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M55342M09G165EC-TR

Fixed Resistor, Metal Glaze/thick Film, 1W, 165000ohm, 200V, 1% +/-Tol, 300ppm/Cel, Surface Mount, 2512, CHIP

器件类别:无源元件    电阻器   

厂商名称:State of the Art Inc

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
State of the Art Inc
包装说明
CHIP
Reach Compliance Code
compli
ECCN代码
EAR99
构造
Chi
JESD-609代码
e4
制造商序列号
M55342/09
安装特点
SURFACE MOUNT
端子数量
2
最高工作温度
150 °C
最低工作温度
-65 °C
封装高度
0.71 mm
封装长度
6.35 mm
封装形状
RECTANGULAR PACKAGE
封装形式
SMT
封装宽度
3.02 mm
包装方法
TR
额定功率耗散 (P)
1 W
额定温度
70 °C
参考标准
MIL-PRF-55342
电阻
165000 Ω
电阻器类型
FIXED RESISTOR
系列
M55342/09-THICKFILM
尺寸代码
2512
表面贴装
YES
技术
METAL GLAZE/THICK FILM
温度系数
300 ppm/°C
端子面层
Gold (Au)
端子形状
WRAPAROUND
容差
1%
工作电压
200 V
文档预览
State of the Art, Inc.
Thick Film Chip Resistor
M55342/09 RM2512
GLASS
PASSIVATION
WRAPAROUND
TERMINATIONS
RESISTOR
FILM
96% ALUMINA CHIP
PERFORMANCE
TEMPERATURE RISE (°C)
Resistance Range
Tolerances
Maximum Power
Maximum Voltage
1
W
- 22M
W
1%, 2%, 5%, 10%
1000 mW
200 Volts
CHARACTERISTICS*
M
K
±100
±0.5%
±0.25%
±0.25%
±0.25%
±0.5%
±0.5%
±0.5%
±300
±0.5%
±0.5%
±0.5%
±0.25%
±0.5%
±2.0%
±1.0%
CURRENT NOISE
POWER DISSIPATION
fiber epoxy board
ceramic board
TESTS
TCR (-55 to +125
°
C) in ppm/
°
C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours
High Temperature Exposure
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
PART NUMBERING
M55342 K 09 B 100D S - TR
PACKAGING CODE: TR = Tape & Reel W= Waffle Pack
PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ER
RESISTANCE AND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
D: 1%
W
E: 1% K
W
F: 1% M
W
G: 2%
W
H: 2% K
W
T: 2% M
W
J: 5%
W
K: 5% K
W
L: 5% M
W
M: 10%
W
N: 10% K
W
P: 10% M
W
TERMINATION MATERIALS:
B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound
W: Gold wire bondable
G: Gold wraparound
SIZE CODE: /09 = RM2512
TEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppm
PERFORMANCE SPECIFICATION MIL-PRF-55342
MECHANICAL
INCHES
MILLIMETERS
.300
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.250 (.244 - .268)
.119 (.119 - .129)
.028 (.015 - .033)
.020 (.015 - .025)
.019 (.015 - .025)
.212 (.208 - .216)
.0513 grams
6.35
3.02
0.71
0.51
0.48
5.39
(6.20 - 6.81)
(3.02 - 3.28)
(0.38 - 0.84)
(0.38 - 0.64)
(0.38 - 0.64)
(5.28 - 5.49)
.125
.202
.049
State of the Art, Inc.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401
“Specifications subject to change without notice.”
www.resistor.com
04/09/08
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