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M34519M6-XXXFP

4-BIT CISC SINGLE-CHIP MICROCOMPUTER 720 FAMILY / 4500 SERIES

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Renesas(瑞萨电子)

厂商官网:https://www.renesas.com/

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Renesas(瑞萨电子)
零件包装代码
SSOP
包装说明
SSOP, SOP42,.5,32
针数
42
Reach Compliance Code
compli
具有ADC
YES
其他特性
ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 1.1 MHZ
地址总线宽度
位大小
4
CPU系列
4500
最大时钟频率
6 MHz
DAC 通道
NO
DMA 通道
NO
外部数据总线宽度
JESD-30 代码
R-PDSO-G42
JESD-609代码
e2
长度
17.5 mm
湿度敏感等级
3
I/O 线路数量
35
端子数量
42
最高工作温度
85 °C
最低工作温度
-20 °C
PWM 通道
YES
封装主体材料
PLASTIC/EPOXY
封装代码
SSOP
封装等效代码
SOP42,.5,32
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度)
260
电源
2/5 V
认证状态
Not Qualified
RAM(字节)
192
ROM(单词)
6144
ROM可编程性
MROM
座面最大高度
2.4 mm
速度
6 MHz
最大压摆率
5.6 mA
最大供电电压
5.5 V
最小供电电压
4 V
标称供电电压
5 V
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子面层
TIN COPPER
端子形式
GULL WING
端子节距
0.8 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
20
宽度
8.4 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER
文档预览
REJ09B0175-0100Z
4
4519 Group
User's Manual
RENESAS 4-BIT CISC SINGLE-CHIP MICROCOMPUTER
720 FAMILY / 4500 SERIES
Before using this material, please visit our website to confirm that this is the most
current document available.
Rev. 1.00
Revision date: Aug 06, 2004
www.renesas.com
Keep safety first in your circuit designs!
1.
Renesas Technology Corp. puts the maximum effort into making semiconductor products
better and more reliable, but there is always the possibility that trouble may occur with
them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with ap-
propriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-
flammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1.
2.
3.
4.
5.
6.
7.
8.
These materials are intended as a reference to assist our customers in the selection of the
Renesas Technology Corp. product best suited to the customer's application; they do not
convey any license under any intellectual property rights, or any other rights, belonging to
Renesas Technology Corp. or a third party.
Renesas Technology Corp. assumes no responsibility for any damage, or infringement of
any third-party's rights, originating in the use of any product data, diagrams, charts, pro-
grams, algorithms, or circuit application examples contained in these materials.
All information contained in these materials, including product data, diagrams, charts, pro-
grams and algorithms represents information on products at the time of publication of these
materials, and are subject to change by Renesas Technology Corp. without notice due to
product improvements or other reasons. It is therefore recommended that customers con-
tact Renesas Technology Corp. or an authorized Renesas Technology Corp. product dis-
tributor for the latest product information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other
loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by vari-
ous means, including the Renesas Technology Corp. Semiconductor home page (http://
www.renesas.com).
When using any or all of the information contained in these materials, including product
data, diagrams, charts, programs, and algorithms, please be sure to evaluate all informa-
tion as a total system before making a final decision on the applicability of the information
and products. Renesas Technology Corp. assumes no responsibility for any damage, liabil-
ity or other loss resulting from the information contained herein.
Renesas Technology Corp. semiconductors are not designed or manufactured for use in a
device or system that is used under circumstances in which human life is potentially at
stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology
Corp. product distributor when considering the use of a product contained herein for any
specific purposes, such as apparatus or systems for transportation, vehicular, medical,
aerospace, nuclear, or undersea repeater use.
The prior written approval of Renesas Technology Corp. is necessary to reprint or repro-
duce in whole or in part these materials.
If these products or technologies are subject to the Japanese export control restrictions,
they must be exported under a license from the Japanese government and cannot be im-
ported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/
or the country of destination is prohibited.
Please contact Renesas Technology Corp. for further details on these materials or the
products contained therein.
REVISION HISTORY
Rev.
Date
Page
1.00
Aug 06, 2004
First edition issued
4519 Group User’s Manual
Description
Summary
BEFORE USING THIS USER’S MANUAL
This user’s manual consists of the following three chapters. Refer to the chapter appropriate to your conditions,
such as hardware design or software development.
1. Organization
q
CHAPTER 1 HARDWARE
This chapter describes features of the microcomputer and operation of each peripheral function.
q
CHAPTER 2 APPLICATION
This chapter describes usage and application examples of peripheral functions, based mainly on setting
examples of related registers.
q
CHAPTER 3 APPENDIX
This chapter includes necessary information for systems development using the microcomputer, such
as the electrical characteristics, the list of registers.
As for the Mask ROM confirmation form, the ROM programming confirmation form, and the Mark specification
form which are to be submitted when ordering, refer to the “Renesas Technology Corp.” Hompage (http:/
/www.renesas.com/en/rom).
As for the Development tools and related documents, refer to the Product Info - 4519 Group (http://
www.renesas.com/eng/products/mpumcu/specific/lcd_mcu/expand/e4519.htm) of “Renesas Technology
Corp.” Homepage.
4519 Group
Table of contents
Table of contents
CHAPTER 1 HARDWARE
DESCRIPTION ................................................................................................................................ 1-2
FEATURES ...................................................................................................................................... 1-2
APPLICATION ................................................................................................................................ 1-2
PIN CONFIGURATION .................................................................................................................. 1-2
