Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IGW75N60H3
MA000967588
PG-TO247-3-44
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
antimony
silver
tin
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-36-0
7440-22-4
7440-31-5
Issued
Weight*
Weight
[mg]
6.352
3.972
1.192
3967.074
5.475
20.050
380.946
1603.985
31.874
0.500
1.251
3.253
Average
Mass
[%]
0.11
0.07
0.02
65.83
0.09
0.33
6.32
26.62
0.53
0.01
0.02
0.05
29. August 2013
6025.93 mg
Sum
[%]
0.11
Average
Mass
[ppm]
1054
659
198
65.92
0.09
658334
909
3327
63218
33.27
0.53
266180
5290
83
208
0.08
540
831
1000000
332725
5290
659191
909
Sum
[ppm]
1054
wire
encapsulation
leadfinish
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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