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M1A3P1000-FFG256FG256

FPGA, 1000000 GATES, PBGA256, 1 MM PITCH, FBGA-256

器件类别:可编程逻辑器件    可编程逻辑   

厂商名称:Microsemi

厂商官网:https://www.microsemi.com

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器件参数
参数名称
属性值
厂商名称
Microsemi
包装说明
BGA,
Reach Compliance Code
unknown
JESD-30 代码
S-PBGA-B256
长度
17 mm
等效关口数量
1000000
端子数量
256
最高工作温度
70 °C
最低工作温度
组织
1000000 GATES
封装主体材料
PLASTIC/EPOXY
封装代码
BGA
封装形状
SQUARE
封装形式
GRID ARRAY
可编程逻辑类型
FIELD PROGRAMMABLE GATE ARRAY
认证状态
Not Qualified
最大供电电压
1.575 V
最小供电电压
1.425 V
标称供电电压
1.5 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
宽度
17 mm
文档预览
ProASIC
®
3 Handbook
ProASIC3 Handbook
Table of Contents
Low-Power Flash Device Handbooks Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i
Section I – ProASIC3 Datasheet
ProASIC3 Flash Family FPGAs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
ProASIC3 Device Family Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1
ProASIC3 DC and Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-1
Package Pin Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-1
Section II – Core Architecture
Low-Power Flash Technology and Flash*Freeze Mode
Core Architecture of IGLOO and ProASIC3 Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1
Low-Power Modes in Actel ProASIC3/E FPGAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-1
Global Resources and Clock Conditioning
Global Resources in Actel Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-1
Clock Conditioning Circuits in IGLOO and ProASIC3 Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-1
Embedded Memories
FlashROM in Actel’s Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-1
SRAM and FIFO Memories in Actel's Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-1
I/O Descriptions and Usage
I/O Structures in IGLOO and ProASIC3 Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-1
I/O Software Control in Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-1
DDR for Actel’s Low-Power Flash Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9-1
Packaging and Pin Descriptions
Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-1
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11-1
Design Migration
Migrating Designs in ProASIC3 Devices from Higher-Density to Mid-Density Devices . . . . . . . . . . .12-1
Migrating Designs from A3P250 to Lower-Logic-Density Devices . . . . . . . . . . . . . . . . . . . . . . . . . . .13-1
Table of Contents
Programming and Security
Programming Flash Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14-1
Security in Low-Power Flash Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15-1
In-System Programming (ISP) of Actel’s Low-Power Flash Devices Using FlashPro3 . . . . . . . . . . . . .16-1
Microprocessor Programming of Actel’s Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . .17-1
Boundary Scan and UJTAG
Boundary Scan in Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18-1
UJTAG Applications in Actel’s Low-Power Flash Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19-1
Board-Level Requirements
Power-Up/-Down Behavior of ProASIC3/E Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20-1
ProASIC3/E SSO and Pin Placement Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21-1
Metastability Characterization Report for Actel Flash FPGAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22-1
Low-Power Flash Device Handbooks Introduction
Low-Power Flash Device Handbooks Introduction
Device Handbooks contain all the information available to help designers understand and use
Actel's devices. Handbook chapters are grouped into sections on the website to simplify
navigation. Each chapter of the handbook can be viewed as an individual PDF file.
At the top of the handbook web page, you will see a zip file for each product family. This file
contains the complete device handbook. Please register for product updates to be notified when a
section of the handbook changes.
Versions
Device handbook chapters may have different version numbers. Actel’s goal is to provide customers
with the latest information in a timely matter. As a result, the handbook chapters will be updated
independently of the handbook.
Categories
In order to provide the latest information to designers, some datasheets are published before data
has been fully characterized. Datasheets are designated as “Product Brief,” “Advanced,” and
“Production”. The definition of these categories are as follows:
Product Brief
The product brief is a summarized version of a datasheet (advanced or production) and contains
general product information. This document gives an overview of specific device and family
information.
Advanced
This version contains initial estimated information based on simulation, other products, devices, or
speed grades. This information can be used as estimates, but not for production. This label only
applies to the DC and Switching Characteristics chapter of the datasheet and will only be used
when the data has not been fully characterized.
Unmarked (production)
This version contains information that is considered to be final.
Export Administration Regulations (EAR)
The products described in this document are subject to the Export Administration Regulations
(EAR). They could require an approved export license prior to export from the United States. An
export includes release of product or disclosure of technology to a foreign national inside or
outside the United States.
Part Number and Revision Date
Part Number 51700094-001-0
Revised January 2008
v1.0
i
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