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M24C02-W1BN6T

256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8

器件类别:存储   

厂商名称:ST(意法半导体)

厂商官网:http://www.st.com/

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器件参数
参数名称
属性值
功能数量
1
端子数量
8
最大工作温度
85 Cel
最小工作温度
-40 Cel
最大供电/工作电压
5.5 V
最小供电/工作电压
4.5 V
额定供电电压
5 V
最大时钟频率
0.4000 MHz
加工封装描述
0.150 INCH, 塑料, SO-8
状态
DISCONTINUED
工艺
CMOS
包装形状
矩形的
包装尺寸
SMALL OUTLINE
表面贴装
Yes
端子形式
GULL WING
端子间距
1.27 mm
端子涂层
锡 铅
端子位置
包装材料
塑料/环氧树脂
温度等级
INDUSTRIAL
内存宽度
8
组织
256 × 8
存储密度
2048 deg
操作模式
同步
位数
256 words
位数
256
内存IC类型
I2C/2-线 串行 电可擦除只读存储器
串行并行
串行
写周期最大TWC
5 ms
文档预览
M24C16, M24C08
M24C04, M24C02, M24C01
16Kbit, 8Kbit, 4Kbit, 2Kbit and 1Kbit Serial I²C Bus EEPROM
FEATURES SUMMARY
Two-Wire I²C Serial Interface
Supports 400kHz Protocol
Single Supply Voltage:
– 2.5 to 5.5V for M24Cxx-W
– 1.8 to 5.5V for M24Cxx-R
Write Control Input
BYTE and PAGE WRITE (up to 16 Bytes)
RANDOM and SEQUENTIAL READ Modes
Self-Timed Programming Cycle
Automatic Address Incrementing
Enhanced ESD/Latch-Up Protection
More than 1 Million Erase/Write Cycles
More than 40-Year Data Retention
Packages
– ECOPACK® (RoHS compliant)
Figure 1. Packages
8
1
PDIP8 (BN)
8
1
Table 1. Product List
Reference
M24C16
M24C16-R
M24C08-W
M24C08
M24C08-R
M24C04-W
M24C04
M24C04-R
M24C02-W
M24C02
M24C02-R
M24C01-W
M24C01
M24C01-R
Part Number
M24C16-W
SO8 (MN)
150 mil width
TSSOP8 (DW)
169 mil width
TSSOP8 (DS)
3x3mm² body size (MSOP)
UFDFPN8 (MB)
2x3mm² (MLP)
October 2005
1/25
M24C16, M24C08, M24C04, M24C02, M24C01
TABLE OF CONTENTS
FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SUMMARY DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Device internal reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
SIGNAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Chip Enable (E0, E1, E2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
DEVICE OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Start Condition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Stop Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Acknowledge Bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Data Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Memory Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Write Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Minimizing System Delays by Polling On ACK. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Read Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Sequential Read. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Acknowledge in Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
INITIAL DELIVERY STATE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
DC and AC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
2/25
M24C16, M24C08, M24C04, M24C02, M24C01
SUMMARY DESCRIPTION
These I²C-compatible electrically erasable pro-
grammable memory (EEPROM) devices are orga-
nized as 2048/1024/512/256/128 x 8 (M24C16,
M24C08, M24C04, M24C02 and M24C01).
In order to meet environmental requirements, ST
offers these devices in ECOPACK® packages.
ECOPACK® packages are Lead-free and RoHS
compliant.
ECOPACK is an ST trademark. ECOPACK speci-
fications are available at: www.st.com.
Figure 2. Logic Diagram
scribed in
Table 3.),
terminated by an acknowl-
edge bit.
When writing data to the memory, the device in-
serts an acknowledge bit during the 9
th
bit time,
following the bus master’s 8-bit transmission.
When data is read by the bus master, the bus
master acknowledges the receipt of the data byte
in the same way. Data transfers are terminated by
a Stop condition after an Ack for Write, and after a
NoAck for Read.
Table 2. Signal Names
E0, E1, E2
SDA
Chip Enable
Serial Data
Serial Clock
Write Control
Supply Voltage
Ground
VCC
SCL
WC
3
E0-E2
SCL
WC
M24Cxx
SDA
V
CC
V
SS
VSS
AI02033
I²C uses a two-wire serial interface, comprising a
bi-directional data line and a clock line. The devic-
es carry a built-in 4-bit Device Type Identifier code
(1010) in accordance with the I²C bus definition.
The device behaves as a slave in the I²C protocol,
with all memory operations synchronized by the
serial clock. Read and Write operations are initiat-
ed by a Start condition, generated by the bus mas-
