May. 2010
DDR3 SDRAM Memory
Product Guide
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or other-
wise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or
similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions
may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
ⓒ
2010 Samsung Electronics Co., Ltd. All rights reserved.
-1-
Product Guide
1. DDR3 SDRAM MEMORY ORDERING INFORMATION
1
2
3
4
5
6
7
8
May. 2010
DDR3 SDRAM Memory
9
10
11
K 4 B X X X X X X X - X X X X
SAMSUNG Memory
DRAM
DRAM Type
Density
Bit Organization
Speed
Temp & Power
Package Type
Revision
Interface (V
DD
, V
DDQ
)
# of Internal Banks
1. SAMSUNG Memory : K
7. Interface ( V
DD
, V
DDQ
)
6
:
SSTL (1.5V, 1.5V)
2. DRAM : 4
8. Revision
3. DRAM Type
B
:
DDR3 SDRAM
M
A
B
C
D
E
F
G
H
:
1st Gen.
:
2nd Gen.
:
3rd Gen.
:
4th Gen.
:
5th Gen.
:
6th Gen.
:
7th Gen
:
8th Gen
:
9th Gen
4. Density
51
:
512Mb
1G
:
1Gb
2G
:
2Gb
4G
:
4Gb
9. Package Type
5. Bit Organization
04
:
x 4
08
:
x 8
16
:
x16
Z
H
J
M
:
:
:
:
FBGA (Lead-free)
FBGA (Halogen-free & Lead-free)
FBGA (Lead-free, DDP)
FBGA (Halogen-free & Lead-free, DDP)
10. Temp & Power
C
:
Commercial Temp.( 0°C ~ 85°C) & Normal Power
L
:
Commercial Temp.( 0°C ~ 85°C) & Low Power
Y
:
Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
6. # of Internal Banks
3
:
4 Banks
4
:
8 Banks
5
:
16 Banks
11. Speed
F7
:
DDR3-800
F8
:
DDR3-1066
H9
:
DDR3-1333
K0
:
DDR3-1600
(400MHz @ CL=6, tRCD=6, tRP=6)
(533MHz @ CL=7, tRCD=7, tRP=7)
(667MHz @ CL=9, tRCD=9, tRP=9)
(800MHz @ CL=11, tRCD=11, tRP=11)
-2-
Product Guide
2. DDR3 SDRAM Component Product Guide
Density
Banks
Part Number
K4B1G0446E
K4B1G0846E
1Gb E-die
8Banks
K4B1G1646E
K4B1G0446E
K4B1G0846E
K4B1G0446F
1Gb F-die
8Banks
K4B1G0846F
K4B1G0446F
K4B1G0846F
K4B2G0446B
K4B2G0846B
2Gb B-die
8Banks
K4B2G1646B
K4B2G0446B
K4B2G0846B
K4B2G0446C
2Gb C-die
8Banks
K4B2G0846C
K4B2G0446C
K4B2G0846C
DDP 2Gb E-die
8Banks
K4B2G0446E
K4B2G0846E
K4B4G0446A
4Gb A-die
May. 2010
DDR3 SDRAM Memory
Package & Power,
Temp. (-C/-L) & Speed
HC(L)F7/F8/H9/K0
HC(L)F7/F8/H9/K0
HC(L)F7/F8/H9/K0
HYF7/F8/H9
HYF7/F8/H9
HC(L)F8/H9/K0
HC(L)F8/H9/K0
HY(L)F8/H9
HY(L)F8/H9
HC(L)F7/F8/H9
HC(L)F7/F8/H9
HC(L)F7/F8/H9
HYF7/F8/H9
HYF7/F8/H9
HC(L)F8/H9/K0
HC(L)F8/H9/K0
HY(L)F8/H9
HY(L)F8/H9
MC(L)F7/F8/H9
MC(L)F7/F8/H9
HC(L)F8/H9/K0
HC(L)F8/H9/K0
HY(L)F8/H9/K0
HY(L)F8/H9/K0
MC(L)F7/F8/H9
MC(L)F7/F8/H9
MC(L)F7/F8/H9
MC(L)F7/F8/H9
Org.
