EVALUATION KIT AVAILABLE
MAX14502
Hi-Speed USB-to-SD Card
Readers with Bypass
General Description
The MAX14502 USB-to-SD™ card reader provides a
means for portable devices that support full-speed USB
communication (12Mbps) with one or two SD card slots,
upgrading the USB SD card reader function to USB
high-speed (480Mbps) operation. The MAX14502 has
two modes of operation: Pass Thru and Card Reader.
In pass thru, the SD and USB signals pass through the
MAX14502 without modification, appearing like the device
is not present. The host microprocessor firmware does
not need modification, as there is no change from the host
microprocessor’s perspective. In Card Reader mode, the
MAX14502 implements a high-speed USB card reader
that operates independently of the host microprocessor.
All the capabilities of the full-speed USB port and SD card
slot are preserved with the additional feature that allows
a faster way for a PC to read or write to the SD card.
The MAX14502 supports high-capacity SDHC cards. The
40-pin TQFN version supports one SD card, while the
56-bump wafer-level package (WLP) version supports
two SD cards.
The MAX14502 features advanced power-saving modes
to reduce power consumption in portable applications.
The low-power sleep modes allow the ability to disable
internal circuit blocks, providing power-saving operating
modes. The default clock input for is specified in the
ordering information. The MAX14502 features the option
to change the default values using the I
2
C interface.
The MAX14502 is available in a 5mm x 5mm, 40-pin TQFN
package. This device operates over a wide supply voltage
range and is specified over the -40°C to +85°C extended
temperature range.
Benefits and Features
●
SDHC Card Support
●
USB 2.0 High-Speed and Full-Speed Compliant
●
Internal High-Speed USB SD Card Reader Eases
Host μP Overhead
● On-Chip Termination and Pullup Resistors
●
Accommodates Clock Input Frequencies:
26MHz, 19.2MHz, 13MHz, and 12MHz
● Internal Clock Squarer for Low-Amplitude TCXO
Signals
●
No Power-Supply Sequencing Required
● Compatible with +1.8V to +3.3V I/O Host
Microprocessor
● Simple Control Mode Requires Only a Single GPIO
●
I
2
C Control Provides Multiple Configuration Options
● On-Chip Power-On Reset/Brown-Out Reset
Ordering Information/Selector Guide
PART
MAX14502AETL+
INPUT
SD
FREQUENCY
CARDS
(MHz)
19.2
1
PIN-
PACKAGE
40 TQFN-EP**
Note:
All devices are specified over the -40°C to +85°C operating
temperature range.
+Denotes a lead(Pb)-free/RoHS-compliant package.
**EP = Exposed pad.
Applications
●
●
●
●
●
Cell Phones
PDAs
MP3 Players
Digital Still Cameras
GPS
SD is a trademark of the SD Card Association.
19-4117; Rev 3; 6/16
MAX14502
Hi-Speed USB-to-SD Card
Readers with Bypass
Absolute Maximum Ratings
(All voltages referenced to GND.)
V
CC
..........................................................................-0.3V to +4V
V
SD
..........................................................................-0.3V to +4V
V
IO
...........................................................................-0.3V to +4V
V
TM
..........................................................................-0.3V to +4V
KVBUS ....................................................................-0.3V to +4V
CLDO.......................................................................-0.3V
to +2V
CDAT1_[3:0], HDAT1_[3:0], CCMD1, HCMD1, CCLK1, HCLK1,
CCRD_PRST, HCRD_PRST ................ -0.3V to (V
SD
+ 0.3V)
BUSY, BERR/INT,
MODE, SCL, SDA, I2C_SEL,
ADD,
RST
.............................................. -0.3V to (V
IO
+ 0.3V)
CD+, CD-, HD+, HD-, RREF, FREF ......... -0.3V to (V
TM
+ 0.3V)
Continuous Power Dissipation (T
A
= +70°C)