ter. The Start condition is followed by a Device
Select Code and Read/Write bit (RW) (as de-
Figure 3. 8-Pin Package Connections (Top View)
Device internal reset
In order to prevent inadvertent Write operations
during Power-up, a Power On Reset (POR) circuit
is included. At Power-up (continuous rise of V
CC
),
the device will not respond to any instructions until
the V
CC
has reached the Power On Reset
threshold voltage (this threshold is lower than the
V
CC
min. operating voltage defined in
DC and AC
PARAMETERS).
When V
CC
has passed over the
POR threshold, the device is reset and is in
Standby
Power
mode.
At
Power-down
(continuous decay of V
CC
), as soon as V
CC
drops
from the normal operating voltage to below the
Power On Reset threshold voltage, the device
stops responding to any instruction sent to it.
Prior to selecting and issuing instructions to the
memory, a valid and stable V
CC
voltage must be
applied. This voltage must remain stable and valid
until the end of the transmission of the instruction
and, for a Write instruction, until the completion of
the internal write cycle (t
W
).
M24Cxx
16Kb /8Kb /4Kb /2Kb /1Kb
NC / NC / NC / E0 / E0
NC / NC / E1 / E1 / E1
NC / E2 / E2 / E2 / E2
VSS
1
2
3
4
8
7
6
5
VCC
WC
SCL
SDA
AI02034E
Note: 1. NC = Not Connected
2. See
PACKAGE MECHANICAL
section for package dimensions, and how to identify pin-1.
3/25
M24C16, M24C08, M24C04, M24C02, M24C01
SIGNAL DESCRIPTION
Serial Clock (SCL).
This input signal is used to
strobe all data in and out of the device. In applica-
tions where this signal is used by slave devices to
synchronize the bus to a slower clock, the bus
master must have an open drain output, and a
pull-up resistor can be connected from Serial
Clock (SCL) to V
CC
. (Figure
5.
indicates how the
value of the pull-up resistor can be calculated). In
most applications, though, this method of synchro-
nization is not employed, and so the pull-up resis-
tor is not necessary, provided that the bus master
has a push-pull (rather than open drain) output.
Serial Data (SDA).
This bi-directional signal is
used to transfer data in or out of the device. It is an
open drain output that may be wire-OR’ed with
other open drain or open collector signals on the
bus. A pull up resistor must be connected from Se-
rial Data (SDA) to V
CC
. (Figure
5.
indicates how
the value of the pull-up resistor can be calculated).
Chip Enable (E0, E1, E2).
These input signals
are used to set the value that is to be looked for on
the three least significant bits (b3, b2, b1) of the 7-
bit Device Select Code. These inputs must be tied
to V
CC
or V
SS
, to establish the Device Select Code
as shown in
Figure 4.
Figure 4. Device Select Code
VCC
VCC
M24Cxx
Ei
M24Cxx
Ei
VSS
VSS
Ai11650
Write Control (WC).
This input signal is useful
for protecting the entire contents of the memory
from inadvertent write operations. Write opera-
tions are disabled to the entire memory array when
Write Control (WC) is driven High. When uncon-
nected, the signal is internally read as V
IL
, and
Write operations are allowed.
When Write Control (WC) is driven High, Device
Select and Address bytes are acknowledged,
Data bytes are not acknowledged.
Figure 5. Maximum RP Value versus Bus Parasitic Capacitance (C) for an I²C Bus
VCC
20
Maximum RP value (kΩ)
16
R
P
12
8
4
0
10
100
C (pF)
AI01665b
R
P
SDA
MASTER
fc = 100kHz
fc = 400kHz
SCL
C
C
1000
4/25
M24C16, M24C08, M24C04, M24C02, M24C01
Figure 6. I²C Bus Protocol
SCL
SDA
SDA
Input
SDA
Change
START
Condition
STOP
Condition
SCL
1
2
3
7
8
9
SDA
MSB
ACK
START
Condition
SCL
1
2
3
7
8
9
SDA
MSB
ACK
STOP
Condition
AI00792B
Table 3. Device Select Code
Device Type Identifier
1
b7
M24C01 Select Code
M24C02 Select Code
M24C04 Select Code
M24C08 Select Code
M24C16 Select Code
1
1
1
1
1
b6
0
0
0
0
0
b5
1
1
1
1
1
b4
0
0
0
0
0
b3
E2
E2
E2
E2
A10
Chip Enable
2,3
b2
E1
E1
E1
A9
A9
b1
E0
E0
A8
A8
A8
RW
b0
RW
RW
RW
RW
RW
Note: 1. The most significant bit, b7, is sent first.
2. E0, E1 and E2 are compared against the respective external pins on the memory device.
3. A10, A9 and A8 represent most significant bits of the address.
5/25
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