256M x 4
128M x 8
64M x 16
256M x 4
128M x 8
256M x 4
128M x 8
256M x 4
128M x 8
512M x 4
256M x 8
128M x 16
512M x 4
256M x 8
512M x 4
256M x 8
512M x 4
256M x 8
512M x 4
256M x 8
1G x 4
512M x 8
1G x 4
512M x 8
1G x 4
512M x 8
1G x 4
512M x 8
1.35V
1.5V
1.35V
1.5V
VDD Voltage
PKG
78 ball
FBGA
96 ball
FBGA
78 ball
FBGA
Now
Avail.
NOTE
1.5V
78 ball
FBGA
1.35V
78 ball
FBGA
96 ball
FBGA
78 ball
FBGA
Now
Now
1.5V
78 ball
FBGA
1.35V
78 ball
FBGA
Now
1.5V
Now
8Banks
K4B2G0846A
K4B4G0446A
K4B2G0846A
1.5V
78 ball
FBGA
Now
1.35V
78 ball
FBGA
78 ball
FBGA
DDP 4Gb B-die
8Banks
K4B4G0446B
K4B2G0846B
K4B4G0446C
K4B2G0846C
1.5V
Now
DDP 4Gb C-die
8Banks
1.5V
Feb.’10
*
NOTE
: 1.35V product is 1.5V operatable.
-3-
Product Guide
3. DDR3 SDRAM Module Ordering Information
1
2
3
4
5
6
7
8
9
10
May. 2010
DDR3 SDRAM Memory
11
12
M X X X B X X X X X X X - X X X
Memory Module
DIMM Type
Data bits
DRAM Component Type
Depth
# of Banks in Comp. & Interface
Bit Organization
1. Memory Module : M
8. Component Revision
M
:
1st Gen.
B
:
3rd Gen.
D
:
5th Gen.
F
:
7th Gen.
Speed
Temp & Power
PCB Revision
Package
Component Revision
2. DIMM Type
3
:
DIMM
4
:
SODIMM
3. Data Bits
71 :
78 :
91 :
92 :
93 :
x64
x64
x72
x72
x72
204pin Unbuffered SODIMM
240pin Unbuffered DIMM
240pin ECC unbuffered DIMM
240pin VLP Registered DIMM
240pin Registered DIMM
A
C
E
G
:
:
:
:
2nd Gen.
4th Gen.
6th Gen.
8th Gen.
9. Package
:
FBGA(Lead-free)
Z
:
FBGA(Lead-free & Halogen-free)
H
:
FBGA(Lead-free, DDP)
J
M
:
FBGA(Lead-free & Halogen-free, DDP)
10. PCB Revision
0
:
None
2
:
2nd Rev.
4
:
4th Rev.
1
:
1st Rev.
3
:
3rd Rev.
S
:
Reduced Layer
4. DRAM Component Type
B
:
DDR3 SDRAM (1.5V VDD)
5. Depth
32
:
32M
64
:
64M
28
:
128M
56
:
256M
51
:
512M
1G
:
1G
2G
:
2G
33
65
29
57
52
1K
2K
:
32M (for 128Mb/512Mb)
:
64M (for 128Mb/512Mb)
:
128M (for 128Mb/512Mb)
:
256M (for 512Mb/2Gb)
:
512M (for 512Mb/2Gb)
:
1G (for 2Gb)
:
2G (for 2Gb)
11. Temp & Power
C
:
Commercial Temp.( 0°C ~ 85°C) & Normal Power
Y
:
Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
6. # of Banks in comp. & Interface
7
:
8Banks & SSTL-1.5V
12. Speed
F7
:
DDR3-800
F8
:
DDR3-1066
H9
:
DDR3-1333
K0
:
DDR3-1600
(400MHz @ CL=6, tRCD=6, tRP=6)
(533MHz @ CL=7, tRCD=7, tRP=7)
(667MHz @ CL=9, tRCD=9, tRP=9)
(800MHz @ CL=11, tRCD=11, tRP=11)
NOTE:
PC3-6400(DDR3-800),PC3-8500(DDR3-1066),
PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)
7. Bit Organization
0
:
x4
3
:
x8
4
:
x16
-4-
Product Guide
4. DDR3 SDRAM Module Product Guide
4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product)
240Pin DDR3 Unbuffered DIMM
Org.
