型号
- 型号
- 关键词
8 CHANNEL MULTIPLEXER/REGISTER 3 STATE
厂商名称：ST(意法半导体)
厂商官网：http://www.st.com/
器件标准：
| 型号 | M74HC354M1R | M74HC354C1R | M74HC354B1R | M74HC354 | M54HC354F1R | M54HC354 |
|---|---|---|---|---|---|---|
| 描述 | 8 CHANNEL MULTIPLEXER/REGISTER 3 STATE | 8 CHANNEL MULTIPLEXER/REGISTER 3 STATE | 8 CHANNEL MULTIPLEXER/REGISTER 3 STATE | 8 CHANNEL MULTIPLEXER/REGISTER 3 STATE | 8 CHANNEL MULTIPLEXER/REGISTER 3 STATE | 8 CHANNEL MULTIPLEXER/REGISTER 3 STATE |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | - | 含铅 | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | - | 不符合 | - |
| 厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | - | ST(意法半导体) | - |
| 零件包装代码 | SOIC | QFN | DIP | - | DIP | - |
| 包装说明 | SOP-20 | QCCJ, LDCC20,.4SQ | DIP, DIP20,.3 | - | DIP, DIP20,.3 | - |
| 针数 | 20 | 20 | 20 | - | 20 | - |
| Reach Compliance Code | compli | compli | compli | - | _compli | - |
| 其他特性 | TRANSPARENT ADDRESS/DATA LATCHES; 3 ENABLE INPUTS | TRANSPARENT ADDRESS/DATA LATCHES; 3 ENABLE INPUTS | TRANSPARENT ADDRESS/DATA LATCHES; 3 ENABLE INPUTS | - | TRANSPARENT ADDRESS/DATA LATCHES; 3 ENABLE INPUTS | - |
| 系列 | HC/UH | HC/UH | HC/UH | - | HC/UH | - |
| JESD-30 代码 | R-PDSO-G20 | S-PQCC-J20 | R-PDIP-T20 | - | R-GDIP-T20 | - |
| JESD-609代码 | e4 | e3 | e3 | - | e0 | - |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | - | 50 pF | - |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | - | MULTIPLEXER | - |
| 最大I（ol） | 0.006 A | 0.006 A | 0.006 A | - | 0.006 A | - |
| 功能数量 | 1 | 1 | 1 | - | 1 | - |
| 输入次数 | 8 | 8 | 8 | - | 8 | - |
| 输出次数 | 1 | 1 | 1 | - | 1 | - |
| 端子数量 | 20 | 20 | 20 | - | 20 | - |
| 最高工作温度 | 125 °C | 85 °C | 125 °C | - | 125 °C | - |
| 最低工作温度 | -55 °C | -40 °C | -55 °C | - | -55 °C | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | - |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | - | COMPLEMENTARY | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | CERAMIC, GLASS-SEALED | - |
| 封装代码 | SOP | QCCJ | DIP | - | DIP | - |
| 封装等效代码 | SOP20,.4 | LDCC20,.4SQ | DIP20,.3 | - | DIP20,.3 | - |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | - | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE | CHIP CARRIER | IN-LINE | - | IN-LINE | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
| 电源 | 2/6 V | 2/6 V | 2/6 V | - | 2/6 V | - |
| Prop。Delay @ Nom-Su | 63 ns | 65 ns | 63 ns | - | 78 ns | - |
| 传播延迟（tpd） | 375 ns | 53 ns | 375 ns | - | 63 ns | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - |
| 座面最大高度 | 2.65 mm | 4.57 mm | 3.93 mm | - | 5.71 mm | - |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | - | 6 V | - |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | - | 2 V | - |
| 标称供电电压 (Vsup) | 4.5 V | 5 V | 4.5 V | - | 5 V | - |
| 表面贴装 | YES | YES | NO | - | NO | - |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | - |
| 温度等级 | MILITARY | INDUSTRIAL | MILITARY | - | MILITARY | - |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | Matte Tin (Sn) | - | Tin/Lead (Sn/Pb) | - |
| 端子形式 | GULL WING | J BEND | THROUGH-HOLE | - | THROUGH-HOLE | - |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | - | 2.54 mm | - |
| 端子位置 | DUAL | QUAD | DUAL | - | DUAL | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
| 宽度 | 7.5 mm | 8.9662 mm | 7.62 mm | - | 7.62 mm | - |