40-Pin TQFN (derate 35.7mW/°C above +70°C) ......2857mW
Junction-to-Case Thermal Resistance (θ
JC
) (Note 1)
40-Pin TQFN ..............................................................1.7°C/W
Junction-to-Ambient Thermal Resistance (θ
JA
) (Note 1)
40-Pin TQFN ...............................................................28°C/W
Operating Temperature Range
........................... -40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range ............................ -65°C to +160°C
Lead Temperature (soldering, 10s) ................................. +300°C
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Electrical Characteristics
(V
CC
= +2.4V to +3.6V, V
SD
= +2.4V to +3.6V, V
IO
= +1.5V to +3.6V, V
TM
= +2.91V to +3.4V, T
A
= -40°C to +85°C, unless otherwise
noted. Typical values are at V
CC
= +3.3V, V
IO
= +2.5V, V
SD
= +2.5V, V
TM
= +3.3V, T
A
= +25°C.) (Note 2)
PARAMETER
DC CHARACTERISTICS
Pass thru
V
CC
Supply Voltage
V
CC
Card reader active, f
CCLK_
≤ 26MHz
Pass thru
V
SD
Supply Voltage
Logic Interface Supply Voltage
USB Supply Voltage
Digital Core LDO Regulator
Output Voltage
V
CC
Supply Current
V
SD
Supply Current
V
IO
Supply Current
V
TM
Supply Current
V
SD
Comparator Threshold
V
TM
Comparator Threshold
MODE, I2C_SEL, ADD,
RST
Input-Voltage Low
V
SD
V
IO
Card reader active, f
CCLK_
> 26MHz
Card reader active, f
CCLK_
≤ 26MHz
2.1
2.1
2.4
2.0
2.0
2.4
1.5
2.91
C
CLDO
= 1.0µF
Pass thru
Card reader active
Pass thru
Card reader active
Pass thru
Card reader active
Pass thru
Card reader active
1.0
2.0
1.8
5
35
17
3
2
0.2
13
25
1.5
2.5
1.9
2.9
0.4
50
10
15
50
40
3.6
3.6
3.6
3.6
3.6
3.6
3.6
3.4
V
V
V
µA
mA
µA
mA
µA
mA
µA
mA
V
V
V
V
V
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Card reader active, f
CCLK_
> 26MHz
V
TM
V
CLDO
I
CC
I
SD
I
IO
I
TM
V
TMCT
V
IL
V
SDCT
www.maximintegrated.com
Maxim Integrated
│
2
MAX14502
Hi-Speed USB-to-SD Card
Readers with Bypass
Electrical Characteristics (continued)
(V
CC
= +2.4V to +3.6V, V
SD
= +2.4V to +3.6V, V
IO
= +1.5V to +3.6V, V
TM
= +2.91V to +3.4V, T
A
= -40°C to +85°C, unless otherwise
noted. Typical values are at V
CC
= +3.3V, V
IO
= +2.5V, V
SD
= +2.5V, V
TM
= +3.3V, T
A
= +25°C.) (Note 2)
PARAMETER
MODE, I2C_SEL, ADD,
RST
Input-Voltage High
BUSY, BERR/INT
Output-Voltage Low
BUSY, BERR/INT
Output-Voltage High
I2C_SEL, ADD,
RST
Input
Leakage Current
MODE Input Resistance to GND
FREF Full-Swing Input-Voltage
High
FREF Full-Swing Input-Voltage
Low
FREF Low-Amplitude Input-
Voltage Low
FREF Input Leakage Current
FREF Input Resistance
KVBUS Comparator Threshold
KVBUS Comparator Hysteresis
KVBUS Comparator Input
Impedance
SDA/SCL Input Low Voltage
SDA/SCL Input High Voltage
SDA Output Logic-Low
SDA/SCL Input Leakage Current
SD CARD INTERFACE
On-Resistance
Off-Leakage Current
Off-Capacitance
On-Capacitance
Pullup Resistance
Output High Voltage
Output Low Voltage
SYMBOL
V
IH
V
OL
V
OH
I
IL
R
MODE
V
IH
V
IL
V
IL
I
ILF
V
TH
R
IN
V
IL_I2C
V
IH_I2C
V
OL_I2C
I
IN_I2C
R
ON
V
TEST
= 0 or V
SD
, I
TEST
= 10mA (Note 3)
V
TEST
= 0 or V
SD
(Note 3)
(Note 4)
(Note 5)
CCMD1, CDAT1_[3:0]
I
OH
= -100μA
I
OL
= 100µA
50
0.75 x
V
SD
0.125 x
V
SD
V
IO
> +2V, 3mA sink current
V
IO
≤ +2V, 3mA sink current
0.7 x
V
IO
0
0
-10
10
-1
5
10
75
100
+1
0.4
0.2 x
V
IO
+10
V
µA
Ω
µA
pF
pF
kΩ
V
V
Full-Swing mode
Low-Amplitude input mode
1.0
10
0.3 x
V
IO
200
-10
1
1.25
20
1.5
+10
I
LOAD
= 1mA
I
LOAD
= -1mA
V
IO
-
0.4
-1
150
1.3
0.4
300
+1
500
CONDITIONS
MIN
2/3 x
V
IO
0.4
TYP
MAX
UNITS
V
V
V
µA
kΩ
V
V
mV
µA
MΩ
V
mV
MΩ
V
V
V
HYS
C
SD_OFF
C
SD_ON
R
PU
V
OH
V
OL
I
ILSD
www.maximintegrated.com
Maxim Integrated
│
3
MAX14502
Hi-Speed USB-to-SD Card
Readers with Bypass
Electrical Characteristics (continued)
(V
CC
