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MAX452MJA/HR

Operational Amplifier, 1 Func, 5000uV Offset-Max, CMOS, CDIP8, 0.300 INCH, CERDIP-8

器件类别:模拟混合信号IC    放大器电路   

厂商名称:Maxim(美信半导体)

厂商官网:https://www.maximintegrated.com/en.html

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
Maxim(美信半导体)
零件包装代码
DIP
包装说明
0.300 INCH, CERDIP-8
针数
8
Reach Compliance Code
not_compliant
ECCN代码
EAR99
放大器类型
OPERATIONAL AMPLIFIER
最大平均偏置电流 (IIB)
0.5 µA
标称共模抑制比
80 dB
最大输入失调电压
5000 µV
JESD-30 代码
R-GDIP-T8
JESD-609代码
e0
湿度敏感等级
1
标称负供电电压 (Vsup)
-5 V
功能数量
1
端子数量
8
最高工作温度
125 °C
最低工作温度
-55 °C
封装主体材料
CERAMIC, GLASS-SEALED
封装代码
DIP
封装等效代码
DIP8,.3
封装形状
RECTANGULAR
封装形式
IN-LINE
峰值回流温度(摄氏度)
240
电源
+-5 V
认证状态
Not Qualified
筛选级别
MIL-STD-883 Class B (Modified)
座面最大高度
5.08 mm
标称压摆率
300 V/us
最大压摆率
30 mA
标称供电电压 (Vsup)
5 V
表面贴装
NO
技术
CMOS
温度等级
MILITARY
端子面层
Tin/Lead (Sn/Pb)
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
20
标称均一增益带宽
50000 kHz
宽度
7.62 mm
文档预览
SCOPE:
CMOS VIDEO MULTIPLEXER/AMPLIFIER
Generic Number
MAX453M(x)/883B
MAX455M(x)/883B
MAX452M(x)/883B
MAX454M(x)/883B
Device Type
01
02
03
04
Case Outline(s).
The case outlines shall be designated in Mil-Std-1835 and as follows:
Case Outline
Package Code
Outline Letter
Mil-Std-1835
JA
GDIP1-T8 or CDIP2-T8
8 LEAD CERDIP
J8
JD
GDIP1-T14 or CDIP2-T14
14 LEAD CERDIP
J14
LP
CQCC1-N20
20 Leadless Chip Carrier L20
Absolute Maximum Ratings
Total Supply Voltage (V+ to V-) ............................................................................ 12V
Positive Supply Voltage, V+ (rel. GND) .............................................................. +12V
Negative Supply Voltage, V- (rel. GND) .............................................................. -12V
Analog Input Voltages: ..........................................................(V+) +0.3V to (V-) -0.3V
Digital Input Voltages: ................................................................. -0.3V to (V+) +0.3V
Duration of Output Short-Circuit to ground ................................................... Indefinite
Input Current, power on or off:
Digital Inputs .............................................................................................
±20mA
All other pins .............................................................................................
±50mA
Short-Circuit Duration, T
OUT
........................................................................ Continuous
Lead Temperature (soldering, 10 seconds) ..................................................................... +300°C
Storage Temperature ........................................................................................ -65°C to +160°C
Continuous Power Dissipation ............................................................................. T
A
=+70°C
8 pin CERDIP(derate 8.0mW/°C above +70°C) ....................................................... 640mW
14 pin CERDIP(derate 9.1mW/°C above +70°C) ..................................................... 727mW
20 pin CERDIP(derate 11.1mW/°C above +70°C) .................................................... 889mW
20 pin LCC(derate 9.1mW/°C above +70°C) ............................................................ 727mW
Junction Temperature T
J
..............................................................................…........ +150°C
Thermal Resistance, Junction to Case,
ΘJC
8 pin CERDIP..................................................................................................... 55°C/W
14 pin CERDIP................................................................................................... 55°C/W
