v2.0
ProASIC
®
3E Flash Family FPGAs
with Optional Soft ARM
®
Support
Features and Benefits
High Capacity
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600 k to 3 Million System Gates
108 to 504 kbits of True Dual-Port SRAM
Up to 616 User I/Os
130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Process
Live at Power-Up (LAPU) Level 0 Support
Single-Chip Solution
Retains Programmed Design when Powered Off
1 kbit of FlashROM with Synchronous Interfacing
350 MHz System Performance
3.3 V, 66 MHz 64-Bit PCI
Secure ISP Using On-Chip 128-Bit Advanced Encryption
Standard (AES) Decryption via JTAG (IEEE 1532–
compliant)
FlashLock
®
to Secure FPGA Contents
Core Voltage for Low Power
Support for 1.5-V-Only Systems
Low-Impedance Flash Switches
Segmented, Hierarchical Routing and Clock Structure
Ultra-Fast Local and Long-Line Network
Enhanced High-Speed, Very-Long-Line Network
High-Performance, Low-Skew Global Network
Architecture Supports Ultra-High Utilization
®
Pro (Professional) I/O
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700 Mbps DDR, LVDS-Capable I/Os
1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
Bank-Selectable I/O Voltages—Up to 8 Banks per Chip
Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X,
and
LVCMOS 2.5 V / 5.0 V Input
Differential I/O Standards: LVPECL, LVDS, BLVDS, and
M-LVDS
Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V,
GTL 2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II,
SSTL3 Class I and II
I/O Registers on Input, Output, and Enable Paths
Hot-Swappable and Cold Sparing I/Os
Programmable Output Slew Rate and Drive Strength
Programmable Input Delay
Schmitt Trigger Option on Single-Ended Inputs
Weak Pull-Up/Down
IEEE 1149.1 (JTAG) Boundary Scan Test
Pin-Compatible Packages Across the ProASIC3E Family
Six CCC Blocks, Each with an Integrated PLL
Configurable Phase-Shift, Multiply/Divide, Delay
Capabilities and External Feedback, Multiply/Divide,
Delay Capabilities, and External Feedback
Wide Input Frequency Range (1.5 MHz to 200 MHz)
CoreMP7Sd (with debug) and CoreMP7S (without debug
Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2,
×4, ×9, and ×18 Organizations Available)
True Dual-Port SRAM (except ×18)
24 SRAM and FIFO Configurations with Synchronous
Operation up to 350 MHz
CoreMP7Sd (with debug) and CoreMP7S (without
debug)
Reprogrammable Flash Technology
On-Chip User Nonvolatile Memory
High Performance
In-System Programming (ISP) and Security
Clock Conditioning Circuit (CCC) and PLL
Low Power
SRAMs and FIFOs
High-Performance Routing Hierarchy
Soft ARM7™ Core Support in M7 ProASIC3E Devices
•
Table 1 •
ProASIC3E Product Family
A3PE600
M7A3PE600
600 k
13,824
108
24
1k
Yes
6
18
8
270
PQ208
FG256, FG484
A3PE1500
M7A3PE1500
1.5 M
38,400
270
60
1k
Yes
6
18
8
444
PQ208
FG484, FG676
A3PE3000
M7A3PE3000
3M
75,264
504
112
1k
Yes
6
18
8
616
PQ208
FG484, FG896
ProASIC3E Devices
ARM-Enabled ProASIC3E Devices
1
System Gates
VersaTiles (D-flip-flops)
RAM kbits (1,024 bits)
4,608-Bit Blocks
FlashROM Bits
Secure (AES) ISP
CCCs with Integrated PLLs
2
VersaNet Globals
3
I/O Banks
Maximum User I/Os
Package Pins
PQFP
FBGA
Notes:
1.
2.
3.
4.
Refer to the
CoreMP7
datasheet for more information.
The PQ208 package has six CCCs and two PLLs.
Six chip (main) and three quadrant global networks are available.
For devices supporting lower densities, refer to the
ProASIC3 Flash FPGAs
datasheet.
April 2007
© 2007 Actel Corporation
i
See the Actel website for the latest version of the datasheet.
ProASIC3E Flash Family FPGAs
I/Os Per Package
1
ProASIC3E Devices
ARM-Enabled
ProASIC3E Devices
A3PE600
M7A3PE600
Single-Ended
I/O
1
147
165
270
–
–
Differential
I/O Pairs
65
79
135
–
–
A3PE1500
3
A3PE3000
3
M7A3PE3000
Single-Ended
I/O
1
147
–
280
–
616
Differential
I/O Pairs
65
–
136
–
300
M7A3PE1500
I/O Types
Single-Ended
I/O
1
147
–
280
444
–
Differential
I/O Pairs
65
–
139
222
–
Package
PQ208
FG256
FG484
FG676
FG896
Notes:
1. When considering migrating your design to a lower- or higher-density device, refer to
"Package Pin Assignments"
starting on
page
4-1
to ensure compliance with design and board migration requirements.
