*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Surface Mount Chip Inductor Capability Matrix
MA Series Chip Ferrite Bead Arrays
Electrical Specifications (Continued)
MA3216-102M4
10000
1000
200
100
MA3216-121T4
1000
MA3216-201T4
IMPEDANCE (Ω)
IMPEDANCE (Ω)
IMPEDANCE (Ω)
Z
X
R
Z
10
100
Z
R
X
100
10
1
0.1
10
1
R
1
X
1
10
100
1000 1800
FREQUENCY (MHz)
MA3216-301T4
1000
Z
IMPEDANCE (Ω)
100
10
X
R
1
0.1
1
10
100
1000 1800
FREQUENCY (MHz)
MA3216-800S4
500
100
E
T
E
L
O
S
B
O
0.1
1
10
100
1000 1800
1
0.1
10
100
1000 1800
FREQUENCY (MHz)
FREQUENCY (MHz)
MA3216-601T4
MA3216-500S4
1000
500
IMPEDANCE (Ω)
IMPEDANCE (Ω)
100
Z
100
10
1
X
Z
X
R
10
1
R
0.1
0.1
1
10
100
1000 1800
0.02
FREQUENCY (MHz)
1
10
100
1000 1800
FREQUENCY (MHz)
MA3216-121S4
MA3216-201S4
500
5000
1000
100
10
1
0.1
IMPEDANCE (Ω)
IMPEDANCE (Ω)
100
IMPEDANCE (Ω)
Z
10
X
R
Z
10
X
R
Z
X
R
1
1
0.1
1
10
100
1000 1800
0.1
1
10
100
1000 1800
FREQUENCY (MHz)
FREQUENCY (MHz)
1
10
100
1000 1800
FREQUENCY (MHz)
MA3216-301S4
1000
IMPEDANCE (Ω)
100
Z
X
R
10
1
0.2
1
10
100
1000 1800
FREQUENCY (MHz)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Surface Mount Chip Inductor Capability Matrix
MA Series Chip Ferrite Bead Arrays
Product Dimensions
0.4
±
0.15
(.016
±
.006)
0.8
±
0.1
(.031
±
.004)
2.5
(.098)
0.8
(.031)
Preheating:
100 to 150°C
2 minutes min.
Recommended Land Pattern
Recommended Soldering
10 seconds max.
Soldering 230°C
200°C
30 seconds max.
1.6
±
0.2
(.063
±
.008)
3.2
±
0.2
(.126
±
.008)
0.2 MIN. TO 0.45 MAX.
(.008 MIN. TO .018 MAX.)
0.8
(.031)
0.4
(.016)
0.2
±
0.1
(.008
±
.004)
0.8
±
0.1
(.031
±
.004)
Reel Dimensions
178.0
DIA.
(7.00)
2.0
±
0.5
(.079
±
.020)
21.0
±
0.8
(.827
±
.031)
13.0
±
0.5
DIA.
(.512
±
.020)
E
T
E
L
O
S
B
O
DIMENSIONS ARE:
MM
(INCHES)
12.5
(.492)
13.0
±
0.5
(.512
±
.020)
DIA.
THICKNESS
0.10
(.004)
MAX.
50.0
(1.969)
9.0
(.354)
EMBOSSED
CARRIER
8.0
(.315)
EMBOSSED
CAVITY
CARRIER TAPE WIDTH:
CAVITY PITCH:
4.0
(.157)
8.0
(.315)
3000 pcs. per reel.
Gross weight: 140g.
REV.
/14
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
