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MA3S79500L

DIODE SCHOTTKY 30V 30MA SSMINI3

器件类别:半导体    分立半导体   

厂商名称:Panasonic(松下)

厂商官网:http://www.panasonic.co.jp/semicon/e-index.html

器件标准:

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器件参数
参数名称
属性值
二极管类型
肖特基
电压 - DC 反向(Vr)(最大值)
30V
电流 - 平均整流(Io)
30mA(DC)
不同 If 时的电压 - 正向(Vf
1V @ 30mA
速度
小信号 =< 200mA(Io),任意速度
反向恢复时间(trr)
1ns
不同 Vr 时的电流 - 反向漏电流
30µA @ 30V
不同 Vr,F 时的电容
1.5pF @ 1V,1MHz
安装类型
表面贴装
封装/外壳
SC-89,SOT-490
供应商器件封装
SS迷你型3-F2
工作温度 - 结
125°C(最大)
文档预览
This product complies with the RoHS Directive (EU 2002/95/EC).
Schottky Barrier Diodes (SBD)
MA3S795
(MA795)
Silicon epitaxial planar type
Unit: mm
0.80
±0.05
For switching
Features
High-density mounting is possible
Forward voltage V
F
, optimum for low voltage rectification
Low V
F
type of MA3X704A (MA704A)
Optimum for high frequency rectification because of its short
reverse recovery time t
rr
0.28
±0.05
0.12
+0.05
–0.02
(0.44)
(0.44)
2
3
1.60
±0.05
(0.80)
M
ain
Di
sc te
on na
tin nc
ue e/
d
1 2
(0.51)
(0.80) (0.80)
1.60
+0.05
–0.03
0.28
±0.05
(0.51)
0 to 0.1
Absolute Maximum Ratings
T
a
=
25°C
Parameter
Symbol
V
R
I
F
Reverse voltage
Maximum peak reverse voltage
Forward current
V
RM
I
FM
T
j
Peak forward current
Junction temperature
Storage temperature
T
stg
−55
to
+125
Electrical Characteristics
T
a
=
25°C
±
3°C
tin
ue
Parameter
Symbol
V
F1
V
F2
I
R
t
rr
η
C
t
Forward voltage
/D
Reverse current
an
ce
Terminal capacitance
Reverse recovery time
*
Detection efficiency
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on the charge of a human body
and the leakage of current from the operating equipment.
3. Absolute frequency of input and output is 2 GHz.
4. *: t
rr
measurement circuit
Bias Application Unit (N-50BU)
t
r
10%
Input Pulse
t
p
t
I
F
t
rr
t
I
rr
=
1 mA
I
F
=
10 mA
I
R
=
10 mA
R
L
=
100
Output Pulse
A
V
R
Pulse Generator
(PG-10N)
R
s
=
50
Wave Form Analyzer
(SAS-8130)
R
i
=
50
Note)
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Rating
30
30
30
Unit
V
V
1: Anode
2: N.C.
3: Cathode
EIAJ: SC-81
0.60
+0.05
–0.03
SSMini3-F2 Package
mA
°C
°C
150
125
mA
Marking Symbol: M2M
Internal Connection
3
1
Conditions
Min
Typ
Max
0.3
on
I
F
=
1 mA
(0.15)
Unit
V
isc
I
F
=
30 mA
V
R
=
30 V
1.0
30
µA
pF
ns
%
V
R
=
1 V, f
=
1 MHz
1.5
Ma
int
en
I
F
=
I
R
=
10 mA
I
rr
=
1 mA, R
L
=
100
1.0
65
V
IN
=
3 V
(peak)
, f
=
30 MHz
R
L
=
3.9 kΩ, C
L
=
10 pF
90%
t
p
=
2
µs
t
r
=
0.35 ns
δ =
0.05
The part number in the parenthesis shows conventional part number.
(0.375)
0.88
+0.05
–0.03
Publication date: April 2004
SKH00062BED
1
This product complies with the RoHS Directive (EU 2002/95/EC).
MA3S795
I
F
V
F
10
3
10
4
T
a
=
125°C
10
2
75°C 25°C
T
a
=
125°C
10
–20°C
10
3
I
R
V
R
1.0
V
F
T
a
0.8
Forward current I
F
(mA)
Forward voltage V
F
(V)
Reverse current I
R
(
µA
)
75°C
10
2
I
F
=
30 mA
0.6
10 mA
0.4
M
ain
Di
sc te
on na
tin nc
ue e/
d
1
10
10
−1
1
25°C
0.2
1 mA
40
80
120
160
200
10
−2
0
0.4
0.8
1.2
1.6
2.0
2.4
Forward voltage V
F
(V)
I
R
T
a
10
4
V
R
=
25 V
Reverse current I
R
(
µA
)
3V
1V
Terminal capacitance C
t
(pF)
10
3
10
2
10
1
10
−1
−40
0
40
80
120
160
200
2
Ma
int
en
an
ce
/D
isc
on
tin
ue
Ambient temperature T
a
(
°C
)
d
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10
−1
0
5
10
15
20
25
30
0
−40
0
Reverse voltage V
R
(V)
Ambient temperature T
a
(
°C
)
C
t
V
R
3.0
f
=
1 MHz
T
a
=
25°C
2.5
2.0
1.5
1.0
0.5
0
0
5
10
15
20
25
30
Reverse voltage V
R
(V)
SKH00062BED
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)
If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
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Ma
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M
ain
Di
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