2. Each used differential I/O pair reduces the number of single-ended I/Os available by two.
3. For A3PE1500 and A3PE3000 devices, the usage of certain I/O standards is limited as follows:
– SSTL3(I) and (II): up to 40 I/Os per north or south bank
– LVPECL / GTL+ 3.3 V / GTL 3.3 V: up to 48 I/Os per north or south bank
– SSTL2(I) and (II) / GTL+ 2.5 V/ GTL 2.5 V: up to 72 I/Os per north or south bank
4. FG256 and FG484 are footprint-compatible packages.
5. When using voltage-referenced I/O standards, one I/O pin should be assigned as a voltage-referenced pin (V
REF
) per minibank
(group of I/Os).Refer to the
"I/O Banks and I/O Standards Compatibility" section on page 2-28
for more information about V
REF
and
the use of minibanks
6. "G" indicates RoHS-compliant packages. Refer to the
"ProASIC3E Ordering Information" on page iii
for the location of the "G" in
the part number.
Packaging Tables
Pinout tables not published in this document will be added in future revisions of the datasheet. For updates, contact
our local sales office.
ii
v2.0
ProASIC3E Flash Family FPGAs
ProASIC3E Ordering Information
A3PE3000 _
1
FG
G
896
I
Application (Temperature Range)
Blank = Commercial (0°C to +70°C)
I = Industrial (–40°C to +85°C)
PP = Pre-Production
ES = Engineering Sample (Room Temperature Only)
Package Lead Count
Lead-Free Packaging
Blank = Standard Packaging
G = RoHS-Compliant (Green) Packaging
Package Type
PQ = Plastic Quad Flat Pack (0.5 mm pitch)
FG = Fine Pitch Ball Grid Array (1.0 mm pitch)
Speed Grade
F
Blank
1
2
=
=
=
=
20% Slower than Standard*
Standard
15% Faster than Standard
25% Faster than Standard
Part Number
ProASIC3E Devices
A3PE600 = 600,000 System Gates
A3PE1500 = 1,500,000 System Gates
A3PE3000 = 3,000,000 System Gates
ARM-Enabled ProASIC3E Devices
M7A3PE600 = 600,000 System Gates
M7A3PE1500 = 1,500,000 System Gates
M7A3PE3000 = 3,000,000 System Gates
Note:
*The DC and switching characteristics for the –F speed grade targets are based only on simulation.
The characteristics provided for the –F speed grade are subject to change after establishing FPGA specifications. Some restrictions
might be added and will be reflected in future revisions of this document. The –F speed grade is only supported in the commercial
temperature range.
v2.0
iii
ProASIC3E Flash Family FPGAs
Temperature Grade Offerings
A3PE600
Package
PQ208
FG256
FG484
FG676
FG896
M7A3PE600
C, I
C, I
C, I
–
–
A3PE1500
M7A3PE1500
C, I
–
C, I
C, I
–
A3PE3000
M7A3PE3000
C, I
–
C, I
–
C, I
Note:
C = Commercial temperature range: 0°C to 70°C
I = Industrial temperature range: –40°C to 85°C
Speed Grade and Temperature Grade Matrix
Temperature Grade
C
2
I
3
Notes:
1. The DC and switching characteristics for the –F speed grade targets are based only on simulation.
The characteristics provided for the –F speed grade are subject to change after establishing FPGA specifications. Some restrictions
might be added and will be reflected in future revisions of this document. The –F speed grade is only supported in the commercial
temperature range.
2. C = Commercial temperature range: 0°C to 70°C
3. I = Industrial temperature range: –40°C to 85°C
–F
✓
–
1
Std.
✓
✓
–1
✓
✓
–2
✓
✓
Datasheet references made to ProASIC3E devices also apply to ARM-enabled ProASIC3E devices. The ARM-enabled
part numbers start with M7.
Contact your local Actel representative for device availability (http://www.actel.com/contact/default.aspx).
iv
v2.0
ProASIC3E Flash Family FPGAs
Table of Contents
Introduction and Overview
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
Device Architecture
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Device Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-51
Software Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-53
Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-53
Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-53
ISP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-54
DC and Switching Characteristics
General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Calculating Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
User I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11
VersaTile Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-60
Global Resource Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-64
Embedded SRAM and FIFO Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-67
Embedded FlashROM Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-79
JTAG 1532 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-80
Package Pin Assignments
208-Pin PQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
256-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8
484-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-12
676-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-23
896-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-31
Datasheet Information
List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-5
Export Administration Regulations (EAR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-5
v2.0
1
嵌入式系统
