M5M29GB640VP
FEATURES
67,108,864-BIT(8,388,608 - WORD BY 8-BIT / 4,194,304 - WORD BY 16-BIT)
3.3V
ONLY FLASH MEMORY
FEATURES
• Single power supply operation
- 3.0V only operation for read, erase and program
operation
- VCC=VPP=2.7~3.6V
- VCC=12 fast production programming
- 1.65V~2.5V or 2.7V~3.6V I/O Option (VCCQ)
- Operating temperature:-40°
C~85°
C
• Fast access time : 90/120ns
• Low power consumption
- 9mA maximum active read current, f=5MHz (CMOS
input)
- 21mA program erase current maximum
(VPP=1.65~3.6V)
- 7uA typical standby current under power saving
mode
• Sector architecture
- Sector Erase (Sector structure : 4Kword x 2 (boot
sectors), 4Kword x 6 (parameter sectors), 32Kword x
7 (parameter sectors)
• Automatic Suspend Enhance
- Word/byte write suspend to read
- Sector erase suspend to word/byte write
- Sector erase suspend to read register report
• Automatic sector erase, full chip erase, word write and
sector lock/unlock configuration
• Status Reply
- Detection of program and erase operation comple-
tion.
- Command User Interface (CUI)
- Status Register (SR)
• Data Protection Performance
- Include boot sectors and parameter and main sectors
to be block/unblock
• 100,000 minimum erase/program cycles
• Common Flash Interface (CFI)
•
64-bit
Protection Register
Latch-up protected to 100mA from -1V to VCC+1V
- Top Boot
• Auto Erase (chip & sector) and Auto Program
- Automatically program and verify data at specified
address
A15
A14
A13
A12
A11
A10
A9
A8
A21
A20
WE
RP
NC
WP
A19
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
• Package type:
- 48-pin TSOP (12mm x 20mm)
M5M29GB640VP
1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
VCCQ
GND
Q15
Q7
Q14
Q6
Q13
Q5
Q12
Q4
VCC
Q11
Q3
Q10
Q2
Q9
Q1
Q8
Q0
OE
GND
CE
A0
1
M5M29GB640VP
mechanisms. In addition, the combination of advanced
tunnel oxide processing and low internal electric fields
for erase and program operations produces reliable cy-
cling. The
M5M29GB640VP
uses a 2.7V~3.6V VCC sup-
ply to perform the High Reliability Erase and auto Pro-
gram/Erase algorithms.
The highest degree of latch-up protection is achieved
with MXIC's proprietary non-epi process. Latch-up pro-
tection is proved for stresses up to 100 milliamps on
address and data pin from -1V to VCC + 1V.
tially reduces active current when the device is in static
mode (addresses not switching). In this mode, the typi-
cal ICCS current is 7uA (CMOS) at 3.0V VCC.
As CE and RP are at VCC, ICC CMOS standby mode is
enabled. When RP is at GND, the reset mode is enabled
which minimize power consumption and provide data
write protection.
A reset time (tPHQV) is required from RP switching high
until outputs are valid. Similarly, the device has a wake
time (tPHEL) from RP-high until writes to the CUI are
recognized. With RP at GND, the WSM is reset and the
status register is cleared.
A Command User Interface (CUI) serves as the inter-
face between the system processor and internal opera-
tion of the device. A valid command sequence written to
the CUI initiates device automation. An internal Write
State Machine (WSM) automatically executes the algo-
rithms and timings necessary for erase, full chip erase,
word/byte write and sector lock/unlock configuration op-
erations.
A sector erase operation erases one of the device's 32K-
word sectors typically within 1.0s, 4K-word sectors typi-
cally within 0.5s independent of other sectors. Each sec-
tor can be independently erased minimum 100,000 times.
Sector erase suspend mode allows system software to
suspend sector erase to read or write data from any other
sector.
Writing memory data is performed in word increments of
the device's 32K-word sectors typically within 0.8s and
4K-word sectors typically within 0.1s. Word program sus-
pend mode enables the system to read data or execute
code from any other memory array location.
M5M29GB640VP
features with individual sectors lock-
ing by using a combination of bits thirty-nine sector lock-
bits and WP, to lock and unlock sectors.
The status register indicates when the WSM's sector
erase, full chip erase, word program or lock configura-
tion operation is done.
The access time is 90/120ns (tELQV) over the operat-
ing temperature range (-40° to +80° and VCC supply
C
C)
voltage range of 2.7V~3.6V.