= +2.4V to +3.6V, V
SD
= +2.4V to +3.6V, V
IO
= +1.5V to +3.6V, V
TM
= +2.91V to +3.4V, T
A
= -40°C to +85°C, unless otherwise
noted. Typical values are at V
CC
= +3.3V, V
IO
= +2.5V, V
SD
= +2.5V, V
TM
= +3.3V, T
A
= +25°C.) (Note 2)
PARAMETER
Input High Voltage
SYMBOL
V
IH
V
SD
< 2.4V
V
SD
≥ 2.4V
V
SD
< 2.4V
V
SD
≥ 2.4V
V
CD_
= 0 or V
TM
, switch closed
V
CD_
= 0 to 3.3V, V
TM
= +3.3V
Switch closed, measured from CD+
and CD-
Switch open, measured from CD+, CD-,
HD+, HD-
5
2
12
6
CONDITIONS
MIN
0.8 x
V
SD
0.625 x
V
SD
0.2 x
V
SD
0.25 x
V
SD
Ω
Ω
pF
pF
V
TYP
MAX
UNITS
V
Input Low Voltage
USB INTERFACE
On-Resistance
On-Resistance Flatness
On-Capacitance
Off-Capacitance
AC CHARACTERISTICS (Note 6)
V
IL
R
ON
R
ONFLAT
C
ON_USB
C
OFF_USB
SD CARD CLOCK TIMING (CCLK1), DEFAULT SPEED (Figure 5a)
Clock Low Time
Clock High Time
Clock Rise Time
Clock Fall Time
Clock Low Time
Clock High Time
Clock Rise Time
Clock Fall Time
Input Setup Time
Input Hold Time
Output Delay Time During Data
Transfer Mode
Output Hold Time
I
2
C CHARACTERISTICS
SCL Clock Frequency
SDA, SCL Capacitance
SDA Output Fall Time
Hold Time After Repeated START
t
WL
t
WH
t
TLH
t
THL
t
WL
t
WH
t
TLH
t
THL
t
ISU
t
IH
t
ODLY
t
OH
f
SCL
2.5
400
5
250
0.6
C
L
= 10pF
C
L
= 10pF
C
L
= 10pF
C
L
= 10pF
C
L
= 40pF
C
L
= 40pF
C
L
= 40pF
C
L
= 40pF
5
2
14
7
7
3
3
19
19
10
10
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
kHz
pF
ns
µs
SD CARD CLOCK TIMING (CCLK1), HI-SPEED (Figure 5b)
SD CARD COMMAND TIMING (CCMD1, CCMD2) (Figure 5b)
C
IO_I2C
t
HD,STA
t
OF_I2C
www.maximintegrated.com
Maxim Integrated
│
4
MAX14502
Hi-Speed USB-to-SD Card
Readers with Bypass
Electrical Characteristics (continued)
(V
CC
= +2.4V to +3.6V, V
SD
= +2.4V to +3.6V, V
IO
= +1.5V to +3.6V, V
TM
= +2.91V to +3.4V, T
A
= -40°C to +85°C, unless otherwise
noted. Typical values are at V
CC
= +3.3V, V
IO
= +2.5V, V
SD
= +2.5V, V
TM
= +3.3V, T
A
= +25°C.) (Note 2)
PARAMETER
Clock Low Period
Clock High Period
Setup Time for Repeated START
Hold Time for Data
Setup Time for Data
SDA/SCL Input Fall Time
SDA/SCL Rise Time
Setup Time for STOP
Bus Free Time Between STOP
and START
SYMBOL
t
HIGH_I2C
t
HD,DAT
t
SU,DAT
t
R_I2C
t
BUF
t
F_I2C
t
SU,STA
t
LOW_I2C
CONDITIONS
MIN
1.3
0.6
0.6
0
100
300
300
0.6
1.3
0.9
TYP
MAX
UNITS
µs
µs
µs
µs
ns
ns
ns
µs
µs
t
SU,STO
USB High-Speed Source Electrical Characteristics
(V
CC
= +2.4V to +3.6V, V
SD
= +2.4V to +3.6V, V
IO
= +1.5V to +3.6V, V
TM
= +2.91V to +3.4V, T
A
= -40°C to +85°C, unless otherwise
noted. Typical values are at V
CC
= +3.3V, V
IO
= +2.5V, V
SD
= +2.5V, V
TM
= +3.3V, T
A
= +25°C.) (Note 2)
PARAMETER
DC CHARACTERISTICS
High-Speed Squelch Detection
Threshold (Diff Signal Amplitude)
High-Speed Differential Input
Signaling Levels
High-Speed Data Signaling
Common-Mode Voltage Range
High-Speed Idle Level
High-Speed Data Signaling High
High-Speed Data Signaling Low
Chirp J Level (Differential Voltage)
Chirp K Level (Differential
Voltage)
Termination Voltage (High-Speed)
AC CHARACTERISTICS
Rise Time
Fall Time
Driver Waveform Requirements
Driver-Output Resistance
Source Jitter Total (Including
Frequency Tolerance)
Z
HSDRV
Specified by high-speed transmit eye diagram
t
HSR
t
HSF
(Note 6)
(Note 6)
Specified by high-speed transmit eye
diagram
500
500
See the
Typical Operating
Characteristics
section
40.5
49.5
Ω
See the
Typical Operating
Characteristics
section
ps
ps
V
HSSQ
V
IL
SCM
V
HSOI
V
HSOH
V
HSOL
V
CHIRPJ
V
CHIRPK
V
HSTERM
(Note 6)
Specified by high-speed receive eye
diagram
(Note 6)
-50
-10
360
-10
700
-900
-10
+500
+10
440
+10
1100
-500
+10
mV
mV
mV
mV
mV
mV
mV
100
150
mV
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
www.maximintegrated.com
Maxim Integrated
│
5
电源技术
