型号
- 型号
- 关键词
| 型号 | M7020R | M7020R-083ZA1T | M7020R-050ZA1T | M7020R-066ZA1T |
|---|---|---|---|---|
| 描述 | 32K x 68-bit Entry NETWORK SEARCH ENGINE | 32K x 68-bit Entry NETWORK SEARCH ENGINE | 32K x 68-bit Entry NETWORK SEARCH ENGINE | 32K x 68-bit Entry NETWORK SEARCH ENGINE |
| 厂商名称 | - | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
| 零件包装代码 | - | BGA | BGA | BGA |
| 包装说明 | - | 27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-272 | 27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-272 | 27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-272 |
| 针数 | - | 272 | 272 | 272 |
| Reach Compliance Code | - | compli | compli | compli |
| JESD-30 代码 | - | S-PBGA-B272 | S-PBGA-B272 | S-PBGA-B272 |
| 长度 | - | 27 mm | 27 mm | 27 mm |
| 功能数量 | - | 1 | 1 | 1 |
| 端子数量 | - | 272 | 272 | 272 |
| 最高工作温度 | - | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | BGA | BGA | BGA |
| 封装等效代码 | - | BGA272,20X20,50 | BGA272,20X20,50 | BGA272,20X20,50 |
| 封装形状 | - | SQUARE | SQUARE | SQUARE |
| 封装形式 | - | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 电源 | - | 1.8,2.5/3.3 V | 1.8,2.5/3.3 V | 1.8,2.5/3.3 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 2.6 mm | 2.6 mm | 2.6 mm |
| 标称供电电压 | - | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | - | YES | YES | YES |
| 电信集成电路类型 | - | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
| 温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | - | BALL | BALL | BALL |
| 端子节距 | - | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | - | BOTTOM | BOTTOM | BOTTOM |
| 宽度 | - | 27 mm | 27 mm | 27 mm |