State of the Art, Inc.
Precision Thin Film Chip Resistor
MIL-PRF-55342/09 Solderable RM2512
5.6Ω to 1 MΩ
0.1, 0.25, 0.5, 1, 2, 5, 10
25, 50, 100
1000 mW
200 V
-65 to 150°C
M, P, R, S, U, V, T
Noise
c
d
a
b
e
Performance
Resistance Range*
Tolerances (± %)*
TCR (± ppm/°C)*
Power Rating
Voltage Rating
Operating Range
Product Levels
0
Noise (dB)
-10
-20
-30
-40
125
100
75
50
25
0
0
1.0
2.0 3.0 4.0
Power (W)
5.0
ceramic board
Power Dissipation
fiber epoxy board
*see QPL55342 for part number availability
1
1k
1M
Resistance Value (Ω)
Maximum Allowable Drift
Temperature Characteristic
TCR (ppm/°C)
Thermal Shock
Power Conditioning
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Moisture Resistance
Life (Qualification)
Life (FR Level)
Resistance to Soldering Heat
Resistance to Bonding Exposure
E
±25
±0.1%
±0.2%
±0.1%
±0.1%
±0.1%
±0.2%
±0.5%
±2.0%
±0.2%
±0.2%
H
±50
±0.25%
±0.25%
±0.25%
±0.1%
±0.2%
±0.4%
±0.5%
±2.0%
±0.25%
±0.25%
K
±100
±0.5%
±0.5%
±0.25%
±0.25%
±0.5%
±0.5%
±0.5%
±2.0%
±0.25%
±0.25%
0.5
Drift (|%∆R|)
0.4
0.3
0.2
0.1
0
0
2k
Life Test
Percent Power
100
75
50
25
0
Temperature Rise (°C)
Power Derating
4k 6k
Hours
8k
10k
-10
70
150
Ambient Temperature (°C)
Part Number
M55342E09B100AS -TR
Packaging: -TR: Tape & Reel
Product Level (/1000 hrs.): M: 1%
Resistance Value and Tolerance:
Three numerals and a letter indicating
decimal, value range, and tolerance
-W: Waffle Tray
P: 0.1%
R & U: 0.01%
S & V: 0.001%
T: Space 0.001%
Ω: A: 0.1% R: 0.25% W: 0.5% D: 1% G: 2% J: 5% M: 10%
kΩ: B: 0.1% U: 0.25% Y: 0.5% E: 1% H: 2% K: 5% N: 10%
MΩ: C: 0.1% V: 0.25% Z: 0.5% F: 1% T: 2% L: 5% P: 10%
Termination Material: B: Solderable (SnPb solder over nickel)
Size: 09: RM2512
Temperature Characteristic (ppm/°C): E: ±25
Performance Specification MIL-PRF-55342
H: ±50
K: ±100
Mechanical
Length (a)
Width (b)
Thickness (c)
Top Termination (d)
Bottom Termination (e)
Approximate Weight
Inches
.260(.244 - .268)
.122(.119 - .129)
.028(.015 - .033)
.019(.015 - .025)
.021(.015 - .025)
0.05130 g
Millimeters
6.60(6.20 - 6.81)
3.10(3.02 - 3.28)
0.71(0.38 - 0.84)
0.48(0.38 - 0.64)
0.53(0.38 - 0.64)
.310
Recommended
Minimum
Bond Pads
(inches)
.051
.209
.128
State of the Art, Inc.
www.resistor.com
Specifications Subject to Change Without Notice
2470 Fox Hill Road, State College, PA, USA 16803-1797
Telephone: 814-355-8004 Toll Free: 800-458-3401 Fax: 814-355-2714
All Products Made in the USA
Copyright 2016 by State of the Art, Inc.
FPGA/CPLD