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M24C08-MB3P/G

1KX8 I2C/2-WIRE SERIAL EEPROM, DSO8, 2 X 3 MM, LEAD FREE, MLP-8

器件类别:存储    存储   

厂商名称:ST(意法半导体)

厂商官网:http://www.st.com/

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
ST(意法半导体)
零件包装代码
SOIC
包装说明
2 X 3 MM, LEAD FREE, MLP-8
针数
8
Reach Compliance Code
compli
ECCN代码
EAR99
最大时钟频率 (fCLK)
0.4 MHz
数据保留时间-最小值
40
耐久性
1000000 Write/Erase Cycles
I2C控制字节
1010DMMR
JESD-30 代码
R-XDSO-N8
长度
3 mm
内存密度
8192 bi
内存集成电路类型
EEPROM
内存宽度
8
功能数量
1
端子数量
8
字数
1024 words
字数代码
1000
工作模式
SYNCHRONOUS
最高工作温度
125 °C
最低工作温度
-40 °C
组织
1KX8
封装主体材料
UNSPECIFIED
封装代码
VSON
封装等效代码
SOLCC8,.11,20
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, VERY THIN PROFILE
并行/串行
SERIAL
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
5 V
认证状态
Not Qualified
筛选级别
AEC-Q100
座面最大高度
0.6 mm
串行总线类型
I2C
最大待机电流
0.000005 A
最大压摆率
0.003 mA
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
AUTOMOTIVE
端子形式
NO LEAD
端子节距
0.5 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
2 mm
最长写入周期时间 (tWC)
10 ms
写保护
HARDWARE
文档预览
M24C16, M24C08
M24C04, M24C02, M24C01
16Kbit, 8Kbit, 4Kbit, 2Kbit and 1Kbit Serial I²C Bus EEPROM
FEATURES SUMMARY
Two-Wire I²C Serial Interface
Supports 400kHz Protocol
Single Supply Voltage:
– 2.5 to 5.5V for M24Cxx-W
– 1.8 to 5.5V for M24Cxx-R
Write Control Input
BYTE and PAGE WRITE (up to 16 Bytes)
RANDOM and SEQUENTIAL READ Modes
Self-Timed Programming Cycle
Automatic Address Incrementing
Enhanced ESD/Latch-Up Protection
More than 1 Million Erase/Write Cycles
More than 40-Year Data Retention
Packages
– ECOPACK® (RoHS compliant)
Figure 1. Packages
PDIP8 (BN)
SO8 (MN)
150 mil width
Table 1. Product List
Reference
M24C16
M24C16-R
M24C08-W
M24C08
M24C08-R
M24C04-W
M24C04
M24C04-R
M24C02-W
M24C02
M24C02-R
M24C01-W
M24C01
M24C01-R
UFDFPN8 (MB)
2x3mm² (MLP)
TSSOP8 (DS)
3x3mm² body size (MSOP)
TSSOP8 (DW)
169 mil width
Part Number
M24C16-W
January 2006
1/28
M24C16, M24C08, M24C04, M24C02, M24C01
TABLE OF CONTENTS
FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 1. Product List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 1. Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SUMMARY DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Table 2. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 3. 8-Pin Package Connections (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
SIGNAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Chip Enable (E0, E1, E2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 4. Device Select Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Supply voltage (V
CC
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Operating supply voltage V
CC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Internal Device Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Power-down. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 5. Maximum RP Value versus Bus Parasitic Capacitance (C) for an I²C Bus . . . . . . . . . . . 6
Figure 6. I²C Bus Protocol. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 3. Device Select Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
DEVICE OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Start Condition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Stop Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Acknowledge Bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Data Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Memory Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 4. Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 7. Write Mode Sequences with WC=1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 9
Write Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 8. Write Mode Sequences with WC=0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 9. Write Cycle Polling Flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Minimizing System Delays by Polling On ACK. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 10.Read Mode Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Read Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Sequential Read. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Acknowledge in Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2/28
M24C16, M24C08, M24C04, M24C02, M24C01
INITIAL DELIVERY STATE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 5. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
DC and AC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 6. Operating Conditions (M24Cxx-W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 7. Operating Conditions (M24Cxx-R). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 8. DC Characteristics (M24Cxx-W, Device Grade 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 9. DC Characteristics (M24Cxx-W, Device Grade 3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 10. DC Characteristics (M24Cxx-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 11. AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 11.AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 12. Input Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 13. AC Characteristics (M24Cxx-W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 14. AC Characteristics (M24Cxx-R). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 12.AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 13.PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Outline . . . . . . . . . . . . . . . . . 21
Table 15. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data . . . . . . . . . . 21
Figure 14.SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline . . . . 22
Table 16. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width,
Package Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 15.UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm²,
Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 17. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm²,
Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 16.TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline . . . . . . . . . . . . . . . . . . . 24
Table 18. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data . . . . . . . . . . . . 24
Figure 17.TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size,
Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 19. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size,
Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 20. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 21. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3/28
M24C16, M24C08, M24C04, M24C02, M24C01
SUMMARY DESCRIPTION
These I²C-compatible electrically erasable pro-
grammable memory (EEPROM) devices are orga-
nized as 2048/1024/512/256/128 x 8 (M24C16,
M24C08, M24C04, M24C02 and M24C01).
In order to meet environmental requirements, ST
offers these devices in ECOPACK® packages.
ECOPACK® packages are Lead-free and RoHS
compliant.
ECOPACK is an ST trademark. ECOPACK speci-
fications are available at: www.st.com.
Figure 2. Logic Diagram
I²C uses a two-wire serial interface, comprising a
bi-directional data line and a clock line. The devic-
es carry a built-in 4-bit Device Type Identifier code
(1010) in accordance with the I²C bus definition.
The device behaves as a slave in the I²C protocol,
with all memory operations synchronized by the
serial clock. Read and Write operations are initiat-
ed by a Start condition, generated by the bus mas-
ter. The Start condition is followed by a Device
Select Code and Read/Write bit (RW) (as de-
scribed in
Table 3.),
terminated by an acknowl-
edge bit.
When writing data to the memory, the device in-
serts an acknowledge bit during the 9
th
bit time,
following the bus master’s 8-bit transmission.
When data is read by the bus master, the bus
master acknowledges the receipt of the data byte
in the same way. Data transfers are terminated by
a Stop condition after an Ack for Write, and after a
NoAck for Read.
Table 2. Signal Names
E0, E1, E2
SDA
SCL
WC
Chip Enable
Serial Data
Serial Clock
Write Control
Supply Voltage
Ground
VCC
3
E0-E2
SCL
WC
M24Cxx
SDA
VSS
AI02033
V
CC
V
SS
Figure 3. 8-Pin Package Connections (Top View)
M24Cxx
16Kb /8Kb /4Kb /2Kb /1Kb
NC / NC / NC / E0 / E0
NC / NC / E1 / E1 / E1
NC / E2 / E2 / E2 / E2
VSS
1
2
3
4
8
7
6
5
VCC
WC
SCL
SDA
AI02034E
Note: 1. NC = Not Connected
2. See
PACKAGE MECHANICAL
section for package dimensions, and how to identify pin-1.
4/28
M24C16, M24C08, M24C04, M24C02, M24C01
SIGNAL DESCRIPTION
Serial Clock (SCL)
This input signal is used to strobe all data in and
out of the device. In applications where this signal
is used by slave devices to synchronize the bus to
a slower clock, the bus master must have an open
drain output, and a pull-up resistor can be con-
nected from Serial Clock (SCL) to V
CC
. (Figure
5.
indicates how the value of the pull-up resistor can
be calculated). In most applications, though, this
method of synchronization is not employed, and
so the pull-up resistor is not necessary, provided
that the bus master has a push-pull (rather than
open drain) output.
Serial Data (SDA)
This bi-directional signal is used to transfer data in
or out of the device. It is an open drain output that
may be wire-OR’ed with other open drain or open
collector signals on the bus. A pull up resistor must
be connected from Serial Data (SDA) to V
CC
. (Fig-
ure 5.
indicates how the value of the pull-up resis-
tor can be calculated).
Chip Enable (E0, E1, E2)
These input signals are used to set the value that
is to be looked for on the three least significant bits
(b3, b2, b1) of the 7-bit Device Select Code. These
inputs must be tied to V
CC
or V
SS
, to establish the
Device Select Code as shown in
Figure 4.
Figure 4. Device Select Code
VCC
VCC
Write Control (WC).
This input signal is useful
for protecting the entire contents of the memory
from inadvertent write operations. Write opera-
tions are disabled to the entire memory array when
Write Control (WC) is driven High. When uncon-
nected, the signal is internally read as V
IL
, and
Write operations are allowed.
When Write Control (WC) is driven High, Device
Select and Address bytes are acknowledged,
Data bytes are not acknowledged.
Supply voltage (V
CC
)
Operating supply voltage V
CC
.
Prior to select-
ing the memory and issuing instructions to it, a val-
id and stable V
CC
voltage must be applied: this
voltage must be a DC voltage within the specified
[V
CC
(min), V
CC
(max)] range, as defined in
Table
6.
and
Table 7.
In order to secure a stable DC sup-
ply voltage, it is recommended to decouple the
V
CC
line with a suitable capacitor (usually of the
order of 10nF to 100nF) close to the V
CC
/V
SS
package pins.
The V
CC
voltage must remain stable and valid until
the end of the transmission of the instruction and,
for a Write instruction, until the completion of the
internal write cycle (t
W
).
Internal Device Reset.
In order to prevent inad-
vertent Write operations during Power-up, a Pow-
er On Reset (POR) circuit is included. At Power-up
(continuous rise of V
CC
), the device does not re-
spond to any instruction until V
CC
has reached the
Power On Reset threshold voltage (this threshold
is lower than the minimum V
CC
operating voltage
defined in
Table 6.
and
Table 7.).
When V
CC
has passed the POR threshold, the de-
vice is reset and in the Standby Power mode
Power-down.
At Power-down (where V
CC
de-
creases continuously), as soon as V
CC
drops from
the operating voltage range below the Power On
Reset threshold voltage, the device stops re-
sponding to any instruction sent to it.
During Power-down, the device must be deselect-
ed and in the Standby Power mode (that is there
should be no internal Write cycle in progress).
M24Cxx
Ei
M24Cxx
Ei
VSS
VSS
Ai11650
5/28
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器件捷径:
E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ
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