The MAX14934–MAX14936 are a family of four-channel,
5kV
RMS
digital isolators utilizing Maxim’s proprietary
process technology. For applications requiring 2.75kV
RMS
of isolation, see the MAX14930–MAX14932. The
MAX14934–MAX14936 family transfers digital signals
between circuits with different power domains at ambient
temperatures up to +125°C.
The MAX14934–MAX14936 family offers all three pos-
sible unidirectional channel configurations to accom-
modate any four-channel design, including SPI, RS-232,
RS-485, and large digital IO modules. For applications
requiring bidirectional channels, such as I
2
C, refer to the
MAX14937.
Devices are available with data rates from DC up to
1Mbps, 25Mbps, or 150Mbps. Each device is also available
in either a default high or default low configuration. The
default is the state an output goes to when its input is
unpowered. See the
Ordering Information/Selector Guide
for the suffixes associated with each option.
Independent 1.71V to 5.5V supplies on each side of the
isolator also make the devices suitable for use as level
translators.
The MAX14934–MAX14936 are available in a 16-pin
wide body (10.3mm x 7.5mm) SOIC package. All devices
are rated for operation at ambient temperatures of -40°C
to +125°C.
Ordering Information/Selector Guide
appears at end of data
sheet.
General Description
●
Robust Galvanic Isolation of Digital Signals
• Withstands 5kV
RMS
for 60s (V
ISO
)
• Continuously Withstands 848V
RMS
(V
IOWM
)
• 1200V
P
Repetitive Peak Voltage (V
IORM
)
• Withstands ±10kV Surge per IEC 61000-4-5
●
Interfaces Directly with Most Micros and FPGAs
• Accepts 1.71V to 5.5V Supplies
●
Many Options Support Broad Applications
• 3 Data Rates (1Mbps, 25Mbps, 150Mbps)
•
3 Channel Direction Configuration
• 2 Output Default States (High or Low)
●
Low Power Consumption at High Data Rates
At 1.8V:
• 2.5mA per Channel Typical at 1Mbps
• 5.25mA per Channel Typical at 100Mbps
At 3.3V:
• 2.6mA per Channel Typical at 1Mbps
• 7.1mA per Channel Typical at 100Mbps
Benefits and Features
Safety Regulatory Approvals
(see
Safety Regulatory Approvals)
● UL According to UL1577
● cUL According to CSA Bulletin 5A
● VDE 0884-10
Applications
●
●
●
●
●
Fieldbus Communications for Industrial Automation
Isolated SPI, RS-232, RS-485/RS-422
General Multichannel Isolation Applications
Battery Management
Medical Systems
Functional Diagram
V
DDA
V
DDB
V
DDA
V
DDB
V
DDA
V
DDB
MAX14934
ENB
INA1
OUTB1
INA1
MAX14935
ENB
OUTB1
INA1
MAX14936
ENB
OUTB1
INA2
DIGITAL
ISOLATOR
OUTB2
5kV
RMS
INA2
DIGITAL
ISOLATOR
OUTB2
5kV
RMS
INA2
DIGITAL
ISOLATOR
OUTB2
5kV
RMS
INA3
OUTB3
INA3
OUTB3
OUTA1
INB1
INA4
OUTB4
OUTA1
ENA
INB1
OUTA2
ENA
INB2
GNDA
GNDB
GNDA
GNDB
GNDA
GNDB
19-7067; Rev 6; 1/17
MAX14934–MAX14936
Four-Channel, 5kV
RMS
Digital Isolators
Absolute Maximum Ratings
V
DDA
to GNDA, V
DDB
to GNDB .............................-0.3V to +6V
INA_, ENA to GNDA................................................-0.3V to +6V
INB_, ENB to GNDB ...............................................-0.3V to +6V
OUTA_ to GNDA
.................................... -0.3V to (V
DDA
+ 0.3V)
OUTB_ to GNDB
.................................... -0.3V to (V
DDB
+ 0.3V)
Short-Circuit Duration
(OUTA_ to GNDA, OUTB_ to GNDB)
..................Continuous
Continuous Power Dissipation (T
A
= +70°C)
Wide SOIC (derate 14.1mW/°C above +70°C)
...... 1126.8mW
Operating Temperature Range ......................... -40°C to +125°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s) ................................. +300°C
Soldering Temperature (reflow) ......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
Wide SOIC
Junction-to-Ambient Thermal Resistance (θ
JA
) ..........71°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ...............23°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