20 pin CERDIP................................................................................................... 40°C/W
20 pin LCC ........................................................................................................ 20°C/W
Thermal Resistance, Junction to Ambient,
ΘJA:
8 pin CERDIP.................................................................................................... 125°C/W
14 pin CERDIP.................................................................................................. 110°C/W
20 pin CERDIP................................................................................................... 90°C/W
20 pin LCC ...................................................................................................... 110°C/W
Recommended Operating Conditions
Ambient Operating Range (T
A
) ............................................................ -55°C to
+125°C
Input Voltage Range ....................................................................................... -2V to +2V
Operating Supply Voltage ...............................................................
±4.5Vdc
to
±5.5V
dc
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
----------------------------
Electrical Characteristics of MAX452/453/454/455/883B
for /883B and SMD 5962-94512
19-0207
Page 2 of
Rev. D
6
TABLE 1. ELECTRICAL TESTS:
CONDITIONS
-55
°C
<=T
A
<= +125°C 1/
Unless otherwise specified
Group A
Subgroup
TEST
VIDEO AMPLIFIER
Input Voltage Range
Input Offset Voltage
Input Bias Current
Open-Loop Voltage Gain
Symbol
Device
type
Limits
Min
Limits
Max
Units
V
IN
V
OS
IB
A
VOL
NOTE 2
R
L
=1000Ω
R
L
=150Ω
R
L
=75Ω
-2V≤V
IN
≤+2V
±4.5V
to
±5.5V
NOTE 3
AV=0dB, RL=75Ω, NOTE 3
AV=6dB, RL=150Ω, NOTE 3
1,2,3
1
2,3
1
2,3
1
All
All
All
All
-2.0
2.0
5.0
10.0
10
500
V
mV
nA
V/V
Common-Mode Rejection
Ratio
Power Supply Rejection
Ratio
Slew Rate
VIDEO AMPLIFIER
-3dB Bandwidth
Full-Scale Output Current
Output Voltage Swing
Input noise, dc to 40 MHz
Operating Supply Voltage
Supply Current
MULTIPLEXER
Input Voltage Range
OFF Input Leakage
Current
Logic Low Threshold
Logic High Threshold
Input Pullup/down
Current
Turn-On Time
Turn-Off Time
Break-Before-Make
Delay
Channel “On”
Capacitance
Channel “Off”
Capacitance
Channel “Off” Isolation
Delay
NOTE 1:
NOTE 2:
NOTE 3:
NOTE 4:
CMRR
PSRR
SR
GBW1
GBW2
I
OUT
V
OUT
Vn
V+, V-
I
CC
1
1
2,3
1
1
1
1
1
1,2,3
1
2,3
1,2,3
1
2,3
1,2,3
1,2,3
1
9
9
9
9
9
All
All
All
All
All
All
All
All
All
180
45
25
60
54
48
150
30
25
±14
±2.1
±4.5
20
17
-2.0
0.5
±5.5
30
32
2.0
10
500
0.8
20
120
60
10
15
12
dB
dB
V/µs
MHz
mA
V
mVrms
V
mA
NOTE 3
V
IN
=0V
V
IN
I
OFF
V
IL
V
IH
I
IL
/I
IH
t
ON
t
OFF
t
D
C
ON
C
OFF
OIRR
NOTE 4
02,03,04
02,03,04
02,03,04
02,03,04
02,03,04
02,03,04
02,03,04
02,03,04
02,03,04
02,03,04
02,03,04
V
nA
V
V
µA
ns
ns
ns
pF
pF
2.4
NOTE 3
NOTE 3
NOTE 3
NOTE 3
NOTE 3
9
fIN=4MHz, RS=75Ω, NOTE 3,
Channel 2 to Channel 3
All other channels
V+=+5V, V-=-5V, -2V≤V
IN
≤+2V,
Output Load Resistor=150Ω.
Input bias includes the multiplexer’s On-state leakage current.
Guaranteed by design.
Guaranteed over the voltage range, V-≤V
IN
≤V+
45
60
dB
----------------------------
Electrical Characteristics of MAX452/453/454/455/883B
for /883B and SMD 5962-94512
19-0207
Page 3 of
Rev. D
6
TERMINAL CONNECTIONS FOR 01, 02, 03, 04
MAX452
MAX453
MAX454
1 NC
A0
A1
2 NC
GND
A0
3 V-
V-
GND
4 NC
IN0
V-
5 +IN
+IN
NC
6 V+
V+
NC
7 -IN
-IN
IN0
8 V
OUT
V
OUT
IN1
9
NC
10
IN2
11
IN3
12
V+
13
-IN
14
V
OUT
15
16
17
18
19
20
MAX455
A2
A1
A0
GND
IN0
V-
IN1
NC
IN2
IN3
IN4
NC
IN5
NC
IN6
NC
IN7
V+
-IN
V
OUT
01
01
02
02
03
03
04
04
Package
8 pin CERDIP
20 pin LCC
20 pin CERDIP
