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M25P40VMN3G

64K X 8 FLASH 2.7V PROM, PDSO8

器件类别:存储   

厂商名称:ST(意法半导体)

厂商官网:http://www.st.com/

下载文档
器件参数
参数名称
属性值
功能数量
1
端子数量
8
最大工作温度
85 Cel
最小工作温度
-40 Cel
最大供电/工作电压
3.6 V
最小供电/工作电压
2.7 V
额定供电电压
3 V
最大时钟频率
50 MHz
加工封装描述
0.150 INCH, 塑料, SO-8
状态
ACTIVE
包装形状
矩形的
包装尺寸
SMALL OUTLINE
表面贴装
Yes
端子形式
GULL WING
端子间距
1.27 mm
端子涂层
锡 铅
端子位置
包装材料
塑料/环氧树脂
温度等级
INDUSTRIAL
内存宽度
8
组织
64K × 8
存储密度
524288 deg
操作模式
ASYNCHRONOUS
位数
65536 words
位数
64K
内存IC类型
FLASH 2.7V 可编程只读存储器
串行并行
串行
文档预览
M25PXX
512 Kbit to 32 Mbit, Low Voltage, Serial Flash Memory
With 40 MHz or 50 MHz SPI Bus Interface
DATA BRIEF
FEATURES SUMMARY
512Kbit to 32Mbit of Flash Memory
Page Program (up to 256 Bytes) in 1.4ms
(typical)
Sector Erase (256 Kbit or 512Kbit)
Bulk Erase (512Kbit to 32Mbit)
2.7 to 3.6V Single Supply Voltage
SPI Bus Compatible Serial Interface
40MHz to 50MHz Clock Rate (maximum)
Deep Power-down Mode 1µA (typical)
Electronic Signatures
– JEDEC Standard Two-Byte Signature
(20xxh)
– RES Instruction, One-Byte, Signature, for
backward compatibility
More than 100000 Erase/Program Cycles per
Sector
More than 20 Year Data Retention
Figure 1. Packages
VDFPN8 (ME)
8x6mm (MLP8)
VDFPN8 (MP)
(MLP8)
Table 1. Product List
Reference
Part Number
M25P32
M25P16
M25P80
M25Pxx
M25P40
M25P20
M25P10-A
M25P05-A
SO16 (MF)
300 mil width
8
1
SO8 (MN)
150 mil width
October 2004
For further information contact your local ST sales office.
1/7
M25PXX
SUMMARY DESCRIPTION
The M25Pxx is a 512Kbit to 32Mbit (2M x 8) Serial
Flash Memory, with advanced write protection
mechanisms, accessed by a high speed SPI-com-
patible bus.
The memory can be programmed 1 to 256 bytes at
a time, using the Page Program instruction.
The memory is organized as a number of sectors,
each containing 256 or 128 pages. Each page is
256 bytes wide.
The whole memory can be erased using the Bulk
Erase instruction, or a sector at a time, using the
Sector Erase instruction.
Figure 2. Logic Diagram
VCC
Figure 3. SO8 and VDFPN Connections
M25Pxx
S
Q
W
VSS
1
2
3
4
8
7
6
5
AI10259
VCC
HOLD
C
D
D
C
S
W
HOLD
M25Pxx
Q
Note: 1. There is an exposed die paddle on the underside of the
MLP8 package. This is pulled, internally, to V
SS
, and
must not be allowed to be connected to any other voltage
or signal line on the PCB.
Figure 4. SO16 Connections
M25Pxx
HOLD
VCC
DU
DU
DU
DU
S
Q
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
AI10260
VSS
AI10258
Table 2. Signal Names
C
D
Q
Serial Clock
Serial Data Input
Serial Data Output
Chip Select
Write Protect
Hold
Supply Voltage
Ground
C
D
DU
DU
DU
DU
VSS
W
Note: 1. DU = Don’t Use
S
W
HOLD
V
CC
V
SS
2/7
M25PXX
Figure 5. Block Diagram
HOLD
W
S
C
D
Q
Control Logic
High Voltage
Generator
I/O Shift Register
Address Register
and Counter
256 Byte
Data Buffer
Status
Register
Top of Address Space
Y Decoder
Size of the
read-only
memory area
00000h
256 Bytes (Page Size)
X Decoder
000FFh
AI10261
3/7
M25PXX
Table 3. Instruction Set
Instruction
WREN
WRDI
RDID
RDSR
WRSR
READ
Description
Write Enable
Write Disable
Read Identification
Read Status Register
Write Status Register
Read Data Bytes
One-byte Instruction Code
0000 0110
0000 0100
1001 1111
0000 0101
0000 0001
0000 0011
0000 1011
0000 0010
1101 1000
1100 0111
1011 1001
06h
04h
9Fh
05h
01h
03h
0Bh
02h
D8h
C7h
B9h
Address
Bytes
0
0
0
0
0
3
3
3
3
0
0
0
1010 1011
ABh
0
0
Dummy
Bytes
0
0
0
0
0
0
1
0
0
0
0
3
Data
Bytes
0
0
1 to 3
1 to
1
1 to
1 to
1 to 256
0
0
0
1 to
0
FAST_READ Read Data Bytes at Higher Speed
PP
SE
BE
DP
Page Program
Sector Erase
Bulk Erase
Deep Power-down
Release from Deep Power-down,
and Read Electronic Signature
Release from Deep Power-down
RES
Table 4. Status Register Format
b7
SRWD
0
0
BP2
BP1
BP0
WEL
b0
WIP
Status Register
Write Protect
Block Protect Bits
Write Enable Latch Bit
Write In Progress Bit
4/7
M25PXX
PART NUMBERING
Table 5. Ordering Information Scheme
Example:
Device Type
M25P = Serial Flash Memory for Code Storage
Device Function
32 = 32Mbit (4M x 8)
16 = 16Mbit (2M x 8)
80 = 8Mbit (1M x 8)
40 = 4Mbit (512K x 8)
20 = 2Mbit (256K x 8)
10-A = 1Mbit (128K x 8)
05-A = 512Kbit (64K x 8)
Operating Voltage
V = V
CC
= 2.7 to 3.6V
Package
ME = VDFPN8 8x6mm (MLP8)
MP = VDFPN8 (MLP8)
MF = SO16 (300 mil width)
MN = SO8 (150 mil width)
Device Grade
6 = Industrial temperature range, –40 to 85 °C.
Device tested with standard test flow
3 = Device tested with High Reliability Certified Flow
1
.
Automotive temperature range (–40 to 125 °C)
Option
blank = Standard Packing
T = Tape and Reel Packing
Plating Technology
blank = Standard SnPb plating
P = Lead-Free and RoHS compliant
G = Lead-Free, RoHS compliant, Sb
2
O
3
-free and TBBA-free
Note: 1. ST strongly recommends the use of the Automotive Grade devices for use in an automotive environment. The High Reliability Cer-
tified Flow (HRCF) is described in the quality note QNEE9801. Please ask your nearest ST sales office for a copy.
M25P80
V MP
6
T
P
For a list of available options (speed, package,
etc.) or for further information on any aspect of this
device, please contact your nearest ST Sales Of-
fice.
5/7
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