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M27V512-200K1TR

512 Kbit 64Kb x8 Low Voltage UV EPROM and OTP EPROM

器件类别:存储    存储   

厂商名称:ST(意法半导体)

厂商官网:http://www.st.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
ST(意法半导体)
零件包装代码
QFJ
包装说明
PLASTIC, LCC-32
针数
32
Reach Compliance Code
_compli
ECCN代码
EAR99
最长访问时间
200 ns
I/O 类型
COMMON
JESD-30 代码
R-PQCC-J32
JESD-609代码
e0
长度
13.97 mm
内存密度
524288 bi
内存集成电路类型
OTP ROM
内存宽度
8
功能数量
1
端子数量
32
字数
65536 words
字数代码
64000
工作模式
ASYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
64KX8
输出特性
3-STATE
封装主体材料
PLASTIC/EPOXY
封装代码
QCCJ
封装等效代码
LDCC32,.5X.6
封装形状
RECTANGULAR
封装形式
CHIP CARRIER
并行/串行
PARALLEL
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
3.3 V
认证状态
Not Qualified
座面最大高度
3.56 mm
最大待机电流
0.00001 A
最大压摆率
0.01 mA
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
J BEND
端子节距
1.27 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
11.43 mm
文档预览
M27V512
512 Kbit (64Kb x8) Low Voltage UV EPROM and OTP EPROM
s
LOW VOLTAGE READ OPERATION:
3V to 3.6V
FAST ACCESS TIME: 100ns
LOW POWER CONSUMPTION:
– Active Current 10mA at 5MHz
– Standby Current 10µA
28
28
s
s
s
s
s
PROGRAMMING VOLTAGE: 12.75V
±
0.25V
PROGRAMMING TIME: 100µs/byte (typical)
ELECTRONIC SIGNATURE
– Manufacturer Code: 20h
– Device Code: 3Dh
1
1
FDIP28W (F)
PDIP28 (B)
DESCRIPTION
The M27V512 is a low voltage 512 Kbit EPROM
offered in the two ranges UV (ultra viloet erase)
and OTP (one time programmable). It is ideally
suited for microprocessor systems and is orga-
nized as 65,536 by 8 bits.
The M27V512 operates in the read mode with a
supply voltage as low as 3V. The decrease in op-
erating power allows either a reduction of the size
of the battery or an increase in the time between
battery recharges.
The FDIP28W (window ceramic frit-seal package)
has transparent lid which allows the user to ex-
pose the chip to ultraviolet light to erase the bit pat-
tern. A new pattern can then be written to the
device by following the programming procedure.
For applications where the content is programmed
only one time and erasure is not required, the
M27V512 is offered in PDIP28, PLCC32 and
TSOP28 (8 x 13.4 mm) packages.
Table 1. Signal Names
A0-A15
Q0-Q7
E
GV
PP
V
CC
V
SS
Address Inputs
Data Outputs
Chip Enable
Output Enable
Supply Voltage
Ground
PLCC32 (K)
TSOP28 (N)
8 x 13.4mm
Figure 1. Logic Diagram
VCC
16
A0-A15
8
Q0-Q7
E
GVPP
M27V512
VSS
AI00732B
May 1998
1/16
M27V512
Figure 2A. DIP Pin Connections
Figure 2B. LCC Pin Connections
AI01907
VSS
DU
Q3
Q4
Q5
AI00733B
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
VSS
1
28
2
27
3
26
4
25
5
24
6
23
7
22
M27V512
8
21
9
20
10
19
11
18
12
17
13
16
14
15
VCC
A14
A13
A8
A9
A11
GVPP
A10
E
Q7
Q6
Q5
Q4
Q3
A6
A5
A4
A3
A2
A1
A0
NC
Q0
A7
A12
A15
DU
VCC
A14
A13
1 32
A8
A9
A11
NC
GVPP
A10
E
Q7
Q6
9
M27V512
25
17
Q1
Q2
Warning:
NC = Not Connected, DU = Don’t Use
Figure 2C. TSOP Pin Connections
GVPP
A11
A9
A8
A13
A14
VCC
A15
A12
A7
A6
A5
A4
A3
22
21
28
1
M27V512
15
14
7
8
AI00734B
A10
E
Q7
Q6
Q5
Q4
Q3
VSS
Q2
Q1
Q0
A0
A1
A2
DEVICE OPERATION
The operating modes of the M27V512 are listed in
the Operating Modes table. A single power supply
is required in the read mode. All inputs are TTL
levels except for GV
PP
and 12V on A9 for Elec-
tronic Signature.
