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M29W640GH70ZF6E

Flash, 4MX16, 70ns, PBGA64, TBGA-64

器件类别:存储    存储   

厂商名称:Micron Technology

厂商官网:http://www.mdtic.com.tw/

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Micron Technology
零件包装代码
BGA
包装说明
TBGA, BGA64,8X8,40
针数
64
Reach Compliance Code
compliant
ECCN代码
3A991.B.1.A
最长访问时间
70 ns
其他特性
BOTTOM BOOT BLOCK
备用内存宽度
8
启动块
BOTTOM
命令用户界面
YES
通用闪存接口
YES
数据轮询
YES
JESD-30 代码
R-PBGA-B64
JESD-609代码
e1
长度
13 mm
内存密度
67108864 bit
内存集成电路类型
FLASH
内存宽度
16
功能数量
1
部门数/规模
128
端子数量
64
字数
4194304 words
字数代码
4000000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
4MX16
封装主体材料
PLASTIC/EPOXY
封装代码
TBGA
封装等效代码
BGA64,8X8,40
封装形状
RECTANGULAR
封装形式
GRID ARRAY, THIN PROFILE
页面大小
4/8 words
并行/串行
PARALLEL
峰值回流温度(摄氏度)
260
电源
3/3.3 V
编程电压
3 V
认证状态
Not Qualified
就绪/忙碌
YES
座面最大高度
1.2 mm
部门规模
64K
最大待机电流
0.0001 A
最大压摆率
0.02 mA
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
2.7 V
标称供电电压 (Vsup)
3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Silver/Copper (Sn/Ag/Cu)
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
30
切换位
YES
类型
NOR TYPE
宽度
10 mm
文档预览
64Mb: 3V Embedded Parallel NOR Flash
Features
Parallel NOR Flash Embedded Memory
M29W640GH, M29W640GL
M29W640GT, M29W640GB
Features
• Supply voltage
– V
CC
= 2.7–3.6V (program, erase, read)
– V
PP
= 12V for fast program (optional)
• Asynchronous random/page read
– Page width: 4 words
– Page access: 25ns
– Random access: 60ns, 70ns, 90ns
• Fast program commands
– 2-word/4-byte program (without V
PP
= 12V)
– 4-word/8-byte program (with V
PP
= 12V)
– 16-word/32-byte write buffer
• Programming time
– 10µs per byte/word TYP
– Chip program time: 10 s (4-word program)
– Double word/quadruple byte program
• Memory organization
– M29W640GH/L 128 main blocks, 64KB each
– M29W640GT/B 127 main blocks, 64KB each and
8 boot blocks, 8KB each
• Program/erase controller
– Embedded byte/word program algorithms
• Program/erase suspend and resume
– Read from any block during a PROGRAM SUS-
PEND operation
– Read or program another block during an ERASE
SUSPEND operation
• Hardware block protection
– V
PP
/WP# pin for fast program and write protect
– Temporary block unprotect mode
• Common Flash interface
– 64-bit security code
• 128-word extended memory block
– Extra block used as security block or to store ad-
ditional information
• Low power consumption: Standby and automatic
mode
• 100,000 PROGRAM/ERASE cycles per block
• Electronic signature
– Manufacturer code: 0020h
• Device summary: part number and device code
– M29W640GH: uniform, last block protected by
V
PP
/WP#
– 227Eh + 220Ch + 2201h
– M29W640GL: uniform, first block protected by
V
PP
/WP#
– 227Eh + 220Ch + 2200h
– M29W640GT: top boot block
– 227Eh + 2210h + 2201h
– M29W640GB: bottom boot block
– 227Eh + 2210h + 2200h
• RoHS-compliant packages
– 48-pin TSOP (N/NA) 12mm x 20mm
– 56-pin TSOP (NB) 14mm x 20mm
– 48-ball TFBGA (ZA) 6mm x 8mm
– 64-ball FBGA (ZS) 11mm x 13mm
– 64-ball TBGA (ZF) 10mm x 13mm
• Automotive certified parts available
PDF: 09005aef84e35115
m29W_640GH/L_GT/B.pdf - Rev. D 03/15 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Features
Part Numbering Information
Available with extended memory block prelocked by Micron. Devices are shipped from the factory with memory
content bits erased to 1. For available options, such as packages or speed, or for further information, contact your
Micron sales representative. Part numbers can be verified at
www.micron.com.
Feature and specification compari-
son by device type is available at
www.micron.com/products.
Contact the factory for devices not found.
Table 1: Part Number Information
Part Number
Category
Device Type
Device Function
Array Matrix
Category Details
M29 = Parallel Flash memory
640G = 64Mb (x8/x16) boot block, uniform or boot block
T = Top boot
B = Bottom boot
L = First block protected by V
PP
/WP#
H = Last block protected by V
PP
/WP#
Speed
60 = 60ns (in conjunction with temperature range 6; denotes industrial grade –40°C to 85°C parts)
6A = 60ns (in conjunction with temperature range 6; denotes automotive grade –40°C to 85°C parts)
7A = 70ns (in conjunction with temperature range 6; denotes automotive grade –40°C to 85°C parts)
70 = 70ns (in conjunction with temperature range 6; denotes industrial grade –40°C to 85°C parts;
temperature range = 3 denotes automotive grade –40°C to 125°C parts)
90 = 90ns (in conjunction with temperature range 6; denotes industrial grade –40°C to 85°C parts)
Package
N/NA = 48-pin TSOP, 12mm x 20mm
NB = 56-pin TSOP, 14mm x 20mm (available upon request)
ZA = 48-ball TFBGA, 6mm x 8mm, 0.8mm pitch
ZS = 64-ball FBGA, 11mm x 13mm, 1mm pitch
ZF = 64-ball TBGA, 10mm x 13mm, 1mm pitch (available upon request)
Temperature
Range
Shipping Options
6 = –40°C to 85°C
3 = –40°C to 125°C (Automotive)
E = RoHS-compliant package, standard packing
F = RoHS-compliant package, tape and reel packing
Operating Voltage W = 2.7 to 3.6V
PDF: 09005aef84e35115
m29W_640GH/L_GT/B.pdf - Rev. D 03/15 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Features
Contents
General Description ......................................................................................................................................... 7
Signal Assignments ......................................................................................................................................... 10
Signal Descriptions ......................................................................................................................................... 14
Memory Organization .................................................................................................................................... 17
Memory Configuration ............................................................................................................................... 17
Uniform Block Memory Map, x16 – 64Mb Density ........................................................................................ 17
Uniform Block Memory Map, x8 – 64Mb Density ......................................................................................... 17
Bus Operations ............................................................................................................................................... 18
Read .......................................................................................................................................................... 18
Write .......................................................................................................................................................... 18
