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v1.4

IGLOO Low-Power Flash FPGAs

with Flash*Freeze Technology

Features and Benefits

Low Power

•

1.2 V to 1.5 V Core Voltage Support for Low Power

Supports Single-Voltage System Operation

5 µW Power Consumption in Flash*Freeze Mode

Low-Power Active FPGA Operation

Flash*Freeze Technology Enables Ultra-Low Power

Consumption while Maintaining FPGA Content

• Easy Entry to / Exit from Ultra-Low-Power Flash*Freeze Mode

High Capacity

• 15 k to 1 Million System Gates

• Up to 144 kbits of True Dual-Port SRAM

• Up to 300 User I/Os

Reprogrammable Flash Technology

•

130-nm, 7-Layer Metal, Flash-Based CMOS Process

Live-at-Power-Up (LAPU) Level 0 Support

Single-Chip Solution

Retains Programmed Design When Powered Off

Clock Conditioning Circuit (CCC) and PLL

• Bank-Selectable I/O Voltages—up to 4 Banks per Chip

• Single-Ended

I/O

Standards:

LVTTL,

LVCMOS

3.3 V / 2.5 V / 1.8 V / 1.5 V / 1.2 V, 3.3 V PCI / 3.3 V PCI-X

†

, and

LVCMOS 2.5 V / 5.0 V Input

†

• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M-

LVDS (AGL250 and above)

• Wide Range Power Supply Voltage Support per JESD8-B,

Allowing I/Os to Operate from 2.7 V to 3.6 V

• Wide Range Power Supply Voltage Support per JESD8-12,

Allowing I/Os to Operate from 1.14 V to 1.575 V

• I/O Registers on Input, Output, and Enable Paths

• Hot-Swappable and Cold-Sparing I/Os

‡

• Programmable Output Slew Rate

†

and Drive Strength

• Weak Pull-Up/-Down

• IEEE 1149.1 (JTAG) Boundary Scan Test

• Pin-Compatible Packages across the IGLOO Family

†

• Six CCC Blocks, One with an Integrated PLL

• Configurable

Phase

Shift, Multiply/Divide,

Delay

Capabilities, and External Feedback

• Wide Input Frequency Range (1.5 MHz up to 250 MHz)

In-System Programming (ISP) and Security

• Secure ISP Using On-Chip 128-Bit Advanced Encryption

Standard (AES) Decryption (except ARM

-enabled IGLOO

devices) via JTAG (IEEE 1532–compliant)

†

• FlashLock

to Secure FPGA Contents

Embedded Memory

• 1 kbit of FlashROM User Nonvolatile Memory

†

• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM

Blocks (×1, ×2, ×4, ×9, and ×18 organizations)

†

• True Dual-Port SRAM (except ×18)

High-Performance Routing Hierarchy

• Segmented, Hierarchical Routing and Clock Structure

Advanced I/O

• 700 Mbps DDR, LVDS-Capable I/Os (AGL250 and above)

• 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

ARM Processor Support in IGLOO FPGAs

• M1 IGLOO Devices—Cortex™-M1 Soft Processor Available

with or without Debug

AGL125

125 k

1,024

3,072

Yes

133

CS196

QN132

VQ100

FG144

AGL250

AGL400

AGL600

AGL1000

M1AGL250 M1AGL400 M1AGL600 M1AGL1000

250 k

400 k

600 k

2,048

–

6,144

9,216

13,824

24,576

108

144

Yes

143

194

235

300

CS196

QN132

4,5

VQ100

FG144

CS196

CS281

IGLOO Product Family

IGLOO Devices

ARM-Enabled IGLOO Devices

System Gates

Typical Equivalent Macrocells

VersaTiles (D-flip-flops)

Flash*Freeze Mode (typical, µW)

RAM kbits (1,024 bits)

4,608-Bit Blocks

FlashROM Bits

Secure (AES) ISP

Integrated PLL in CCCs

VersaNet Globals

I/O Banks

Maximum User I/Os

Package Pins

UC/CS

QFN

VQFP

FBGA

AGL015

15 k

128

384

–

QN68

AGL030

30 k

256

768

–

UC81/CS81

QN48, QN68,

QN132

VQ100

AGL060

60 k

512

1,536

Yes

CS121

QN132

VQ100

FG144

FG144,

FG256,

FG484

FG144,

FG256,

FG484

FG144,

FG256,

FG484

Notes:

1. AES is not available for ARM-enabled IGLOO devices.

AGL060 in CS121 does not support the PLL.

Six chip (main) and twelve quadrant global networks are available for AGL060 and above.

The M1AGL250 device does not support this package.

