size, low insertion loss and power consumption with
high isolation. Ideal for many applications and
module use. It will function well for designs below
6 GHz.
This die includes full passivation for performance
and reliability.
RF1
RF2
A
B
Bond Pad Dimensions
Ordering Information
1
Part Number
MASW6010G
1. Die quantity varies.
Bond Pad
Package
Die
RFC
RF2, RF3
A, B
GND1, GND2
DIE Size
Dimension Inches (mm)
0.004 x 0.004 (0.100 x 0.100)
0.004 x 0.004 (0.100 x 0.100)
0.004 x 0.004 (0.100 x 0.100)
0.012 x 0.004 (0.300 x 0.100)
0.031 x 0.031 x 0.010 (0.80 x 0.80 x 0.25)
Absolute Maximum Ratings
2
Parameter
Control Voltage (A/B)
Input RF Power
Operating Temperature
Storage Temperature
Absolute Maximum
-8.5 VDC
+34 dBm (500 MHz - 6 GHz)
+175°C
-65°C to +175°C
Schematic
2. Exceeding any one or combination of these limits may cause
permanent damage to this device.
1
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MASW6010G
GaAs SPDT Switch
DC - 6.0 GHz
Electrical Specifications
3,4
: T
A
= 25°C, Z
0
= 50 Ω
Parameter
Insertion Loss
Test Conditions
DC - 1.0 GHz
DC - 2.0 GHz
DC - 6.0 GHz
DC - 1.0 GHz
DC - 2.0 GHz
DC - 6.0 GHz
DC - 1.0 GHz
DC - 2.0 GHz
DC - 6.0 GHz
10% to 90% RF and 90% to 10% RF
50% control to 90% RF, and 50% control to
10% RF
In-Band
Above 500 MHz, 0 to -5 V
100 MHz, 0 to -5 V
Above 500 MHz, 0 to -8 V
100 MHz, 0 to -8 V
Two Tone, +5 dBm/Tone, 5 MHz Spacing
Above 500 MHz
100 MHz
Two Tone, +5 dBm/Tone, 5 MHz Spacing
Above 500 MHz
100 MHz
V
IN
Low, 0 to -0.2 V
V
IN
High, -5 V
V
IN
High, -8 V
Units
dB
Min.
—
—
—
45
38
22
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ.
—
—
—
—
—
—
—
—
—
2
4
10
+27
+21
+33
+26
+68
+62
+46
+40
—
—
—
Max.
0.6
0.8
1.4
—
—
—
1.1:1
1.2:1
1.9:1
—
—
—
—
—
—
—
—
—
—
—
20
50
300
Rev. V6
Isolation
dB
VSWR
Trise, Tfall
Ton, Toff
Transients
Ratio
ns
ns
mV
Input P1dB
dBm
IP2
dBm
IIP3
Control Voltage
(Complementary Logic)
dBm
µA
3. All specifications apply with 50-ohm impedance connected to all RF ports, 0 and –8 VDC control voltages.
4. Loss changes 0.0025 dB/°C (From –55°C to +85°C).
Handling Procedures
Please observe the following precautions to avoid
damage:
Truth Table
5
Control Inputs
A
V
IN
Hi
V
IN
Low
B
V
IN
Low
V
IN
Hi
Condition of Switch
RF Common to each RF Port
RF1
On
Off
RF2
Off
On
Static Sensitivity
Gallium Arsenide Integrated Circuits are sensitive
to electrostatic discharge (ESD) and can be
damaged by static electricity. Proper ESD control
techniques should be used when handling these
devices.
5. V
IN
Low = 0 to -0.2 V, V
IN
High = -5 to -8 V.
2
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Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW6010G
GaAs SPDT Switch
DC - 6.0 GHz
Typical Performance Curves
Insertion Loss
1.4
1.2
1.0
0.8
0.6
0.4
0.2
+85°C
+25°C
-55°C
Rev. V6
Isolation
80
70
60
50
40
30
20
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Frequency (GHz)
Frequency (GHz)
VSWR
2.0
1.8
1.6
1.4
1.2
1.0
0
1
2
3
4
5
6
Frequency (GHz)
3
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Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
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MASW6010G
GaAs SPDT Switch
DC - 6.0 GHz
Handling Procedures
Permanent damage to the MASW6010G may occur
if the following precautions are not adhered to:
A. Cleanliness - The MASW6010G should be
handled in a clean environment. DO NOT
attempt to clean assembly after the
MASW6010G is installed.
B. Static Sensitivity - All die handling equipment
and personnel should be DC grounded.
C. Transients - Avoid instrument and power
supply transients while bias is connected to the
MASW6010G. Use shielded signal and bias
cables to minimize inductive pick-up.
D. Bias - Apply voltage to either control port A/B
or only when the other is grounded. Neither
port should be allowed to ―float‖.
E. General Handling - It is recommended that the
MASW6010G chip be handled along the long
side of the die with a sharp pair of bent
tweezers. DO NOT touch the surface of the
chip with fingers or tweezers.
Rev. V6
Wire Bonding
A. Ball or wedge bond with 1.0 mil diameter pure
gold wire. Thermosonic wire bonding with a
nominal stage temperature of 150°C and a ball
bonding force of 40 to 50 grams or wedge
bonding force of 18 to 22 grams is recom-
mended. Ultrasonic energy and time should be
adjusted to the minimum levels to achieve
reliable wirebonds.
B. Wirebonds should be started on the chip and
terminated on the package.
Mounting
The MASW6010G is back-metalized with Pd/Ni/Au
(100/1,000/30,000Å) metallization. It can be
die
-mounted using Au/Sn eutectic preforms or a ther-
mally conductive epoxy. The package surface
should be clean and flat before attachment.
Eutectic Die Attach:
A. An 80/20 Au/Sn preform is recommended with
a work surface temperature of approximately
255°C and a tool temperature of 265°C. When
hot 90/10 nitrogen/hydrogen gas is applied,
solder temperature should be approximately
290°C.
B. DO NOT expose the MASW6010G to a
temperature greater than 320°C for more than
20 seconds. No more than 3 seconds of
scrubbing should be required for attachment.
Epoxy Die Attach:
A. Electrically conductive epoxy must be used.
B. Apply a minimum amount of epoxy and place
the MASW6010G into position. A thin epoxy
fillet should be visible around the perimeter of
the die.
C. Cure epoxy per manufacturer’s recommended
schedule.
4
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Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW6010G
GaAs SPDT Switch
DC - 6.0 GHz
Rev. V6
M/A-COM Technology Solutions Inc. All rights reserved.
Information in this document is provided in connection with M/A-COM Technology Solutions Inc ("MACOM")
products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,
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THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
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5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
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for additional data sheets and product information.
