型号
- 型号
- 关键词
Synchronous DRAM Module, 16MX64, 6ns, CMOS, MICRO, SODIMM-144
厂商名称：SAMSUNG(三星)
厂商官网：http://www.samsung.com/Products/Semiconductor/
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| 型号 | M463S1654CT1-L1L | M463S1654CT1-L1H | M463S1654CT1-C7A | M463S1654CT1-L7A | M463S1654CT1-C7C | M463S1654CT1-L7C | M463S1654CT1-C1L | M463S1654CT1-C1H |
|---|---|---|---|---|---|---|---|---|
| 描述 | Synchronous DRAM Module, 16MX64, 6ns, CMOS, MICRO, SODIMM-144 | Synchronous DRAM Module, 16MX64, 6ns, CMOS, MICRO, SODIMM-144 | Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, MICRO, SODIMM-144 | Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, MICRO, SODIMM-144 | Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, MICRO, SODIMM-144 | Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, MICRO, SODIMM-144 | Synchronous DRAM Module, 16MX64, 6ns, CMOS, MICRO, SODIMM-144 | Synchronous DRAM Module, 16MX64, 6ns, CMOS, MICRO, SODIMM-144 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | MODULE | MODULE | MODULE | MODULE | MODULE | MODULE | MODULE | MODULE |
| 包装说明 | DIMM, DIMM144,20 | DIMM, DIMM144,20 | DIMM, DIMM144,20 | DIMM, DIMM144,20 | DIMM, DIMM144,20 | DIMM, DIMM144,20 | DIMM, DIMM144,20 | DIMM, DIMM144,20 |
| 针数 | 144 | 144 | 144 | 144 | 144 | 144 | 144 | 144 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST |
| 最长访问时间 | 6 ns | 6 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 6 ns | 6 ns |
| 其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| 最大时钟频率 (fCLK) | 100 MHz | 100 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 100 MHz | 100 MHz |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 |
| 内存密度 | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1073741824 bit |
| 内存集成电路类型 | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
| 内存宽度 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 144 | 144 | 144 | 144 | 144 | 144 | 144 | 144 |
| 字数 | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
| 字数代码 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 16MX64 | 16MX64 | 16MX64 | 16MX64 | 16MX64 | 16MX64 | 16MX64 | 16MX64 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
| 封装等效代码 | DIMM144,20 | DIMM144,20 | DIMM144,20 | DIMM144,20 | DIMM144,20 | DIMM144,20 | DIMM144,20 | DIMM144,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 峰值回流温度（摄氏度） | 225 | 225 | 225 | 225 | 225 | 225 | 225 | 225 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 |
| 自我刷新 | YES | YES | YES | YES | YES | YES | YES | YES |
| 最大待机电流 | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A |
| 最大压摆率 | 0.76 mA | 0.76 mA | 0.8 mA | 0.8 mA | 0.88 mA | 0.88 mA | 0.76 mA | 0.76 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 厂商名称 | SAMSUNG(三星) | - | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
