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M74HCT564M1R

OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING

器件类别:逻辑    逻辑   

厂商名称:ST(意法半导体)

厂商官网:http://www.st.com/

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
ST(意法半导体)
零件包装代码
SOIC
包装说明
SOP-20
针数
20
Reach Compliance Code
compli
Is Samacsys
N
其他特性
BROADSIDE VERSION OF 534
系列
HCT
JESD-30 代码
R-PDSO-G20
JESD-609代码
e4
长度
12.8 mm
负载电容(CL)
150 pF
逻辑集成电路类型
BUS DRIVER
最大频率@ Nom-Su
21000000 Hz
最大I(ol)
0.006 A
位数
8
功能数量
1
端口数量
2
端子数量
20
最高工作温度
125 °C
最低工作温度
-55 °C
输出特性
3-STATE
输出极性
INVERTED
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装等效代码
SOP20,.4
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
包装方法
TUBE
电源
5 V
传播延迟(tpd)
54 ns
认证状态
Not Qualified
座面最大高度
2.65 mm
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
MILITARY
端子面层
Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
触发器类型
POSITIVE EDGE
宽度
7.5 mm
Base Number Matches
1
参数对比
与M74HCT564M1R相近的元器件有:M74HCT574C1R、M74HCT574、M74HCT564C1R、M74HCT564B1R、M74HCT564、M54HCT574F1R、M54HCT574、M54HCT564F1R、M54HCT564。描述及对比如下:
型号 M74HCT564M1R M74HCT574C1R M74HCT574 M74HCT564C1R M74HCT564B1R M74HCT564 M54HCT574F1R M54HCT574 M54HCT564F1R M54HCT564
描述 OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING
是否Rohs认证 符合 符合 - 符合 符合 - 不符合 - 不符合 -
厂商名称 ST(意法半导体) ST(意法半导体) - ST(意法半导体) ST(意法半导体) - ST(意法半导体) - ST(意法半导体) -
零件包装代码 SOIC QLCC - QLCC DIP - DIP - DIP -
包装说明 SOP-20 PLASTIC, LCC-20 - PLASTIC, LCC-20 PLASTIC, DIP-20 - DIP, DIP20,.3 - CERAMIC, DIP-20 -
针数 20 20 - 20 20 - 20 - 20 -
Reach Compliance Code compli compli - compli compli - _compli - _compli -
其他特性 BROADSIDE VERSION OF 534 BROADSIDE VERSION OF 374 - BROADSIDE VERSION OF 534 BROADSIDE VERSION OF 534 - BROADSIDE VERSION OF 374 - BROADSIDE VERSION OF 534 -
系列 HCT HCT - HCT HCT - HCT - HCT -
JESD-30 代码 R-PDSO-G20 S-PQCC-J20 - S-PQCC-J20 R-PDIP-T20 - R-GDIP-T20 - R-GDIP-T20 -
JESD-609代码 e4 e3 - e3 e3 - e0 - e0 -
负载电容(CL) 150 pF 150 pF - 150 pF 150 pF - 150 pF - 150 pF -
逻辑集成电路类型 BUS DRIVER BUS DRIVER - BUS DRIVER BUS DRIVER - BUS DRIVER - BUS DRIVER -
最大频率@ Nom-Su 21000000 Hz 25000000 Hz - 25000000 Hz 21000000 Hz - 21000000 Hz - 21000000 Hz -
最大I(ol) 0.006 A 0.006 A - 0.006 A 0.006 A - 0.006 A - 0.006 A -
位数 8 8 - 8 8 - 8 - 8 -
功能数量 1 1 - 1 1 - 1 - 1 -
端口数量 2 2 - 2 2 - 2 - 2 -
端子数量 20 20 - 20 20 - 20 - 20 -
最高工作温度 125 °C 85 °C - 85 °C 125 °C - 125 °C - 125 °C -
最低工作温度 -55 °C -40 °C - -40 °C -55 °C - -55 °C - -55 °C -
输出特性 3-STATE 3-STATE - 3-STATE 3-STATE - 3-STATE - 3-STATE -
输出极性 INVERTED TRUE - INVERTED INVERTED - TRUE - INVERTED -
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY - CERAMIC, GLASS-SEALED - CERAMIC, GLASS-SEALED -
封装代码 SOP QCCJ - QCCJ DIP - DIP - DIP -
封装等效代码 SOP20,.4 LDCC20,.4SQ - LDCC20,.4SQ DIP20,.3 - DIP20,.3 - DIP20,.3 -
封装形状 RECTANGULAR SQUARE - SQUARE RECTANGULAR - RECTANGULAR - RECTANGULAR -
封装形式 SMALL OUTLINE CHIP CARRIER - CHIP CARRIER IN-LINE - IN-LINE - IN-LINE -
电源 5 V 5 V - 5 V 5 V - 5 V - 5 V -
传播延迟(tpd) 54 ns 45 ns - 45 ns 54 ns - 54 ns - 54 ns -
认证状态 Not Qualified Not Qualified - Not Qualified Not Qualified - Not Qualified - Not Qualified -
座面最大高度 2.65 mm 4.57 mm - 4.57 mm 3.93 mm - 5.71 mm - 5.71 mm -
最大供电电压 (Vsup) 5.5 V 5.5 V - 5.5 V 5.5 V - 5.5 V - 5.5 V -
最小供电电压 (Vsup) 4.5 V 4.5 V - 4.5 V 4.5 V - 4.5 V - 4.5 V -
标称供电电压 (Vsup) 5 V 5 V - 5 V 5 V - 5 V - 5 V -
表面贴装 YES YES - YES NO - NO - NO -
技术 CMOS CMOS - CMOS CMOS - CMOS - CMOS -
温度等级 MILITARY INDUSTRIAL - INDUSTRIAL MILITARY - MILITARY - MILITARY -
端子面层 Nickel/Palladium/Gold (Ni/Pd/Au) Matte Tin (Sn) - Matte Tin (Sn) Matte Tin (Sn) - Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) -
端子形式 GULL WING J BEND - J BEND THROUGH-HOLE - THROUGH-HOLE - THROUGH-HOLE -
端子节距 1.27 mm 1.27 mm - 1.27 mm 2.54 mm - 2.54 mm - 2.54 mm -
端子位置 DUAL QUAD - QUAD DUAL - DUAL - DUAL -
触发器类型 POSITIVE EDGE POSITIVE EDGE - POSITIVE EDGE POSITIVE EDGE - POSITIVE EDGE - POSITIVE EDGE -
宽度 7.5 mm 8.965 mm - 8.965 mm 7.62 mm - 7.62 mm - 7.62 mm -
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