M5M29GB640VP's
power saving mode feature substan-
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M5M29GB640VP
BLOCK DIAGRAM
DQ0~DQ7
Output
Buffer
Input
Buffer
I/O
Logic
VCC
Output
Multiplexer
Identifier
Register
Data
Register
CS
Status
Register
Command
User
Interface
WE
OE
RP
WP
Data
Comparator
Write
State
Machine
A0~A21
Input
Buffer
Y
Decoder
Y-Gating
Program/Erase
Voltage Switch
VPP
VCC
GND
Main Sector 29
Boot Sector 0
Boot Sector 1
Parameter Sector
Parameter Sector
Parameter Sector
Parameter Sector
Parameter Sector
Parameter Sector
0
1
2
3
4
5
Main Sector 30
Main Sector 0
Main Sector 1
Address
Latch
X
Decoder
32K-Word
Main Sector
x96
.......
Address
Counter
.......
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M5M29GB640VP
Table 1. Pin Description
Symbol
A0-A21
Type
input
Description and Function
Address inputs for memory address. Data pin float to high-impedance when the chip is
deselected or outputs are disable. Addresses are internally latched during a write or
erase cycle.
Data inputs/outputs: Inputs array data on the second CE and WE cycle during a pro-
gram command. Data is internally latched. Outputs array and configuration data. The
data pin float to tri-state when the chip is de-selected.
Activates the device's control logic, input buffers, and sense amplifiers. CE high de-
selects the memory device and reduce power consumption to standby level. CE is
active low.
Reset Deep Power Down: when RP=VIL, the device is in reset/deep power down mode,
which drives the outputs to High Z, resets the WSM and minimizes current level.
When RP=VIH, the device is normal operation. When RP transition the device defaults
to the read array mode.
WE
input
Write Enable: to control write to CUI and array sector. WR=VIL becomes active. The
data and address is latched WE on the rising edge of the second WE pulse.
DQ0-DQ15
input/output
CE
input
RP
input
OE
WP
input
input
VCC
VCCQ
GND
supply
input
supply
Output enable: gates the device's outputs during a real cycle.
Write protect: when WP is VIL, the boot sectors cannot be written or erased. When WP
is VIH, locked boot sectors cannot be written or erase. WP is not affected parameter
and main sectors.
Device power supply: (2.7V~3.6V).
I/O Power Supply: supplies for input/output buffers. (Refer to section 6.2.6)
Ground voltage: all the GND pin shall not be connected.
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M5M29GB640VP
SECTOR STRUCTURE (TOP)
Sector
Boot Sector 0
Boot Sector 1
Parameter Sector 0
Parameter Sector 1
Parameter Sector 2
Parameter Sector 3
Parameter Sector 4
Parameter Sector 5
Main Sector 0
Main Sector 1
Main Sector 2
Main Sector 3
Main Sector 4
Main Sector 5
Main Sector 6
Main Sector 7
Main Sector 8
Main Sector 9
Main Sector 10
Main Sector 11
Main Sector 12
Main Sector 13
Main Sector 14
Main Sector 15
Main Sector 16
Main Sector 17
Main Sector 18
Main Sector 19
Main Sector 20
Main Sector 21
Main Sector 22
Main Sector 23
Main Sector 24
Main Sector 25
Main Sector 26
Main Sector 27
Main Sector 28
Main Sector 29
Main Sector 30
Sector Size
4K Word
4K Word
4K Word
4K Word
4K Word
4K Word
4K Word
4K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
32K Word
Address Range (h)
3FF000-3FFFFF
3FE000-3FEFFF
3FD000-3FDFFF
3FC000-3FCFFF
3FB000-3FBFFF
3FA000-3FAFFF
3F9000-3F9FFF
3F8000-3F8FFF
3F0000-3F7FFF
3E8000-3EFFFF
3E0000-3E7FFF
3D8000-3DFFFF
3D0000-3D7FFF
3C8000-3CFFFF
3C0000-3C7FFF
3B8000-3BFFFF
3B0000-3B7FFF
3A8000-3AFFFF
3A0000-3A7FFF
398000-39FFFF
390000-397FFF
388000-38FFFF
380000-387FFF
378000-37FFFF
370000-377FFF
368000-36FFFF
360000-367FFF
358000-35FFFF
350000-357FFF
348000-34FFFF
340000-347FFF
338000-33FFFF
330000-337FFF
328000-32FFFF
320000-327FFF
318000-31FFFF
310000-317FFF
308000-30FFFF
300000-307FFF
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