Read Mode
The M27V512 has two control functions, both of
which must be logically active in order to obtain
data at the outputs. Chip Enable (E) is the power
control and should be used for device selection.
Output Enable (G) is the output control and should
be used to gate data to the output pins, indepen-
dent of device selection. Assuming that the ad-
dresses are stable, the address access time
(t
AVQV
) is equal to the delay from E to output
(t
ELQV
). Data is available at the output after a delay
of t
GLQV
from the falling edge of G, assuming that
E has been low and the addresses have been sta-
ble for at least t
AVQV
-t
GLQV
.
Standby Mode
The M27V512 has a standby mode which reduces
the supply current from 10mA to 10µA with low
voltage operation V
CC
3.6V, see Read Mode DC
Characteristics table for details.The M27V512 is
placed in the standby mode by applying a CMOS
high signal to the E input. When in the standby
mode, the outputs are in a high impedance state,
independent of the GV
PP
input.
2/16
M27V512
Table 2. Absolute Maximum Ratings
(1)
Symbol
T
A
T
BIAS
T
STG
V
IO (2)
V
CC
V
A9 (2)
V
PP
Parameter
Ambient Operating Temperature
(3)
Temperature Under Bias
Storage Temperature
Input or Output Voltage (except A9)
Supply Voltage
A9 Voltage
Program Supply Voltage
Value
–40 to 125
–50 to 125
–65 to 150
–2 to 7
–2 to 7
–2 to 13.5
–2 to 14
Unit
°C
°C
°C
V
V
V
V
Note: 1. Except for the rating ”Operating Temperature Range”, stresses above those listed in the Table ”Absolute Maximum Ratings” may
cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions
above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating condi-
tions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant qua-
lity documents.
2. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than 20ns. Maximum DC
voltage on Output is V
CC
+0.5V with possible overshoot to V
CC
+2V for a period less than 20ns.
3. Depends on range.
Table 3. Operating Modes
Mode
Read
Output Disable
Program
Program Inhibit
Standby
Electronic Signature
Note: X = V
IH
or V
IL
, V
ID
= 12V
±
0.5V.
E
V
IL
V
IL
V
IL
Pulse
V
IH
V
IH
V
IL
GV
PP
V
IL
V
IH
V
PP
V
PP
X
V
IL
A9
X
X
X
X
X
V
ID
Q0-Q7
Data Out
Hi-Z
Data In
Hi-Z
Hi-Z
Codes
Table 4. Electronic Signature
Identifier
Manufacturer’s Code
Device Code
A0
V
IL
V
IH
Q7
0
0
Q6
0
0
Q5
1
1
Q4
0
1
Q3
0
1
Q2
0
1
Q1
0
0
Q0
0
1
Hex Data
20h
3Dh
Two Line Output Control
Because EPROMs are usually used in larger
memory arrays, the product features a 2 line con-
trol function which accommodates the use of mul-
tiple memory connection. The two line control
function allows:
a. the lowest possible memory power dissipation,
b. complete assurance that output bus contention
will not occur.
For the most efficient use of these two control
lines, E should be decoded and used as the prima-
ry device selecting function, while G should be
made a common connection to all devices in the
array and connected to the READ line from the
system control bus. This ensures that all deselect-
ed memory devices are in their low power standby
mode and that the output pins are only active
when data is required from a particular memory
device.
