RAD HARD DUAL J-K FLIP FLOP WITH PRESET AND CLEAR
厂商名称:ST(意法半导体)
厂商官网:http://www.st.com/
下载文档型号 | M54HC73D1 | M54HC73D | M54HC73 | M54HC73_04 | M54HC73K | M54HC73K1 |
---|---|---|---|---|---|---|
描述 | RAD HARD DUAL J-K FLIP FLOP WITH PRESET AND CLEAR | RAD HARD DUAL J-K FLIP FLOP WITH PRESET AND CLEAR | RAD HARD DUAL J-K FLIP FLOP WITH PRESET AND CLEAR | RAD HARD DUAL J-K FLIP FLOP WITH PRESET AND CLEAR | RAD HARD DUAL J-K FLIP FLOP WITH PRESET AND CLEAR | RAD HARD DUAL J-K FLIP FLOP WITH PRESET AND CLEAR |
是否无铅 | 含铅 | 含铅 | - | - | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | - | - | 不符合 | 不符合 |
厂商名称 | ST(意法半导体) | ST(意法半导体) | - | - | ST(意法半导体) | ST(意法半导体) |
零件包装代码 | DIP | DIP | - | - | DFP | DFP |
包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | - | - | DFP, FL14,.3 | DFP, FL14,.3 |
针数 | 14 | 14 | - | - | 14 | 14 |
Reach Compliance Code | _compli | _compli | - | - | _compli | _compli |
系列 | HC/UH | HC/UH | - | - | HC/UH | HC/UH |
JESD-30 代码 | R-CDIP-T14 | R-CDIP-T14 | - | - | R-CDFP-F14 | R-CDFP-F14 |
JESD-609代码 | e0 | e0 | - | - | e0 | e0 |
长度 | 19 mm | 19 mm | - | - | 9.95 mm | 9.95 mm |
负载电容(CL) | 50 pF | 50 pF | - | - | 50 pF | 50 pF |
逻辑集成电路类型 | J-K FLIP-FLOP | J-K FLIP-FLOP | - | - | J-K FLIP-FLOP | J-K FLIP-FLOP |
最大频率@ Nom-Su | 20000000 Hz | 20000000 Hz | - | - | 20000000 Hz | 20000000 Hz |
最大I(ol) | 0.004 A | 0.004 A | - | - | 0.004 A | 0.004 A |
位数 | 2 | 2 | - | - | 2 | 2 |
功能数量 | 2 | 2 | - | - | 2 | 2 |
端子数量 | 14 | 14 | - | - | 14 | 14 |
最高工作温度 | 125 °C | 125 °C | - | - | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | - | - | -55 °C | -55 °C |
输出极性 | COMPLEMENTARY | COMPLEMENTARY | - | - | COMPLEMENTARY | COMPLEMENTARY |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | - | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP | DIP | - | - | DFP | DFP |
封装等效代码 | DIP14,.3 | DIP14,.3 | - | - | FL14,.3 | FL14,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | - | - | FLATPACK | FLATPACK |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED |
电源 | 2/6 V | 2/6 V | - | - | 2/6 V | 2/6 V |
Prop。Delay @ Nom-Su | 38 ns | 38 ns | - | - | 38 ns | 38 ns |
传播延迟(tpd) | 190 ns | 190 ns | - | - | 190 ns | 190 ns |
认证状态 | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 6 V | 6 V | - | - | 6 V | 6 V |
最小供电电压 (Vsup) | 2 V | 2 V | - | - | 2 V | 2 V |
标称供电电压 (Vsup) | 4.5 V | 4.5 V | - | - | 4.5 V | 4.5 V |
表面贴装 | NO | NO | - | - | YES | YES |
技术 | CMOS | CMOS | - | - | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | - | - | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | TIN LEAD | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | - | - | FLAT | FLAT |
端子节距 | 2.54 mm | 2.54 mm | - | - | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | - | - | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED |
总剂量 | 50k Rad(Si) V | 50k Rad(Si) V | - | - | 50k Rad(Si) V | 50k Rad(Si) V |
触发器类型 | NEGATIVE EDGE | NEGATIVE EDGE | - | - | NEGATIVE EDGE | NEGATIVE EDGE |
宽度 | 7.62 mm | 7.62 mm | - | - | 6.91 mm | 6.91 mm |
最小 fmax | 24 MHz | 24 MHz | - | - | 24 MHz | 24 MHz |