型号
- 型号
- 关键词
| 型号 | M74HC4002 | M74HC4002B1R | M74HC4002C1R | M54HC4002F1R |
|---|---|---|---|---|
| 描述 | DUAL 4 INPUT NOR GATE | DUAL 4 INPUT NOR GATE | DUAL 4 INPUT NOR GATE | DUAL 4 INPUT NOR GATE |
| 是否Rohs认证 | - | 符合 | 不符合 | 不符合 |
| 厂商名称 | - | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
| 零件包装代码 | - | DIP | QFN | DIP |
| 包装说明 | - | PLASTIC, DIP-14 | PLASTIC, CC-20 | CERAMIC, DIP-14 |
| 针数 | - | 14 | 20 | 14 |
| Reach Compliance Code | - | compliant | _compli | _compli |
| 系列 | - | HC/UH | HC/UH | HC/UH |
| JESD-30 代码 | - | R-PDIP-T14 | S-PQCC-J20 | R-GDIP-T14 |
| JESD-609代码 | - | e3 | e0 | e0 |
| 负载电容（CL） | - | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | - | NOR GATE | NOR GATE | NOR GATE |
| 最大I（ol） | - | 0.004 A | 0.004 A | 0.004 A |
| 功能数量 | - | 2 | 2 | 2 |
| 输入次数 | - | 4 | 4 | 4 |
| 端子数量 | - | 14 | 20 | 14 |
| 最高工作温度 | - | 125 °C | 85 °C | 125 °C |
| 最低工作温度 | - | -55 °C | -40 °C | -55 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | - | DIP | QCCJ | DIP |
| 封装等效代码 | - | DIP14,.3 | LDCC20,.4SQ | DIP14,.3 |
| 封装形状 | - | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | - | IN-LINE | CHIP CARRIER | IN-LINE |
| 电源 | - | 2/6 V | 2/6 V | 2/6 V |
| 传播延迟（tpd） | - | 150 ns | 25 ns | 30 ns |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | - | NO | NO | NO |
| 座面最大高度 | - | 5.1 mm | 4.57 mm | 5.08 mm |
| 最大供电电压 (Vsup) | - | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | - | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | - | 4.5 V | 5 V | 5 V |
| 表面贴装 | - | NO | YES | NO |
| 技术 | - | CMOS | CMOS | CMOS |
| 温度等级 | - | MILITARY | INDUSTRIAL | MILITARY |
| 端子面层 | - | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | THROUGH-HOLE | J BEND | THROUGH-HOLE |
| 端子节距 | - | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | - | DUAL | QUAD | DUAL |
| 宽度 | - | 7.62 mm | 8.9662 mm | 7.62 mm |