3/16
M27V512
Table 5. AC Measurement Conditions
High Speed
Input Rise and Fall Times
Input Pulse Voltages
Input and Output Timing Ref. Voltages
10ns
0 to 3V
1.5V
Standard
20ns
0.4V to 2.4V
0.8V and 2V
Figure 3. Testing Input Output Waveform
Figure 4. AC Testing Load Circuit
1.3V
High Speed
3V
1.5V
0V
DEVICE
UNDER
TEST
2.0V
0.8V
AI01822
1N914
3.3kΩ
Standard
2.4V
OUT
CL
0.4V
CL = 30pF for High Speed
CL = 100pF for Standard
CL includes JIG capacitance
AI01823B
Table 6. Capacitance
(1)
(T
A
= 25
°C,
f = 1 MHz)
Symbol
C
IN
C
OUT
Parameter
Input Capacitance
Output Capacitance
Test Condit ion
V
IN
= 0V
V
OUT
= 0V
Min
Max
6
12
Unit
pF
pF
Note: 1. Sampled only, not 100% tested.
System Considerations
The power switching characteristics of Advanced
CMOS EPROMs require careful decoupling of the
devices. The supply current, I
CC
, has three seg-
ments that are of interest to the system designer:
the standby current level, the active current level,
and transient current peaks that are produced by
the falling and rising edges of E. The magnitude of
the transient current peaks is dependent on the
capacitive and inductive loading of the device at
the output.
The associated transient voltage peaks can be
suppressed by complying with the two line output
control and by properly selected decoupling ca-
pacitors. It is recommended that a 0.1µF ceramic
capacitor be used on every device between V
CC
and V
SS
. This should be a high frequency capaci-
tor of low inherent inductance and should be
placed as close to the device as possible. In addi-
tion, a 4.7µF bulk electrolytic capacitor should be
used between V
CC
and V
SS
for every eight devic-
es. The bulk capacitor should be located near the
power supplyconnection point.The purpose of the
bulk capacitor is to overcome the voltage drop
caused by the inductive effects of PCB traces.
4/16
M27V512
Table 7. Read Mode DC Characteristics
(1)
(T
A
= 0 to 70
°C
or –40 to 85
°C;
V
CC
= 3.3V
±
10%; V
PP
= V
CC
)
Symbol
I
LI
I
LO
I
CC
I
CC1
I
CC2
I
PP
V
IL
V
IH (2)
V
OL
V
OH
V
OH
Parameter
Input Leakage Current
Output Leakage Current
Supply Current
Supply Current (Standby) TTL
Supply Current (Standby) CMOS
Program Current
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage TTL
Output High Voltage CMOS
I
OL
= 2.1mA
I
OH
= –400µA
I
OH
= –100µA
2.4
V
CC
– 0.7V
Test Condition
0V
V
IN
V
CC
0V
V
OUT
V
CC
E = V
IL
, G = V
IL
, I
OUT
= 0mA,
f = 5MHz, V
CC
3.6V
E = V
IH
E > V
CC
– 0.2V, V
CC
3.6V
V
PP
= V
CC
–0.3
2
Min
Max
±10
±10
10
1
10
10
0.8
V
CC
+ 1
0.4
Unit
µA
µA
mA
mA
µA
µA
V
V
V
V
V
Note: 1. V
CC
must be applied simultaneously with or before V
PP
and removed simultaneously or after V
PP
.
2. Maximum DC voltage on Output is V
CC
+0.5V.
Table 8A. Read Mode AC Characteristics
(1)
(T
A
= 0 to 70
°C
or –40 to 85
°C;
V
CC
= 3.3V
±
10%; V
PP
= V
CC
)
M27V512
Symbol
Alt
Parameter
Test Condition
-100
(3)
Min
t
AVQV
t
ELQV
t
GLQV
t
EHQZ (2)
t
GHQZ (2)
t
AXQX
t
ACC
t
CE
t
OE
t
DF
t
DF
t
OH
Address Valid to Output Valid
Chip Enable Low to Output Valid
Output Enable Low to Output Valid
Chip Enable High to Output Hi-Z
Output Enable High to Output Hi-Z
Address Transition to Output
Transition
E = V
IL
, G = V
IL
G = V
IL
E = V
IL
G = V
IL
E = V
IL
E = V
IL
, G = V
IL
0
0
0
Max
100
100
45
30
30
0
0
0
-120
Min
Max
120
120
45
35
35
ns
ns
ns
ns
ns
ns
Unit
Note: 1. V
CC
must be applied simultaneously with or before V
PP
and removed simultaneously or after V
PP
.
2. Sampled only, not 100% tested.
3. Speed obtained with High Speed AC measurement conditions.
5/16
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