M2GL090T-FCSG325,M2GL090T-FCSG325 pdf中文资料,M2GL090T-FCSG325引脚图,M2GL090T-FCSG325电路-Datasheet-电子工程世界

文档预览

Automotive Product Selector Guide

Microsemi

offers a broad range of automotive-grade FPGAs and ARM

-enabled SoC FPGAs for designers to choose from which best fits their requirements. This product selector guide covers

primary parameters; be it logic elements density, package size, on-chip peripherals etc. that are used to select an FPGA or SoC FPGA for a given application. All the products recommended in

this guide are AEC-Q100 qualified and offer extended temperature support. Microsemi’s automotive-grade FPGAs and SoCs offers the advantages of best-in-class security, high-reliability and

low-power flash FPGAs for automotive designers.

The following device families offer Microsemi automotive-grade FPGAs:

•

ProASIC3

IGLOO

SmartFusion

Family

ProASIC3

Part Number

A3P060‐1FG144T

A3P060‐FG144T

A3P060‐1FGG144T

A3P060‐FGG144T

A3P060‐1VQ100T

A3P060‐VQ100T

A3P060‐1VQG100T

A3P060‐VQG100T

A3P125‐1FG144T

A3P125‐FG144T

A3P125‐1FGG144T

A3P125‐FGG144T

A3P125‐1VQ100T

A3P125‐VQ100T

A3P125‐1VQG100T

A3P125‐VQG100T

A3P250‐FG144T

A3P250‐1FGG144T

Package

Size(mm)

13x13

14x14

13x13

14x14

13x13

Temperature

Range(°C)

-40 to 135

LEs

~700

~1500

~3,000

Mathblocks RAM Memory

(18x18)

(Kbits)

–

Transceivers

(Lanes)

–

Transceiver

Speed

–

User I/Os

Status

Production

Automotive Product Selector Guide

Table continuation...

Family

ProASIC3

SmartFusion2

Part Number

A3P250‐FGG144T

A3P250‐1FG144T

A3P250‐VQ100T

A3P250‐1VQ100T

A3P250‐1VQG100T

A3P250‐VQG100T

A3P250‐1FG256T

A3P250‐FG256T

A3P250‐1FGG256T

A3P250‐FGG256T

A3P1000‐1FG144T

A3P1000‐1FGG144T

A3P1000‐FGG144T

A3P1000‐FG144T

A3P1000‐1FG256T

A3P1000‐FG256T

A3P1000‐1FGG256T

A3P1000‐FGG256T

A3P1000‐1FG484T

A3P1000‐FG484T

A3P1000‐1FGG484T

A3P1000‐FGG484T

M2S005S-1VFG256T2

M2S005S-1VFG400T2

M2S005S-1FGG484T2

M2S010TS-1VFG256T2

Package

Size(mm)

13x13

14x14

17x17

13x13

17x17

23x23

14x14

17x17

23x23

14x14

Temperature

Range(°C)

-40 to 135

-40 to 125

LEs

~3,000

~11,000

6,060

12,084

Mathblocks RAM Memory

(18x18)

(Kbits)

144

703

912

Transceivers

(Lanes)

Transceiver

Speed

3.125 Gbps

User I/Os

157

177

300

161

171

209

138

Status

Production

Automotive Product Selector Guide

Table continuation...

Family

SmartFusion2

IGLOO2

Part Number

M2S010TS-1VFG400T2

M2S010TS-1FGG484T2

M2S025TS-1VFG256T2

M2S025TS-1VFG400T2

M2S025TS-1FGG484T2

M2S060TS-1VFG400T2

M2S060TS-1FGG484T2

M2S060TS-1FGG676T2

M2S090TS-1FGG484T2

M2S090TS-1FGG676T2

M2GL005S-1VFG256T2

M2GL005S-1VFG400T2

M2GL005S-1FGG484T2

M2GL010TS-1VFG256T2

M2GL010TS-1VFG400T2

M2GL010TS-1FGG484T2

M2GL025TS-1VFG256T2

M2GL025TS-1VFG400T2

M2GL025TS-1FGG484T2

M2GL060TS-1VFG400T2

M2GL060TS-1FGG484T2

M2GL060TS-1FGG676T2

M2GL090TS-1FGG484T2

M2GL090TS-1FGG676T2

M2GL005-1FGG484T1

M2GL010-1FGG484T1

Package

Size(mm)

17x17

23x23

14x14

17x17

23x23

17x17

23x23

27x27

23x23

27x27

14x14

17x17

23x23

14x14

17x17

23x23

14x14

17x17

23x23

17x17

23x23

27x27

23x23

27x27

23x23

Temperature

Range(°C)

-40 to 125

-40 to 135

LEs

12,084

27,696

56,520

86,184

6,060

12,084

27,696

56,520

86,184

6,060

12,084

Mathblocks RAM Memory

(18x18)

(Kbits)

912

1104

1826

2586

703

912

1104

1826

2586

703

912

Transceivers

(Lanes)

Transceiver

Speed

3.125 Gbps

User I/Os

195

233

138

207

267

207

267

387

425

161

171

209

138

195

233

138

207

267

207

267

387

267

425

209

233

Status

Production

Preliminary

Production

Preliminary

Production

Planned

Automotive Product Selector Guide

Table continuation...

Family

IGLOO2

Part Number

M2GL025-1FGG484T1

M2GL060-1FGG484T1

M2GL090-1FGG484T1

Package

Size(mm)

23x23

Temperature

Range(°C)

-40 to 135

LEs

27,696

56,520

86,184

Mathblocks RAM Memory

(18x18)

(Kbits)

1104

1826

2586

Transceivers

(Lanes)

Transceiver

Speed

User I/Os

267

Status

Planned

Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products

sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all

performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer’s responsibility to independently determine suitability of any products and to test

and verify the same. The information provided by Microsemi hereunder is provided “as is, where is” and with all faults, and the entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights,

whether with regard to such information itself or anything described by such information. Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products and services at any time without notice.

Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products in-

clude high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solu-

tions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet

ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,600 employees globally. Learn more at www.microsemi.com.

Microsemi Corporate Headquarters

One Enterprise, Aliso Viejo, CA 92656 USA

Within the USA: +1 (800) 713-4113

Outside the USA: +1 (949) 380-6100

Sales: +1 (949) 380-6136

Fax: +1 (949) 215-4996

email: sales.support@microsemi.com

www.microsemi.com

©2015 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are registered trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners.

50200660.1-9-15