Device/package support TBD

The

IGLOOe

handbook provides information on higher densities and additional features.

‡ Supported only by AGL015 and AGL030 devices.

† AGL015 and AGL030 devices do not support this feature.

February 2009

IGLOO Low-Power Flash FPGAs

I/Os Per Package

IGLOO Devices

ARM-Enabled

IGLOO Devices

AGL015

AGL030

AGL060

AGL125

AGL250

M1AGL250

I/O Type

Differential I/O Pairs

–

FG484

23 × 23

529

1.0

2.23

Single-Ended I/O

–

177

215

300

FG256

17 × 17

289

1.0

1.60

AGL400

M1AGL400

AGL600

M1AGL600

AGL1000

M1AGL1000

Single-Ended I/O

Package

QN48

QN68

UC81

CS81

CS121

VQ100

QN132

CS196

FG144

FG256

CS281

FG484

Notes:

–

Single-Ended I/O

–

133

–

143

–

143

178

–

194

–

177

215

235

–

1. When considering migrating your design to a lower- or higher-density device, refer to the

IGLOO Low-Power Flash FPGAs

handbook to ensure compliance with design and board migration requirements.

2. Each used differential I/O pair reduces the number of single-ended I/Os available by two.

3. The M1AGL250 device does not support QN132 or CS196 packages. Refer to the

IGLOO Low-Power Flash FPGAs

handbook for position assignments of the 15 LVPECL pairs.

4. FG256 and FG484 are footprint-compatible packages.

5. When the Flash*Freeze pin is used to directly enable Flash*Freeze mode and not used as a regular I/O, the number of

single-ended user I/Os available is reduced by one.

6. "G" indicates RoHS-compliant packages. Refer to

"IGLOO Ordering Information" on page III

for the location of the

"G" in the part number.

7. Device/package support TBD.

IGLOO FPGAs Package Sizes Dimensions

Package

Length

(mm\mm)

Nominal Area

(mm

)

Pitch (mm)

Height (mm)

UC81

Width

4 × 4

0.4

0.80

CS81

0.5

0.80

CS121

6×6

0.5

0.99

QN68

8×8

0.4

0.90

QN132

8×8

0.5

0.75

CS196

8×8

0.5

1.20

CS281

10 × 10

100

0.5

1.05

FG144

13 × 13

169

1.0

1.45

VQ100

14 × 14

196

0.5

1.00

v1.4

IGLOO Low-Power Flash FPGAs

IGLOO Ordering Information

AGL1000

144

Application (Temperature Range)

Blank =

Commercial

(0°C to +70°C Ambient Temperature)

I = Industrial (

–

40°C to +85°C Ambient Temperature)

PP = Pre-Production

ES = Engineering

Sample

(Room Temperature Only)

Package Lead

Count

Lead-Free Packaging

Blank =

Standard

Packaging

RoHS-Compliant Packaging

Package Type

UC = Micro

Chip Scale

Package (0.4 mm pitch)

Chip Scale

Package (0.4 mm and 0.5 mm pitches)

QN = Quad Flat Pack No Leads (0.4 mm and 0.5 mm pitch)

VQ = Very Thin Quad Flat Pack (0.5 mm pitch)

FG = Fine Pitch Ball

Grid

Array (1.0 mm pitch)

Speed Grade

F = 20%

Slower

than

Standard*

Blank =

Standard

Supply

Voltage

2 = 1.2 V to 1.5 V

5 = 1.5 V only

Part Number

IGLOO Devices

AGL015 = 15,000

System Gates

AGL030 = 30,000

System Gates

AGL060 =

60,000 System Gates

AGL125 = 125,000

System Gates

AGL250 = 250,000

System Gates

AGL400 = 400,000

System Gates

AGL600 =

600,000 System Gates

AGL1000 = 1,000,000

System Gates

IGLOO Devices with Cortex-M1

M1AGL250 =

M1AGL400 =

M1AGL600 =

M1AGL1000=

250,000

System Gates

400,000

System Gates

600,000 System Gates

1,000,000

System Gates

Notes:

1. Marking Information: IGLOO V2 devices do not have V2 marking, but IGLOO V5 devices are marked accordingly.

2. The DC and switching characteristics for the –F speed grade targets are based only on simulation.

The characteristics provided for the –F speed grade are subject to change after establishing FPGA specifications. Some

restrictions might be added and will be reflected in future revisions of this document. The –F speed grade is only

supported in the commercial temperature range.

v1.4

III

IGLOO Low-Power Flash FPGAs

Temperature Grade Offerings

AGL015

Package

QN48

QN68

UC81

CS81

CS121

VQ100

QN132

CS196

FG144

FG256

CS281

FG484

Notes:

