型号
- 型号
- 关键词
Analog to Digital Converters - ADC 10Bit 300ksps w/FIFO Temp Sensor Int Ref
厂商名称：Maxim(美信半导体)
厂商官网：https://www.maximintegrated.com/en.html
器件标准：
| 型号 | MAX1031BCTI+ | MAX1031BCEG-T | MAX1031BEEG+T | MAX1029BCEP+ | MAX1029BEEP+T | MAX1027BEEE+ | MAX1031BETI+T | MAX1027BCEE+T |
|---|---|---|---|---|---|---|---|---|
| 描述 | Analog to Digital Converters - ADC 10Bit 300ksps w/FIFO Temp Sensor Int Ref | Analog to Digital Converters - ADC 10Bit 300ksps w/FIFO Temp Sensor Int Ref | Analog to Digital Converters - ADC 10Bit 300ksps w/FIFO Temp Sensor Int Ref | Analog to Digital Converters - ADC 10Bit 300ksps w/FIFO Temp Sensor Int Ref | Analog to Digital Converters - ADC 10Bit 300ksps w/FIFO Temp Sensor Int Ref | Analog to Digital Converters - ADC 10Bit 300ksps w/FIFO Temp Sensor Int Ref | Analog to Digital Converters - ADC 10Bit 300ksps w/FIFO Temp Sensor Int Ref | Analog to Digital Converters - ADC 10Bit 300ksps w/FIFO Temp Sensor Int Ref |
| 是否无铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 不符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | QFN | SOIC | SOIC | QSOP | QSOP | SSOP | QFN | SOIC |
| 包装说明 | HVQCCN, LCC28,.2SQ,20 | QSOP-24 | SOP, SSOP24,.24 | SOP, SSOP20,.25 | SOP, SSOP20,.25 | SSOP, SSOP16,.25 | HVQCCN, LCC28,.2SQ,20 | SOP, SSOP16,.25 |
| 针数 | 28 | 24 | 24 | 20 | 20 | 16 | 28 | 16 |
| Reach Compliance Code | compliant | not_compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Is Samacsys | N | N | N | N | N | N | N | N |
| 最大模拟输入电压 | 1.825 V | 1.26 V | 1.26 V | 1.26 V | 1.26 V | 1.825 V | 1.26 V | 1.26 V |
| 最小模拟输入电压 | -0.5 V | -1.24 V | -1.24 V | -1.24 V | -1.24 V | -0.5 V | -1.24 V | -1.24 V |
| 转换器类型 | A/D CONVERTER | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | A/D CONVERTER | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | S-XQCC-N28 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G16 | S-XQCC-N28 | R-PDSO-G16 |
| JESD-609代码 | e3 | e0 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 5 mm | 8.65 mm | 8.65 mm | 8.65 mm | 8.65 mm | 4.9 mm | 5 mm | 4.89 mm |
| 最大线性误差 (EL) | 0.0977% | 0.0977% | 0.0977% | 0.0977% | 0.0977% | 0.0977% | 0.0977% | 0.0977% |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 模拟输入通道数量 | 16 | 16 | 16 | 12 | 12 | 8 | 16 | 8 |
| 位数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 24 | 24 | 20 | 20 | 16 | 28 | 16 |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C |
| 输出位码 | 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY |
| 输出格式 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | SOP | SOP | SOP | SOP | SSOP | HVQCCN | SOP |
| 封装等效代码 | LCC28,.2SQ,20 | SSOP24,.24 | SSOP24,.24 | SSOP20,.25 | SSOP20,.25 | SSOP16,.25 | LCC28,.2SQ,20 | SSOP16,.25 |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 240 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 0.3 MHz | 0.3 MHz | 0.3 MHz | 0.3 MHz | 0.3 MHz | 0.3 MHz | 0.3 MHz | 0.3 MHz |
| 采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK |
| 座面最大高度 | 0.8 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 0.8 mm | 1.75 mm |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | TIN | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD | GULL WING |
| 端子节距 | 0.5 mm | 0.635 mm | 0.635 mm | 1.27 mm | 1.27 mm | 0.635 mm | 0.5 mm | 0.635 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 |
| 宽度 | 5 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.89 mm | 5 mm | 3.9 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Factory Lead Time | 6 weeks | - | 6 weeks | 6 weeks | 6 weeks | 17 weeks | 17 weeks | 18 weeks |
| 最长转换时间 | - | 3.5 µs | 3.5 µs | 3.5 µs | 3.5 µs | - | 3.5 µs | 3.5 µs |
| 标称供电电压 | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V | - | 2.7 V | 2.7 V |