Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPB020NE7N3 G
MA001140416
PG-TO263-3-2
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
12.294
0.304
0.091
304.026
10.847
10.068
110.749
550.390
9.657
0.228
0.001
0.192
0.154
7.350
0.548
0.165
547.666
Average
Mass
[%]
0.79
0.02
0.01
19.43
0.69
0.64
7.08
35.17
0.62
0.01
0.00
0.01
0.01
0.47
0.04
0.01
35.00
29. August 2013
1564.73 mg
Sum
[%]
0.79
Average
Mass
[ppm]
7857
195
58
19.46
0.69
194300
6932
6434
70779
42.89
0.62
351746
6171
146
0.01
1
123
98
0.49
4697
350
105
35.05
350008
350463
1000000
4918
146
428960
6171
194553
6932
Sum
[ppm]
7857
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com