14-Pin SO (derate 8.00mW/°C above +70°C)..............640mW
Operating Temperature Range
MAX413_E__ ...................................................-40°C to +85°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-65°C to +160°C
Lead Temperature (soldering, 10s) .................................+300°C
Bump Reflow Temperature .........................................+235°C
Note 1:
Provided that the maximum package power-dissipation rating is not exceeded.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(V
CC
= +2.7V to +6.5V, V
EE
= 0V, V
CM
= 0V, V
OUT
= V
CC
/2, R
L
tied to V
CC
/2,
SHDN
≥
2V (or open),
T
A
= +25°C,
unless
otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MAX4130EUK
MAX4131ESA
MAX4131EUA/
MAX4131EBT
Input Offset Voltage
V
OS
V
CM
= V
EE
to V
CC
MAX4132ESA/
MAX4133ESD
MAX4132EUA
MAX4134ESD
Input Bias Current
Input Offset Current
Differential Input Voltage
Common-Mode Input Voltage
Range
I
B
I
OS
R
IN
CMVR
MAX4130EUK
MAX4131ESA
V
EE
- 0.25V < V
CM
< V
CC
+ 0.25V
MAX4131EUA/
MAX4131EBT
MAX4132ESA/
MAX4133ESD
MAX4132EUA
MAX4134ESD
Power-Supply Rejection Ratio
Output Resistance
Off-Leakage Current
PSRR
R
OUT
I
LKG
V
CC
= 2.7V to 6.5V
A
V
= 1
SHDN
< 0.8V, V
OUT
= 0V to V
CC
V
CM
= V
EE
to V
CC
V
CM
= V
EE
to V
CC
-1.5V < V
DIFF
< 1.5V
V
EE
-
0.25
67
78
68
74
66
64
78
90
98
88
dB
94
86
84
100
0.1
±0.1
±1
dB
Ω
µA
MAX4131EBT
All other packages
500
V
CC
+
0.25
MIN
TYP
±0.35
±0.20
±0.35
±0.25
±0.40
±0.35
±50
MAX
±1.50
±0.60
±1.20
mV
±0.75
±1.50
±1.50
±150
±15
±12
nA
nA
kΩ
V
UNITS
Common-Mode Rejection Ratio
CMRR
2
Maxim Integrated
MAX4130–MAX4134
Single/Dual/Quad, Wide-Bandwidth, Low-Power,
Single-Supply, Rail-to-Rail I/O Op Amps
DC ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +2.7V to +6.5V, V
EE
= 0V, V
CM
= 0V, V
OUT
= V
CC
/2, R
L
tied to V
CC
/2,
SHDN
≥
2V (or open),
T
A
= +25°C,
unless
otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
V
OUT
= 0.25V to 2.45V,
R
L
= 100kΩ
V
OUT
= 0.4V to 2.3V,
R
L
= 250Ω
V
OUT
= 0.25V to 4.75V,
R
L
= 100kΩ
V
OUT
= 0.4V to 4.6V,
R
L
= 250Ω
R
L
= 100kΩ
R
L
= 250Ω
Output Voltage Swing
V
O
MAX4132/
MAX4133/
MAX4134
Output Short-Circuit Current
SHDN
Logic Threshold
SHDN
Input Current
Operating Supply Voltage
Range
Supply Current per Amplifier
Shutdown Supply Current per
Amplifier
I
SC
V
IL
V
IH
I
IL
V
CC
I
CC
V
CM
= V
OUT
= V
CC
/2
SHDN
> 0.8V, MAX4131–
MAX4134
V
CC
= 2.7V
V
CC
= 5V
V
CC
= 2.7V
V
CC
= 5V
MAX4131–MAX4134
MAX4131–MAX4134
2.7
900
1000
25
40
Low
High
2.0
±1
±3
6.5
1050
1150
40
µA
60
R
L
= 100kΩ
R
L
= 250Ω
V
CC
- V
OH
V
OL
- V
EE
V
CC
- V
OH
V
OL
- V
EE
V
CC
- V
OH
V
OL
- V
EE
V
CC
- V
OH
V
OL
- V
EE
MIN
92
72
94
75
TYP
108
82
dB
108
86
12
20
240
125
15
25
280
180
50
0.8
20
35
290
170
30
40
330
230
mA
V
µA
V
µA
mV
MAX
UNITS
V
CC
= 2.7V
Large-Signal Voltage Gain
A
V
V
CC
= 5V
MAX4130/
MAX4131
I
SHDN
DC ELECTRICAL CHARACTERISTICS
(V
CC
= +2.7V to +6.5V, V
EE
= 0V, V
CM
= 0V, V
OUT