128Mx 64
Density
1GB
Part Number
M378B2873EH1
M378B2873FH0
M391B2873EH1
M391B2873FH0
M378B5673EH1
256Mx 64
2GB
M378B5673FH0
M378B5773CH0
M391B5673EH1
256Mx 72
2GB
M391B5673FH0
M391B5773CH0
512Mx 64
4GB
M378B5273BH1
M378B5273CH0
M391B5273BH1
M391B5273CH0
M378B1G73AH0
M391B1G73AH0
Speed
CF8/H9
CF8/H9/K0*
CF8/H9
CF8/H9/K0*
CF8/H9
CF8/H9/K0*
CF8/H9/K0*
CF8/H9
CF8/H9/K0*
CF8/H9/K0*
CF8/H9
CF8/H9/K0*
CF8/H9
CF8/H9/K0*
CF8/H9/K0*
CF8/H9/K0*
Raw Card
A(1Rx8)
Composition
128M x 8 * 8 pcs
128M x 8 * 8 pcs
128M x 8 * 9 pcs
128M x 8 * 9 pcs
128M x 8 * 16 pcs
128M x 8 * 16 pcs
256M x 8 * 8 pcs
128M x 8 * 18 pcs
128M x 8 * 18 pcs
256M x 8 * 9 pcs
256M x 8 * 16 pcs
256M x 8 * 16 pcs
256M x 8 * 18 pcs
256M x 8 * 18 pcs
512M x 8 * 16 pcs
512M x 8 * 18 pcs
Comp.
Version
1Gb
1Gb
1Gb
1Gb
1Gb
1Gb
2Gb
1Gb
1Gb
2Gb
2Gb
2Gb
2Gb
2Gb
4Gb
4Gb
E-die
F-die
E-die
F-die
E-die
F-die
C-die
E-die
F-die
C-die
B-die
C-die
B-die
C-die
A-die
A-die
May. 2010
DDR3 SDRAM Memory
Internal
Banks
8
Rank
1
PKG
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
Height
30mm
Avail.
Now
NOTE
128Mx 72
1GB
D(1Rx8)
8
1
30mm
Now
B(2Rx8)
A(1Rx8)
E(2Rx8)
D(1Rx8)
B(2Rx8)
8
8
2
1
2
1
30mm
Now
8
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
30mm
Now
8
2
30mm
Now
512Mx 72
1Gx 64
1Gx 72
4GB
8GB
8GB
E(2Rx8)
B(2Rx8)
E(2Rx8)
8
8
8
2
2
2
30mm
30mm
30mm
Now
Now
Now
*
NOTE
: K0(1600Mbps) will be available by ES level
4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product)
240Pin DDR3 Unbuffered DIMM
Org.
128Mx 72
Density
1GB
Part Number
M391B2873EH1
M391B2873FH0
M391B5673EH1
256Mx 72
2GB
M391B5673FH0
M391B5773CH0
512Mx 72
1Gx 72
4GB
8GB
M391B5273BH1
M391B5273CH0
M391B1G73AH0
Speed
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
Raw Card
D(1Rx8)
Composition
128M x 8 * 9 pcs
128M x 8 * 9 pcs
128M x 8 * 18 pcs
128M x 8 * 18 pcs
256M x 8 * 9 pcs
256M x 8 * 18 pcs
256M x 8 * 18 pcs
512M x 8 * 18 pcs
Comp.
Version
1Gb
1Gb
1Gb
1Gb
2Gb
2Gb
2Gb
4Gb
E-die
F-die
E-die
F-die
C-die
B-die
C-die
A-die
Internal
Banks
8
Rank
1
PKG
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
Height
30mm
Avail.
Now
NOTE
E(2Rx8)
D(1Rx8)
E(2Rx8)
E(2Rx8)
8
8
8
8
2
1
2
2
30mm
Now
30mm
30mm
Now
Now
*
NOTE
: 1.35V product is 1.5V operatable.
-5-