1. C = Commercial temperature range: 0°C to 70°C ambient temperature.

AGL030

AGL060

AGL125

AGL250

AGL400

AGL600

AGL1000

M1AGL250

M1AGL400

–

C, I

–

C, I

–

C, I

–

C, I

–

C, I

–

C, I

–

C, I

–

C, I

–

M1AGL600 M1AGL1000

–

C, I

–

C, I

–

C, I

–

C, I

2. I = Industrial temperature range: –40°C to 85°C ambient temperature.

3. Device/package support TBD.

4. The M1AGL250 device does not support FG256 or QN132 packages.

Speed Grade and Temperature Grade Matrix

Temperature Grade

–F

Std.

✓

–

✓

Notes:

1. The characteristics provided for the –F speed grade are subject to change after establishing FPGA specifications. Some

restrictions might be added and will be reflected in future revisions of this document. The –F speed grade is only supported in

the commercial temperature range.

2. C = Commercial temperature range: 0°C to 70°C ambient temperature.

3. I = Industrial temperature range: –40°C to 85°C ambient temperature.

References made to IGLOO devices also apply to ARM-enabled IGLOOe devices. The ARM-enabled part numbers start with

M1 (Cortex-M1).

Contact your local Actel representative for device availability:

http://www.actel.com/contact/default.aspx.

AGL015 and AGL030

The AGL015 and AGL030 are architecturally compatible; there are no RAM or PLL features.

v1.4

1 – IGLOO Device Family Overview

General Description

The IGLOO family of flash FPGAs, based on a 130-nm flash process, offers the lowest power FPGA, a

single-chip solution, small footprint packages, reprogrammability, and an abundance of advanced

features.

The Flash*Freeze technology used in IGLOO devices enables entering and exiting an ultra-low-

power mode that consumes as little as 5 µW while retaining SRAM and register data. Flash*Freeze

technology simplifies power management through I/O and clock management with rapid recovery

to operation mode.

The Low Power Active capability (static idle) allows for ultra-low-power consumption (from 12 µW)

while the IGLOO device is completely functional in the system. This allows the IGLOO device to

control system power management based on external inputs (e.g., scanning for keyboard stimulus)

while consuming minimal power.

Nonvolatile flash technology gives IGLOO devices the advantage of being a secure, low power,

single-chip solution that is live at power-up (LAPU). IGLOO is reprogrammable and offers time-to-

market benefits at an ASIC-level unit cost.

These features enable designers to create high-density systems using existing ASIC or FPGA design

flows and tools.

IGLOO devices offer 1 kbit of on-chip, reprogrammable, nonvolatile FlashROM storage as well as

clock conditioning circuitry based on an integrated phase-locked loop (PLL). The AGL015 and

AGL030 devices have no PLL or RAM support. IGLOO devices have up to 1 million system gates,

supported with up to 144 kbits of true dual-port SRAM and up to 300 user I/Os.

M1 IGLOO devices support the high-performance, 32-bit Cortex-M1 processor developed by ARM

for implementation in FPGAs. Cortex-M1 is a soft processor that is fully implemented in the FPGA

fabric. It has a three-stage pipeline that offers a good balance between low-power consumption

and speed when implemented in an M1 IGLOO device. The processor runs the ARMv6-M instruction

set, has a configurable nested interrupt controller, and can be implemented with or without the

debug block. Cortex-M1 is available for free from Actel for use in M1 IGLOO FPGAs.

The ARM-enabled devices have Actel ordering numbers that begin with M1AGL and do not support

AES decryption.

Flash*Freeze Technology

The IGLOO device offers unique Flash*Freeze technology, allowing the device to enter and exit

ultra-low-power Flash*Freeze mode. IGLOO devices do not need additional components to turn off

I/Os or clocks while retaining the design information, SRAM content, and registers. Flash*Freeze

technology is combined with in-system programmability, which enables users to quickly and easily

upgrade and update their designs in the final stages of manufacturing or in the field. The ability of

IGLOO V2 devices to support a wide range of core voltage (1.2 V to 1.5 V) allows further reduction

in power consumption, thus achieving the lowest total system power.

When the IGLOO device enters Flash*Freeze mode, the device automatically shuts off the clocks

and inputs to the FPGA core; when the device exits Flash*Freeze mode, all activity resumes and

data is retained.

The availability of low-power modes, combined with reprogrammability, a single-chip and single-

voltage solution, and availability of small-footprint, high pin-count packages, make IGLOO devices

the best fit for portable electronics.

v1.4

1-1