型号
- 型号
- 关键词
512KX32 FLASH 3V PROM, 100ns, PBGA80, 10 X 12 MM, 1 MM PITCH, LBGA-80
厂商名称：ST(意法半导体)
厂商官网：http://www.st.com/
器件标准：
| 型号 | M58BW016BB100ZA6 | M58BW016BB80T6 | M58BW016BB100T6 | 54F244 | M58BW016BT100T3 | M58BW016BB80ZA6 | M58BW016BB90ZA6 | M58BW016BB90T6 |
|---|---|---|---|---|---|---|---|---|
| 描述 | 512KX32 FLASH 3V PROM, 100ns, PBGA80, 10 X 12 MM, 1 MM PITCH, LBGA-80 | 512KX32 FLASH 3V PROM, 80ns, PQFP80, PLASTIC, QFP-80 | 512KX32 FLASH 3V PROM, 100ns, PQFP80, PLASTIC, QFP-80 | Octal Buffers/Line Drivers with TRI-STATE(RM) Outputs | 512KX32 FLASH 3V PROM, 100ns, PQFP80, PLASTIC, QFP-80 | 512KX32 FLASH 3V PROM, 80ns, PBGA80, 10 X 12 MM, 1 MM PITCH, LBGA-80 | 512KX32 FLASH 3V PROM, 90ns, PBGA80, 10 X 12 MM, 1 MM PITCH, LBGA-80 | 512KX32 FLASH 3V PROM, 90ns, PQFP80, PLASTIC, QFP-80 |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | - | 不符合 | 符合 | 符合 | 不符合 |
| 厂商名称 | ST(意法半导体) | ST(意法半导体) | - | - | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
| 零件包装代码 | BGA | QFP | QFP | - | QFP | BGA | BGA | QFP |
| 包装说明 | 10 X 12 MM, 1 MM PITCH, LBGA-80 | PLASTIC, QFP-80 | PLASTIC, QFP-80 | - | PLASTIC, QFP-80 | 10 X 12 MM, 1 MM PITCH, LBGA-80 | 10 X 12 MM, 1 MM PITCH, LBGA-80 | PLASTIC, QFP-80 |
| 针数 | 80 | 80 | 80 | - | 80 | 80 | 80 | 80 |
| Reach Compliance Code | unknown | not_compliant | not_compliant | - | not_compliant | unknown | unknown | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 100 ns | 80 ns | 100 ns | - | 100 ns | 80 ns | 90 ns | 90 ns |
| 其他特性 | BOTTOM BOOT BLOCK | BOTTOM BOOT BLOCK | BOTTOM BOOT BLOCK | - | TOP BOOT BLOCK | BOTTOM BOOT BLOCK | BOTTOM BOOT BLOCK | BOTTOM BOOT BLOCK |
| 启动块 | BOTTOM | BOTTOM | BOTTOM | - | TOP | BOTTOM | BOTTOM | BOTTOM |
| 命令用户界面 | YES | YES | YES | - | YES | YES | YES | YES |
| 通用闪存接口 | YES | YES | YES | - | YES | YES | YES | YES |
| 数据轮询 | NO | NO | NO | - | NO | NO | NO | NO |
| JESD-30 代码 | R-PBGA-B80 | R-PQFP-G80 | R-PQFP-G80 | - | R-PQFP-G80 | R-PBGA-B80 | R-PBGA-B80 | R-PQFP-G80 |
| JESD-609代码 | e1 | e0 | e0 | - | e0 | e1 | e1 | e0 |
| 长度 | 12 mm | 20 mm | 20 mm | - | 20 mm | 12 mm | 12 mm | 20 mm |
| 内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | - | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | - | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 32 | 32 | 32 | - | 32 | 32 | 32 | 32 |
| 功能数量 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 部门数/规模 | 8,31 | 8,31 | 8,31 | - | 8,31 | 8,31 | 8,31 | 8,31 |
| 端子数量 | 80 | 80 | 80 | - | 80 | 80 | 80 | 80 |
| 字数 | 524288 words | 524288 words | 524288 words | - | 524288 words | 524288 words | 524288 words | 524288 words |
| 字数代码 | 512000 | 512000 | 512000 | - | 512000 | 512000 | 512000 | 512000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | - | 125 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 512KX32 | 512KX32 | 512KX32 | - | 512KX32 | 512KX32 | 512KX32 | 512KX32 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LBGA | QFP | QFP | - | QFP | LBGA | LBGA | QFP |
| 封装等效代码 | BGA80,8X10,40 | QFP80,.7X.9,32 | QFP80,.7X.9,32 | - | QFP80,.7X.9,32 | BGA80,8X10,40 | BGA80,8X10,40 | QFP80,.7X.9,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE | FLATPACK | FLATPACK | - | FLATPACK | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | FLATPACK |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 2.5/3.3,3/3.3 V | 2.5/3.3,3/3.3 V | 2.5/3.3,3/3.3 V | - | 2.5/3.3,3/3.3 V | 2.5/3.3,3/3.3 V | 2.5/3.3,3/3.3 V | 2.5/3.3,3/3.3 V |
| 编程电压 | 3 V | 3 V | 3 V | - | 3 V | 3 V | 3 V | 3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.7 mm | 3.4 mm | 3.4 mm | - | 3.4 mm | 1.7 mm | 1.7 mm | 3.4 mm |
| 部门规模 | 2K,16K | 2K,16K | 2K,16K | - | 2K,16K | 2K,16K | 2K,16K | 2K,16K |
| 最大待机电流 | 0.000005 A | 0.000005 A | 0.000005 A | - | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A |
| 最大压摆率 | 0.03 mA | 0.03 mA | 0.03 mA | - | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | - | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | - | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | Tin/Lead (Sn85Pb15) |
| 端子形式 | BALL | GULL WING | GULL WING | - | GULL WING | BALL | BALL | GULL WING |
| 端子节距 | 1 mm | 0.8 mm | 0.8 mm | - | 0.8 mm | 1 mm | 1 mm | 0.8 mm |
| 端子位置 | BOTTOM | QUAD | QUAD | - | QUAD | BOTTOM | BOTTOM | QUAD |
| 切换位 | NO | NO | NO | - | NO | NO | NO | NO |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | - | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 宽度 | 10 mm | 14 mm | 14 mm | - | 14 mm | 10 mm | 10 mm | 14 mm |