Standby and Automatic Standby ................................................................................................................. 18
Output Disable ........................................................................................................................................... 18
Status Register ................................................................................................................................................ 19
Data Polling Bit (DQ7) ................................................................................................................................ 19
Toggle Bit (DQ6) ......................................................................................................................................... 19
Error Bit (DQ5) ........................................................................................................................................... 19
Erase Timer Bit (DQ3) ................................................................................................................................. 20
Alternative Toggle Bit (DQ2) ........................................................................................................................ 20
Write to Buffer and Program Abort Bit (DQ1) ............................................................................................... 20
READ Operations ........................................................................................................................................... 24
READ/RESET Command ............................................................................................................................ 24
READ CFI Command .................................................................................................................................. 24
AUTO SELECT Operations .............................................................................................................................. 25
AUTO SELECT Command ........................................................................................................................... 25
Command Interface ....................................................................................................................................... 28
READ/RESET Command ............................................................................................................................ 28
AUTO SELECT Command ........................................................................................................................... 28
READ CFI QUERY Command ...................................................................................................................... 28
PROGRAM Command ................................................................................................................................ 29
PROGRAM SUSPEND Command ................................................................................................................ 29
PROGRAM RESUME Command .................................................................................................................. 30
Fast Program Commands ............................................................................................................................ 30
DOUBLE BYTE PROGRAM Command ......................................................................................................... 30
QUADRUPLE BYTE PROGRAM Command .................................................................................................. 30
OCTUPLE BYTE PROGRAM Command ....................................................................................................... 30
DOUBLE WORD PROGRAM Command ....................................................................................................... 31
QUADRUPLE WORD PROGRAM Command ................................................................................................ 31
WRITE TO BUFFER AND PROGRAM Command .......................................................................................... 32
WRITE TO BUFFER AND PROGRAM CONFIRM Command .......................................................................... 33
WRITE TO BUFFER AND PROGRAM ABORT AND RESET Command ............................................................ 33
UNLOCK BYPASS Command ...................................................................................................................... 33
UNLOCK BYPASS PROGRAM Command ..................................................................................................... 33
UNLOCK BYPASS RESET Command ............................................................................................................ 34
CHIP ERASE Command .............................................................................................................................. 34
BLOCK ERASE Command ........................................................................................................................... 34
ERASE SUSPEND Command ....................................................................................................................... 35
ERASE RESUME Command ........................................................................................................................ 35
ENTER EXTENDED BLOCK Command ....................................................................................................... 35
EXIT EXTENDED BLOCK Command ........................................................................................................... 35
BLOCK PROTECT and CHIP UNPROTECT Commands ................................................................................ 36
PDF: 09005aef84e35115
m29W_640GH/L_GT/B.pdf - Rev. D 03/15 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Features
BLOCK PROTECT Command ......................................................................................................................
Programmer Technique ..............................................................................................................................
In-System Technique ..................................................................................................................................
Common Flash Interface ................................................................................................................................