20 pin LCC
8 pin CERDIP
20 pin LCC
14 pin CERDIP
20 pin LCC
ORDERING INFORMATION:
MAX453MJA/883B
MAX453MLP/883B
MAX455MJP/883B
MAX455MLP/883B
MAX452MJA/883B
MAX452MLP/883B
MAX454MJD/883B
MAX454MLP/883B
SMD Number
5962-9451201MPA
5962-9451201M2C
5962-9451202MRA
5962-9451202M2C
5962-9451203MPA
5962-9451203M2C
5962-9451204MCA
5962-9451204M2C
----------------------------
Electrical Characteristics of MAX452/453/454/455/883B
for /883B and SMD 5962-94512
19-0207
Page 4 of
Rev. D
6
QUALITY ASSURANCE
Sampling and inspection procedures shall be in accordance with MIL-Prf-38535, Appendix A as specified in Mil-
Std-883.
Screening shall be in accordance with Method 5004 of Mil-Std-883. Burn-in test Method 1015:
1. Test Condition, A, B, C, or D.
2. TA = +125°C minimum.
3. Interim and final electrical test requirements shall be specified in Table 2.
Quality conformance inspection shall be in accordance with Method 5005 of Mil-Std-883, including Groups A, B,
C, and D inspection.
Group A inspection:
1. Tests as specified in Table 2.
2. Selected subgroups in Table 1, Method 5005 of Mil-Std-883 shall be omitted.
Group C and D inspections:
a. End-point electrical parameters shall be specified in Table 1.
b. Steady-state life test, Method 1005 of Mil-Std-883:
1. Test condition A, B, C, D.
2. TA = +125°C, minimum.
3. Test duration, 1000 hours, except as permitted by Method 1005 of Mil-Std-883.
TABLE 2.
ELECTRICAL TEST REQUIREMENTS
Mil-Std-883 Test Requirements
Subgroups
per Method 5005, Table 1
1
1*, 2, 3, 9**
1, 2, 3, 9**
1
Interim Electric Parameters
Method 5004
Final Electrical Parameters
Method 5005
Group A Test Requirements
Method 5005
Group C and D End-Point Electrical Parameters
Method 5005
*
**
PDA applies to Subgroup 1 only.
Guaranteed by design.
----------------------------
Electrical Characteristics of MAX452/453/454/455/883B
for /883B and SMD 5962-94512
19-0207
Page 5 of
Rev. D
6
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参数对比
与MAX452MJA/HR相近的元器件有:MAX454MJD/883B、MAX455MJP/883B。描述及对比如下:
型号 MAX452MJA/HR MAX454MJD/883B MAX455MJP/883B
描述 Operational Amplifier, 1 Func, 5000uV Offset-Max, CMOS, CDIP8, 0.300 INCH, CERDIP-8 Operational Amplifier, 1 Func, 5000uV Offset-Max, CDIP14, CERDIP-14 Operational Amplifier, 1 Func, 5000uV Offset-Max, CDIP20, CERDIP-20
是否Rohs认证 不符合 不符合 不符合
厂商名称 Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体)
零件包装代码 DIP DIP DIP
包装说明 0.300 INCH, CERDIP-8 CERDIP-14 CERDIP-20
针数 8 14 20
Reach Compliance Code not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99
放大器类型 OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
最大平均偏置电流 (IIB) 0.5 µA 0.5 µA 0.5 µA
标称共模抑制比 80 dB 80 dB 80 dB
最大输入失调电压 5000 µV 5000 µV 5000 µV
JESD-30 代码 R-GDIP-T8 R-GDIP-T14 R-GDIP-T20
JESD-609代码 e0 e0 e0
湿度敏感等级 1 1 1
标称负供电电压 (Vsup) -5 V -5 V -5 V
功能数量 1 1 1
端子数量 8 14 20
最高工作温度 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C
封装主体材料 CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
封装代码 DIP DIP DIP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE IN-LINE IN-LINE
峰值回流温度(摄氏度) 240 245 245
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 5.08 mm 5.842 mm 5.842 mm
标称压摆率 300 V/us 300 V/us 300 V/us
标称供电电压 (Vsup) 5 V 5 V 5 V
表面贴装 NO NO NO
温度等级 MILITARY MILITARY MILITARY
端子面层 Tin/Lead (Sn/Pb) TIN LEAD TIN LEAD
端子形式 THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
端子节距 2.54 mm 2.54 mm 2.54 mm
端子位置 DUAL DUAL DUAL
处于峰值回流温度下的最长时间 20 NOT SPECIFIED NOT SPECIFIED
标称均一增益带宽 50000 kHz 50000 kHz 50000 kHz
宽度 7.62 mm 7.62 mm 7.62 mm
Is Samacsys - N N
长度 - 19.43 mm 24.13 mm
Base Number Matches - 1 1
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