= V
CC
/2, R
L
tied to V
CC
/2,
SHDN
≥
2V (or open),
T
A
= -40°C to +85°C,
unless
otherwise noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MAX4130EUK
MAX4131ESA
Input Offset Voltage
V
OS
V
CM
= V
EE
to MAX4131EUA/MAX4131EBT
V
CC
MAX4132ESA/MAX4133ESD
MAX4132EUA
MAX4134ESD
Input Offset Voltage Tempco
Input Bias Current
Maxim Integrated
MIN
TYP
MAX
±3.50
±0.75
±4.40
±0.95
±4.70
±4.00
UNITS
mV
TCV
OS
I
B
V
CM
= V
EE
to V
CC
±2
±160
µV/°C
nA
3
MAX4130–MAX4134
Single/Dual/Quad, Wide-Bandwidth, Low-Power,
Single-Supply, Rail-to-Rail I/O Op Amps
DC ELECTRICAL CHARACTERISTICS
(V
CC
= +2.7V to +6.5V, V
EE
= 0V, V
CM
= 0V, V
OUT
= V
CC
/2, R
L
tied to V
CC
/2,
SHDN
≥
2V (or open),
T
A
= -40°C to +85°C,
unless
otherwise noted.) (Note 2)
PARAMETER
Input Offset Current
Common-Mode Input Voltage
Range
SYMBOL
I
OS
CMVR
MAX4130EUK
MAX4131ESA
Common-Mode Rejection Ratio
CMRR
V
EE
- 0.2V
< V
CM
< V
CC
+ 0.2V
MAX4131EUA/MAX4131EBT
MAX4132ESA/MAX4133ESD
MAX4132EUA
MAX4134ESD
Power-Supply Rejection Ratio
Off-Leakage Current
PSRR
I
LKG
V
CC
= 2.7V to 6.5V
SHDN
< 0.8V, V
OUT
= 0V to V
CC
V
OUT
= 0.25V to 2.45V,
R
L
= 100kΩ
V
OUT
= 0.4V to 2.3V,
R
L
= 250Ω
V
OUT
= 0.25V to 4.75V,
R
L
= 100kΩ
V
OUT
= 0.4V to 4.6V,
R
L
= 250Ω
R
L
= 100kΩ
R
L
= 250Ω
R
L
= 100kΩ
Output Voltage Swing
V
O
MAX4131EBT
R
L
= 250Ω
MAX4132/
MAX4133/
MAX4134
R
L
= 100kΩ
R
L
= 250Ω
V
CC
- V
OH
V
OL
- V
EE
V
CC
- V
OH
V
OL
- V
EE
V
CC
- V
OH
V
OL
- V
EE
V
CC
- V
OH
V
OL
- V
EE
V
CC
- V
OH
V
OL
- V
EE
V
CC
- V
OH
V
OL
- V
EE
84
66
dB
86
68
25
40
300
190
25
40
350
190
35
50
350
250
mV
CONDITIONS
V
CM
= V
EE
to V
CC
MAX4131EBT
All other packages
V
EE
-
0.20
62
76
60
74
58
60
74
±12
dB
µA
dB
MIN
TYP
MAX
±24
±18
V
CC
+
0.20
UNITS
nA
V
V
CC
= 2.7V
Large-Signal Voltage Gain
A
V
V
CC
= 5V
MAX4130/
MAX4131ESA/
MAX4131EUA
4
Maxim Integrated
MAX4130–MAX4134
Single/Dual/Quad, Wide-Bandwidth, Low-Power,
Single-Supply, Rail-to-Rail I/O Op Amps
DC ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +2.7V to +6.5V, V
EE
= 0V, V
CM
= 0V, V
OUT
= V
CC
/2, R
L
tied to V
CC
/2,
SHDN
≥
2V (or open),
T
A
= -40°C to +85°C,
unless
otherwise noted.) (Note 2)
PARAMETER
SHDN
Logic Threshold
SHDN
Input Current
Operating Supply Voltage Range
SYMBOL
V
IL
V
IH
I
IL
V
CC
MAX4131EBT
Supply Current per Amplifier
I
CC
V
CM
= V
OUT
=
V
CC
/2
All other
devices
V
CC
= 2.7V
V
CC
= 5V
V
CC
= 2.7V
V
CC
= 5V
V
CC
= 2.7V
V
CC
= 5V
CONDITIONS
MAX4131–MAX4134
MAX4131–MAX4134
2.7
Low
High
2.0
±3
6.5
1200
1350
1100
1200
50
70
µA
µA
MIN
TYP
MAX
0.8
UNITS
V
µA
V
Shutdown Supply Current per
Amplifier
I
SHDN
SHDN
> 0.8V,
MAX4131–MAX4134
Note 2:
All devices are 100% tested at T
A
= +25°C. MAX4130EUK/MAX4131EBT temperature limits are guaranteed by design.
目前检测温度一般采用热电偶或热敏电阻作为传感器。这种传感器至仪表之间通常都要用专用的温度补偿导线,而温度补偿导线的价格很高,并且线路太长,会影响测量精度,这是直接以模拟量形式进行采集的不可避免的问题。在实际应用中,往往需要对较远处的温度信号进行监视。为此,设计了一种用单片机与数字温度传感器集成的方案,它可以以更低的成本和更高的精确度实现温度检测。 l 系统综述 系统硬件设计以Atmel公司的...[详细]