |
85 °C |
85 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
LSSOP |
LSSOP |
LSSOP |
LSSOP |
封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
封装形式 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) |
NOT SPECIFIED |
250 |
NOT SPECIFIED |
250 |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
1.6 mm |
1.6 mm |
1.6 mm |
1.6 mm |
标称供电电压 |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
表面贴装 |
YES |
YES |
YES |
YES |
电信集成电路类型 |
ATM/SONET/SDH SUPPORT CIRCUIT |
ATM/SONET/SDH SUPPORT CIRCUIT |
ATM/SONET/SDH SUPPORT CIRCUIT |
ATM/SONET/SDH SUPPORT CIRCUIT |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
端子面层 |
TIN LEAD |
MATTE TIN |
TIN LEAD |
MATTE TIN |
端子形式 |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
端子节距 |
0.635 mm |
0.635 mm |
0.635 mm |
0.635 mm |
端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
40 |
NOT SPECIFIED |
40 |
宽度 |
3.9 mm |
3.9 mm |
3.9 mm |
3.9 mm |