Absolute Ratings and Operating Conditions .....................................................................................................
DC Characteristics ..........................................................................................................................................
Read AC Characteristics ..................................................................................................................................
Write AC Characteristics .................................................................................................................................
Toggle and Alternative Toggle AC Characteristics .............................................................................................
Program/Erase Characteristics ........................................................................................................................
Reset Characteristics ......................................................................................................................................
Package Dimensions .......................................................................................................................................
Revision History .............................................................................................................................................
Rev. D – 03/15 .............................................................................................................................................
Rev. C – 07/13 .............................................................................................................................................
Rev. B – 06/13 .............................................................................................................................................
Rev. A – 11/12 .............................................................................................................................................
36
36
39
46
51
53
54
57
61
63
67
68
73
73
73
73
73
PDF: 09005aef84e35115
m29W_640GH/L_GT/B.pdf - Rev. D 03/15 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Features
List of Figures
Figure 1: Logic Diagram ................................................................................................................................... 8
Figure 2: 48-Pin TSOP .................................................................................................................................... 10
Figure 3: 56-Pin TSOP .................................................................................................................................... 11
Figure 4: 48-Ball TFBGA ................................................................................................................................. 12
Figure 5: 64-Ball TFBGA ................................................................................................................................. 13
Figure 6: Data Polling Flowchart .................................................................................................................... 22
Figure 7: Data Toggle Flowchart ..................................................................................................................... 23
Figure 8: Programmer Equipment Block Protect Flowchart ............................................................................. 37
Figure 9: Programmer Equipment Chip Unprotect Flowchart .......................................................................... 38
Figure 10: In-System Equipment Block Protect Flowchart ............................................................................... 40
Figure 11: In-System Equipment Chip Protect Flowchart ................................................................................ 41
Figure 12: AC Measurement Load Circuit ....................................................................................................... 52
Figure 13: AC Measurement I/O Waveform ..................................................................................................... 52
Figure 14: Random AC Timing ....................................................................................................................... 55
Figure 15: Page Read AC Timing ..................................................................................................................... 56
Figure 16: WE#-Controlled AC Timing ............................................................................................................ 58
Figure 17: CE#-Controlled AC Timing ............................................................................................................. 60
Figure 18: Toggle/Alternative Toggle, CE# Controlled ...................................................................................... 61
Figure 19: Toggle/Alternative Toggle, OE# Controlled ...................................................................................... 62
Figure 20: WE# Controlled Program Waveform ............................................................................................... 64
Figure 21: CE# Controlled Program Waveform ................................................................................................ 65
Figure 22: Chip/Block Erase Waveform .......................................................................................................... 66
Figure 23: Reset/Block Temporary Unprotect AC Waveforms ........................................................................... 67
Figure 24: Accelerated Programming Timing Waveform .................................................................................. 67
Figure 25: 48-Pin TSOP – 12mm x 20mm ........................................................................................................ 68
Figure 26: 56-Pin TSOP – 14mm x 20mm ........................................................................................................ 69
Figure 27: 48-Ball TFBGA – 6mm x 8mm ......................................................................................................... 70
Figure 28: 64-Ball TBGA – 10mm x 13mm ....................................................................................................... 71
Figure 29: 64-Ball FBGA – 11mm x 13mm ....................................................................................................... 72
PDF: 09005aef84e35115
m29W_640GH/L_GT/B.pdf - Rev. D 03/15 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2013 Micron Technology, Inc. All rights reserved.
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