BLOCK DIAGRAM ......................................................................................................................... 1-3
PERFORMANCE OVERVIEW ....................................................................................................... 1-4
PIN DESCRIPTION ........................................................................................................................ 1-5
MULTIFUNCTION ..................................................................................................................... 1-6
DEFINITION OF CLOCK AND CYCLE ................................................................................. 1-6
PORT FUNCTION .................................................................................................................... 1-7
CONNECTIONS OF UNUSED PINS ..................................................................................... 1-8
PORT BLOCK DIAGRAMS ..................................................................................................... 1-9
FUNCTION BLOCK OPERATIONS ........................................................................................... 1-17
CPU .......................................................................................................................................... 1-17
PROGRAM MEMORY (ROM) ............................................................................................... 1-20
DATA MEMORY (RAM) ......................................................................................................... 1-21
INTERRUPT FUNCTION ....................................................................................................... 1-22
EXTERNAL INTERRUPTS .................................................................................................... 1-26
TIMERS ................................................................................................................................... 1-31
WATCHDOG TIMER .............................................................................................................. 1-45
A/D CONVERTER (COMPARATOR) ................................................................................... 1-47
SERIAL I/O .............................................................................................................................. 1-53
RESET FUNCTION ................................................................................................................ 1-58
VOLTAGE DROP DETECTION CIRCUIT ........................................................................... 1-62
RAM BACK-UP MODE .......................................................................................................... 1-63
CLOCK CONTROL ................................................................................................................. 1-68
ROM ORDERING METHOD ....................................................................................................... 1-71
LIST OF PRECAUTIONS ............................................................................................................ 1-72
CONTROL REGISTERS .............................................................................................................. 1-78
INSTRUCTIONS ............................................................................................................................ 1-85
SYMBOL .................................................................................................................................. 1-85
INDEX LIST OF INSTRUCTION FUNCTION ..................................................................... 1-86
MACHINE INSTRUCTIONS (INDEX BY ALPHABET) ....................................................... 1-91
MACHINE INSTRUCTIONS (INDEX BY TYPES) ............................................................ 1-130
INSTRUCTION CODE TABLE ............................................................................................ 1-146
BUILT-IN PROM VERSION ...................................................................................................... 1-148
Rev.1.00 Aug 06, 2004
REJ09B0175-0100Z
i
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参数对比
与M34519M6-XXXFP相近的元器件有:4519、4519_M、M34519M8-XXXFP、M34519E8FP。描述及对比如下:
型号 M34519M6-XXXFP 4519 4519_M M34519M8-XXXFP M34519E8FP
描述 4-BIT CISC SINGLE-CHIP MICROCOMPUTER 720 FAMILY / 4500 SERIES 4-BIT CISC SINGLE-CHIP MICROCOMPUTER 720 FAMILY / 4500 SERIES 4-BIT CISC SINGLE-CHIP MICROCOMPUTER 720 FAMILY / 4500 SERIES 4-BIT CISC SINGLE-CHIP MICROCOMPUTER 720 FAMILY / 4500 SERIES 4-BIT CISC SINGLE-CHIP MICROCOMPUTER 720 FAMILY / 4500 SERIES
厂商名称 Renesas(瑞萨电子) - - Renesas(瑞萨电子) Renesas(瑞萨电子)
零件包装代码 SSOP - - SSOP SSOP
包装说明 SSOP, SOP42,.5,32 - - SSOP, SOP42,.5,32 0.450 INCH, 0.80 MM PITCH, PLASTIC, SSOP-42
针数 42 - - 42 42
Reach Compliance Code compli - - unknow compli
具有ADC YES - - YES YES
其他特性 ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 1.1 MHZ - - ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 1.1 MHZ ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 2.2 MHZ
位大小 4 - - 4 4
CPU系列 4500 - - 4500 4500
最大时钟频率 6 MHz - - 6 MHz 6 MHz
DAC 通道 NO - - NO NO
DMA 通道 NO - - NO NO
JESD-30 代码 R-PDSO-G42 - - R-PDSO-G42 R-PDSO-G42
长度 17.5 mm - - 17.5 mm 17.5 mm
I/O 线路数量 35 - - 35 35
端子数量 42 - - 42 42
最高工作温度 85 °C - - 85 °C 85 °C
最低工作温度 -20 °C - - -20 °C -20 °C
PWM 通道 YES - - YES YES
封装主体材料 PLASTIC/EPOXY - - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SSOP - - SSOP SSOP
封装等效代码 SOP42,.5,32 - - SOP42,.5,32 SOP42,.5,32
封装形状 RECTANGULAR - - RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, SHRINK PITCH - - SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
电源 2/5 V - - 2/5 V 3/5 V
认证状态 Not Qualified - - Not Qualified Not Qualified
RAM(字节) 192 - - 192 192
ROM(单词) 6144 - - 8192 8192
ROM可编程性 MROM - - MROM OTPROM
座面最大高度 2.4 mm - - 2.4 mm 2.4 mm
速度 6 MHz - - 6 MHz 6 MHz
最大压摆率 5.6 mA - - 5.6 mA 5.6 mA
最大供电电压 5.5 V - - 5.5 V 5.5 V
最小供电电压 4 V - - 4 V 4 V
标称供电电压 5 V - - 5 V 5 V
表面贴装 YES - - YES YES
技术 CMOS - - CMOS CMOS
温度等级 OTHER - - OTHER OTHER
端子形式 GULL WING - - GULL WING GULL WING
端子节距 0.8 mm - - 0.8 mm 0.8 mm
端子位置 DUAL - - DUAL DUAL
宽度 8.4 mm - - 8.4 mm 8.4 mm
uPs/uCs/外围集成电路类型 MICROCONTROLLER - - MICROCONTROLLER MICROCONTROLLER
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